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1. 发明授权

US08022137B2 Silicone resin composition for optical semiconductor devices 有权
标题翻译：用于光学半导体器件的硅树脂组合物
公开(公告)号：US08022137B2
公开(公告)日：2011-09-20
申请号：US12569433
申请日：2009-09-29
申请人： Yusuke Taguchi , Junichi Sawada , Kenji Hagiwara , Shoichi Osada , Kazutoshi Tomiyoshi
发明人： Yusuke Taguchi , Junichi Sawada , Kenji Hagiwara , Shoichi Osada , Kazutoshi Tomiyoshi
IPC分类号： C08L83/00
CPC分类号： H01L23/296 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K3/22 , C08L83/04 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , C08L83/00 , H01L2924/00014
摘要： The present invention provides a silicone resin composition for an optical semiconductor device, comprising (A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1), (CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2 (1) wherein R1 is an organic group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8≦a≦1.5, 0≦b≦0.3, 0.001≦c≦0.5, and 0.801≦a+b+c
摘要翻译：本发明提供一种光半导体装置用有机硅树脂组合物，其包含：（A）100质量份的重均分子量为500〜20000的有机聚硅氧烷，还原为聚苯乙烯，由下列平均组成式（ 1），（CH3）aSi（OR1）b（OH）cO（4-abc）/ 2（1）其中R1是具有1至4个碳原子的有机基团，a，b和c是满足下列等式的数字： 0.8和nlE; a＆nlE; 1.5,0.001和nlE; c＆nlE; 0.5和0.801≤n1E; a + b + c2，（B）3到200质量份白色颜料，（C）400 1000质量份除了所述白色颜料以外的无机填充材料，（D）0.01〜10质量份的缩合催化剂，（E）2〜50质量份的由有机聚硅氧烷构成的有机聚硅氧烷，所述直链二有机聚硅氧烷部分由下式（2），其中R 2和R 3彼此独立地是选自羟基，烷基具有1至3个碳原子的基团，环己基，乙烯基，苯基和烯丙基，其中m为5-50的整数。

2. 发明授权

US08193269B2 Silicone resin composition for optical semiconductor devices and an optical semiconductor device 有权
标题翻译：用于光学半导体器件的硅树脂组合物和光学半导体器件
公开(公告)号：US08193269B2
公开(公告)日：2012-06-05
申请号：US12766660
申请日：2010-04-23
申请人： Yusuke Taguchi , Kenji Hagiwara , Junichi Sawada
发明人： Yusuke Taguchi , Kenji Hagiwara , Junichi Sawada
IPC分类号： C08K3/22
CPC分类号： C08L83/04 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K3/22 , C08L2205/035 , H01L21/02126 , H01L21/02216 , H01L21/3122 , H01L23/296 , H01L33/56 , H01L2224/29499 , H01L2224/48091 , H01L2224/48247 , C08L2666/22 , C08L2666/14 , C08L2666/54 , C08L83/00 , H01L2924/00014
摘要： Silicone resin composition for optical semiconductor devices, providing cured product wherein warpage in the devices is reduced and whiteness, heat-resistance, and light resistance are improved. The composition comprises: (A) an organopolysiloxane of the formula (CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2 (1) wherein R1 is monovalent hydrocarbon and a, b, and c are numbers such that: 0.8
摘要翻译：用于光学半导体器件的硅树脂组合物提供固化产物，其中改善了器件中的翘曲和白度，耐热性和耐光性。组合物包含：（A）式（CH3）aSi（OR1）b（OH）cO（4-abc）/ 2（1）的有机聚硅氧烷，其中R 1为一价烃，a，b和c为：0.8 <= a <= 1.5,0 <= b <= 0.3，0.001 <= c <= 0.5和0.801 <= a + b + c <2; （B）白色颜料; （C）除白色颜料以外的无机填料; （D）缩合催化剂; （E）衍生自异氰脲酸的环氧树脂; （F）包含单元R2SiO和单元RSiO1.5的有机聚硅氧烷，其中R是羟基，甲基，乙基，丙基，环己基，苯基，乙烯基或烯丙基; 和（G）下式的线性二有机聚硅氧烷，其中R 5和R 6是烷基，环己基，乙烯基，苯基或烯丙基，n是800至1200的整数。

3. 发明授权

US08173053B2 White heat-curable silicone resin composition and optoelectronic part case 有权
标题翻译：白色可热固化硅树脂组合物和光电子部件
公开(公告)号：US08173053B2
公开(公告)日：2012-05-08
申请号：US12480129
申请日：2009-06-08
申请人： Yusuke Taguchi , Junichi Sawada
发明人： Yusuke Taguchi , Junichi Sawada
IPC分类号： B29D11/00 , C08L83/04 , C08L83/06
CPC分类号： C08L83/04 , C08G77/16 , C08G77/18 , H01L33/486 , H01L33/60 , H01L2224/48091 , Y10T428/1352 , H01L2924/00014
摘要： A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a thermal conductivity of 1-10 W/mK. The composition is useful for forming cases on optoelectronic parts, typically LED.
摘要翻译：一种白色可热固化的有机硅树脂组合物，其包含（A）可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）缩合催化剂固化成具有耐热性的白色均匀产品，电阻和最小变黄。固化的组合物的导热率为1-10W / mK。组合物可用于在光电子部件（通常为LED）上形成壳体。

4. 发明授权

US08012381B2 White heat-curable silicone resin composition and optoelectronic part case 有权
标题翻译：白色可热固化硅树脂组合物和光电子部件
公开(公告)号：US08012381B2
公开(公告)日：2011-09-06
申请号：US12480118
申请日：2009-06-08
申请人： Yusuke Taguchi , Junichi Sawada
发明人： Yusuke Taguchi , Junichi Sawada
IPC分类号： B29D11/00 , C08L83/04 , C08L83/06
CPC分类号： C08L83/04 , C08G77/16 , C08G77/18 , C08K3/013 , C08K3/22 , H01L31/02161 , H01L33/56 , H01L2224/48091 , Y10T428/1352 , C08L2666/44 , C08L2666/54 , H01L2924/00014
摘要： A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a reflectance of at least 80% at wavelength 350-400 nm. The composition is useful for forming cases on optoelectronic parts, typically LED.
摘要翻译：一种白色可热固化的有机硅树脂组合物，其包含（A）可热固化的有机聚硅氧烷，（B）白色颜料，（C）无机填料和（D）缩合催化剂固化成具有耐热性的白色均匀产品，电阻和最小变黄。固化的组合物在350-400nm的波长下具有至少80％的反射率。组合物可用于在光电子部件（通常为LED）上形成壳体。

5. 发明授权

US08519063B2 Underfill composition and an optical semiconductor device 有权
标题翻译：底部填充组合物和光学半导体器件
公开(公告)号：US08519063B2
公开(公告)日：2013-08-27
申请号：US12875606
申请日：2010-09-03
申请人： Yusuke Taguchi , Junichi Sawada
发明人： Yusuke Taguchi , Junichi Sawada
IPC分类号： C08F283/12 , C08G77/16 , C08G77/44
CPC分类号： H01L23/296 , C08G77/16 , C08G77/70 , C08K3/36 , C08K5/544 , C08K5/548 , C08K9/06 , C08L83/04 , H01L21/563 , H01L33/56 , H01L2924/0002 , C08L83/00 , H01L2924/00
摘要： A purpose of the present invention is to provide an underfill composition for optical semiconductor devices which can provide a cured product whose moldability, adhesiveness to a gold bump, heat-resistance, and light resistance are better. The present invention is an underfill composition, comprising (A) 60 to 99 parts by weight of a branched organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the average compositional formula (1); (B) 250 to 1000 parts by weight of an inorganic filler; (C) 0.01 to 10 parts by weight of a condensation catalyst; (D) 1 to 40 parts by weight of an organopolysiloxane having a linear diorganopolysiloxane moiety, represented by the formula (2), provided that a total amount of component (A) and component (D) is 100 parts by weight; and (E) 0.2 to 2.0 parts by weight of silane coupling agent.
摘要翻译：本发明的目的是提供一种光学半导体器件的底部填充组合物，其可以提供其成型性，对金凸块的粘附性，耐热性和耐光性更好的固化产物。本发明是一种底部填充剂组合物，其包含（A）60〜99重量份的重均分子量为500〜20000的分支有机聚硅氧烷，还原为聚苯乙烯，由平均组成式（1）表示。（B）250〜1000重量份的无机填料; （C）0.01〜10重量份的缩合催化剂; （D）1〜40重量份具有由式（2）表示的线性二有机聚硅氧烷部分的有机聚硅氧烷，其中组分（A）和组分（D）的总量为100重量份; 和（E）0.2〜2.0重量份的硅烷偶联剂。

6. 发明申请

US20110054072A1 WHITE HEAT-CURABLE SILICONE/EPOXY HYBRID RESIN COMPOSITION FOR OPTOELECTRONIC USE, MAKING METHOD, PREMOLDED PACKAGE, AND LED DEVICE 有权
标题翻译：用于光电用的白色可固化硅胶/环氧树脂混合物组合物，制造方法，预制包装和LED装置
公开(公告)号：US20110054072A1
公开(公告)日：2011-03-03
申请号：US12872510
申请日：2010-08-31
申请人： Junichi SAWADA , Yusuke Taguchi
发明人： Junichi SAWADA , Yusuke Taguchi
IPC分类号： C08K5/52 , C08J3/20
CPC分类号： C08K5/34926 , C08G59/3236 , C08G77/16 , C08K5/524 , C08L63/00 , C08L63/06 , C08L83/04 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , C08L83/00 , C08L2666/14 , H01L2924/00014 , H01L2924/00
摘要： A white heat-curable silicone/epoxy hybrid resin composition is provided comprising (A) a heat-curable silicone resin, (B) a triazine derived epoxy resin composition, (C) a white pigment, (D) an inorganic filler, and (E) an antioxidant. Antioxidant (E) is a phosphite compound having formula: P(OR1)(OR2)2 wherein R1 and R2 are organic groups of at least 6 carbon atoms. Components (A) and (B) are present in a weight ratio of from 5:95 to 95:5. The composition effectively cures into a product maintaining heat resistance, light resistance and improved strength over a long term.
摘要翻译：提供白色可热固化的硅酮/环氧树脂混合树脂组合物，其包含（A）可热固化的有机硅树脂，（B）三嗪衍生的环氧树脂组合物，（C）白色颜料，（D）无机填料和（ E）抗氧化剂。抗氧化剂（E）是具有式：P（OR 1）（OR 2）2的亚磷酸酯化合物，其中R 1和R 2是至少6个碳原子的有机基团。组分（A）和（B）以5:95至95:5的重量比存在。该组合物有效地固化成保持耐热性，耐光性和长期改善强度的产品。

7. 发明授权

US08044128B2 White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device 有权
标题翻译：用于光电用途的白色可热固化硅树脂/环氧树脂混合树脂组合物，制作方法，预成型封装和LED器件
公开(公告)号：US08044128B2
公开(公告)日：2011-10-25
申请号：US12872510
申请日：2010-08-31
申请人： Junichi Sawada , Yusuke Taguchi
发明人： Junichi Sawada , Yusuke Taguchi
IPC分类号： C08K5/524
CPC分类号： C08K5/34926 , C08G59/3236 , C08G77/16 , C08K5/524 , C08L63/00 , C08L63/06 , C08L83/04 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , C08L83/00 , C08L2666/14 , H01L2924/00014 , H01L2924/00
摘要： A white heat-curable silicone/epoxy hybrid resin composition is provided comprising (A) a heat-curable silicone resin, (B) a triazine derived epoxy resin composition, (C) a white pigment, (D) an inorganic filler, and (E) an antioxidant. Antioxidant (E) is a phosphite compound having formula: P(OR1)(OR2)2 wherein R1 and R2 are organic groups of at least 6 carbon atoms. Components (A) and (B) are present in a weight ratio of from 5:95 to 95:5. The composition effectively cures into a product maintaining heat resistance, light resistance and improved strength over a long term.
摘要翻译：提供白色可热固化的硅酮/环氧树脂混合树脂组合物，其包含（A）可热固化的有机硅树脂，（B）三嗪衍生的环氧树脂组合物，（C）白色颜料，（D）无机填料和（ E）抗氧化剂。抗氧化剂（E）是具有式：P（OR 1）（OR 2）2的亚磷酸酯化合物，其中R 1和R 2是至少6个碳原子的有机基团。组分（A）和（B）以5:95至95:5的重量比存在。该组合物有效地固化成保持耐热性，耐光性和长期改善强度的产品。

8. 发明申请

US20140100990A1 REVIEW TEXT OUTPUT SYSTEM, REVIEW TEXT OUTPUT METHOD, PROGRAM AND COMPUTER-READABLE INFORMATION STORAGE MEDIUM 审中-公开
标题翻译：查看文本输出系统，查看文本输出方法，程序和计算机可读信息存储介质
公开(公告)号：US20140100990A1
公开(公告)日：2014-04-10
申请号：US14122675
申请日：2012-08-29
申请人： Yusuke Taguchi
发明人： Yusuke Taguchi
IPC分类号： G06Q30/06 , G06Q30/02
CPC分类号： G06Q30/0623 , G06Q10/00 , G06Q30/00 , G06Q30/0282 , G06Q30/06 , G06Q50/01
摘要： To enable a user to easily read and compare review texts about a plurality of commercial transaction objects that are posted by the same reviewer, provided is a review text output method, including: a condition receiving step of receiving a plurality of commercial transaction object search conditions; a review text identifying step of identifying, out of review texts about one or more commercial transaction objects that respectively satisfy the plurality of commercial transaction object search conditions, review texts that have been created by a common reviewer; and a review text outputting step of outputting, in association with one another, the review texts that have been identified in the review text identifying step as review texts that respectively satisfy the plurality of commercial transaction object search conditions.
摘要翻译：为了使用户能够容易地阅读和比较由相同审阅者发布的关于多个商业交易对象的审阅文本，提供了一种评论文本输出方法，包括：条件接收步骤，接收多个商业交易对象搜索条件 ; 评估文本识别步骤，用于识别关于分别满足多个商业交易对象搜索条件的一个或多个商业交易对象的审阅文本，审查由共同审阅者创建的审阅文本; 以及审查文本输出步骤，将彼此相关联地将在评论文本识别步骤中识别的评论文本输出为分别满足多个商业交易对象搜索条件的评论文本。

9. 发明授权

US08237189B2 Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same 有权
标题翻译：可热固化的有机硅树脂 - 环氧树脂组合物，以及由其模制的预成型包装
公开(公告)号：US08237189B2
公开(公告)日：2012-08-07
申请号：US12496460
申请日：2009-07-01
申请人： Yusuke Taguchi , Toshio Shiobara
发明人： Yusuke Taguchi , Toshio Shiobara
IPC分类号： H01L33/00
CPC分类号： H01L23/49861 , C08G77/16 , C08G77/18 , C08L63/00 , C08L63/06 , C08L83/04 , C08L83/06 , H01L23/295 , H01L23/296 , H01L33/56 , H01L2924/0002 , C08L83/00 , C08L2666/14 , C08L2666/22 , H01L2924/00
摘要： A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.
摘要翻译：作为用于高亮度LED或太阳能电池的预先包装的理想的可热固化的有机硅树脂 - 环氧树脂组合物。该组合物含有（A）可热固化的有机硅树脂，（B）三嗪衍生物环氧树脂和酸酐的组合，或通过它们反应获得的预聚物，（C）无机填料和（D）固化促进剂。该组合物表现出优异的固化性，并且产生均匀的固化产物，其在长时间内显示出优异的耐热性和耐光性保持性，并且几乎不发黄。

10. 发明授权

US08013057B2 White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case 有权
标题翻译：用于模制光学半导体外壳和光学半导体外壳的白色热固性硅树脂组合物
公开(公告)号：US08013057B2
公开(公告)日：2011-09-06
申请号：US12405589
申请日：2009-03-17
申请人： Yusuke Taguchi , Kazutoshi Tomiyoshi
发明人： Yusuke Taguchi , Kazutoshi Tomiyoshi
IPC分类号： C08L83/04 , B29D11/00
CPC分类号： C08L83/06 , C08G77/26 , C08G77/28 , H01L2224/48091 , H01L2924/00014
摘要： A white thermosetting silicone resin composition for molding an optical semiconductor case and a case for an optical semiconductor such as LED are provided. The composition comprises (A) a thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler (excluding the white pigment), (D) a condensation catalyst, and (E) a coupling agent represented by the following formula: R3dSi(OR2)e wherein R3 represents an organic group containing a mercapto group, a glycidyl group, or an amino group, R2 represents a C1-4 organic group, d represents 1 or 2, and e represents 2 or 3; wherein content of the white pigment (B) is 1 to 50% by weight in the entire composition, and total content of the white pigment (B) and the inorganic filler (C) is 70 to 93% by weight in the entire composition. When cured, it has excellent whiteness, consistency, and resistance to heat, light, yellowing, and warping.
摘要翻译：提供了一种用于模制光学半导体壳体的白色热固性硅树脂组合物和诸如LED的光学半导体的壳体。组合物包含（A）热固性有机聚硅氧烷，（B）白色颜料，（C）无机填料（不包括白色颜料），（D）缩合催化剂和（E）由下式表示的偶联剂： R3dSi（OR2）e其中R3表示含有巯基，缩水甘油基或氨基的有机基团，R2表示C1-4有机基团，d表示1或2，e表示2或3; 其中白色颜料（B）的含量在整个组合物中为1〜50重量％，白色颜料（B）和无机填料（C）的总含量在整个组合物中为70〜93重量％。固化时，具有优异的白度，一致性和耐热，耐光，发黄，翘曲等特点。

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