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1. 发明申请

US20050061789A1 Laser beam machine 审中-公开
标题翻译：激光束机
公开(公告)号：US20050061789A1
公开(公告)日：2005-03-24
申请号：US10938728
申请日：2004-09-13
申请人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige , Koichi Shigematsu
发明人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige , Koichi Shigematsu
IPC分类号： B23K26/04 , B23K26/06
CPC分类号： B23K26/04
摘要： A laser beam machine comprising a workpiece holding means for holding a workpiece, a laser beam application means comprising a condenser for applying a laser beam to the workpiece held on the workpiece holding means, and a focusing point position adjusting means for adjusting the position of the focusing point of the laser beam applied by the condenser, wherein the machine further comprises a temperature detection means for detecting a temperature of the condenser and a control means for controlling the focusing point position adjusting means based on the temperature of the condenser detected by the temperature detection means.
摘要翻译：一种激光束机器，包括用于保持工件的工件保持装置，激光束施加装置，包括用于将激光束施加到保持在工件保持装置上的工件的聚光器，以及聚焦点位置调整装置，通过冷凝器施加的激光束的聚焦点，其中，该机器还包括用于检测冷凝器的温度的温度检测装置，以及用于根据温度检测到的冷凝器的温度来控制聚焦点位置调整装置的控制装置检测手段。

2. 发明授权

US07179722B2 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US07179722B2
公开(公告)日：2007-02-20
申请号：US11047619
申请日：2005-02-02
申请人： Masahiro Murata , Yusuke Nagai , Yukio Morishige , Satoshi Kobayashi , Naoki Ohmiya
发明人： Masahiro Murata , Yusuke Nagai , Yukio Morishige , Satoshi Kobayashi , Naoki Ohmiya
IPC分类号： H01L21/301
CPC分类号： H01L21/3043 , H01L21/30625 , H01L21/78 , H01L2221/68336
摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, which comprises: a protective member affixing step for affixing a protective member to the front surface of the wafer; a polishing step for polishing the back surface of the wafer having the protective member affixed to the front surface; a deteriorated layer formation step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines from the polished back surface side of the wafer; a frame holding step for affixing the back surface of the wafer in which the deteriorated layers have been formed along the dividing lines, to a dicing tape mounted on an annular frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed, of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a pick up step for picking up the chips from the stretched dicing tape.
摘要翻译：沿着划分线划分具有由在前表面上形成为格子图案的分割线划分的区域中形成的功能元件的晶片的方法，该方法包括：保护构件固定步骤，用于将保护构件固定到晶圆; 抛光步骤，用于抛光具有固定到前表面的保护构件的晶片的背面; 劣化层形成步骤，通过沿晶片的抛光后表面侧沿分割线施加能够穿过晶片的脉冲激光束，沿着晶片内部的分割线形成劣化层; 用于将已经形成有劣化层的晶片的背面沿分割线固定到安装在环形框架上的切割带的框架保持步骤; 分割步骤，通过沿保持在框架上的晶片沿已经形成有劣化层的划分线施加外力沿分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及从拉伸的切割胶带拾取芯片的拾取步骤。

3. 发明申请

US20050109742A1 Processing method using laser beam 审中-公开
标题翻译：使用激光束的加工方法
公开(公告)号：US20050109742A1
公开(公告)日：2005-05-26
申请号：US10972658
申请日：2004-10-26
申请人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige
发明人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige
IPC分类号： B23K26/04 , B23K26/02 , B23K26/08 , B23K101/40 , H01L21/301 , B23K26/06
CPC分类号： B23K26/02 , B23K26/042 , B23K26/0853 , B23K2101/40
摘要： A processing method using a laser beam, which can locate the focus point of a laser beam (82), sufficiently easily and promptly, at a position of a predetermined depth (D) below the face of a workpiece (34). The spacing between a focusing optical system (78) and the face of the workpiece when the laser beam is focused onto the face of the workpiece is adopted as a reference spacing (BL), and the spacing (SL) between the focusing optical system and the face of the workpiece is set based on a set equation taking into consideration the numerical aperture of the focusing optical system and the refractive index of the workpiece in combination with the reference spacing (BL).
摘要翻译：一种使用激光束的处理方法，其可以在工件（34）的表面下方的预定深度（D）的位置处足够容易且及时地定位激光束（82）的聚焦点。采用激光束聚焦到工件表面上时聚焦光学系统（78）和工件表面之间的间距作为参考间距（BL），聚焦光学系统和考虑到聚焦光学系统的数值孔径和工件的折射率与参考间距（BL）的组合，基于设定的方程来设定工件的面。

4. 发明申请

US20050095817A1 Silicon wafer dividing method and apparatus 有权
标题翻译：硅晶片分割方法及装置
公开(公告)号：US20050095817A1
公开(公告)日：2005-05-05
申请号：US10978005
申请日：2004-11-01
申请人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige
发明人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige
IPC分类号： B23K26/00 , B23K26/40 , B23K101/40 , H01L21/301 , H01L21/304 , H01L21/78 , G03F9/00 , H01L21/46
CPC分类号： H01L21/3043 , H01L21/78
摘要： A method of dividing a silicon wafer along predetermined dividing lines, comprising a deteriorated layer forming step for forming deteriorated layers exposed to at least a surface to which a laser beam is applied, from the inside of the silicon wafer by applying a pulse laser beam with a wavelength capable of passing through the silicon wafer to the silicon wafer along the dividing lines; and a dividing step for dividing the silicon wafer along the dividing lines by applying a laser beam having absorptivity for the silicon wafer to the silicon wafer along the dividing lines where the deteriorated layers have been formed, from the side to which the deteriorated layers have been exposed, to generate thermal stress along the dividing lines.
摘要翻译：一种沿预定分割线分割硅晶片的方法，包括：通过施加脉冲激光束，从硅晶片的内部形成用于形成暴露于至少一个激光束表面的恶化层的恶化层形成步骤能够沿着分界线通过硅晶片到硅晶片的波长; 以及分割步骤，用于沿着分割线分割硅晶片，沿着已经形成劣化层的分界线，从劣化层已经形成了具有硅晶片吸收性的激光束到硅晶片暴露，沿分界线产生热应力。

5. 发明申请

US20050127299A1 Apparatus for checking a laser processed deteriorated layer 审中-公开
标题翻译：用于检查激光加工劣化层的装置
公开(公告)号：US20050127299A1
公开(公告)日：2005-06-16
申请号：US11004818
申请日：2004-12-07
申请人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige , Masaru Nakamura , Masahiro Murata
发明人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige , Masaru Nakamura , Masahiro Murata
IPC分类号： B23K26/00 , B23K101/40 , G03F7/20 , H01L21/301 , G03B27/42
CPC分类号： G03F7/70608
摘要： An apparatus for checking a laser processed deteriorated layer formed in the inside of a workpiece by applying a laser beam capable of passing through the workpiece to the workpiece, comprising a workpiece holding means for holding the workpiece; a light application means for applying light capable of passing through the workpiece held on the workpiece holding means to the exposed surface of the workpiece at a predetermined angle; a light receiving means for receiving light that is applied from the light application, passes through the inside of the workpiece and is reflected from the workpiece; and a display means for displaying the state of light received by the light receiving means.
摘要翻译：一种用于通过将能够通过工件的激光束施加到工件来检查在工件内部形成的激光加工劣化层的装置，包括用于保持工件的工件保持装置; 光施加装置，用于施加能够以保持在工件保持装置上的工件以预定角度穿过工件的暴露表面的光; 用于接收从光照射施加的光的光接收装置通过工件内部并从工件反射; 以及显示装置，用于显示由光接收装置接收的光的状态。

6. 发明申请

US20050090077A1 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US20050090077A1
公开(公告)日：2005-04-28
申请号：US10968100
申请日：2004-10-20
申请人： Yusuke Nagai , Masuru Nakamura , Satoshi Kobayashi , Yukio Morishige
发明人： Yusuke Nagai , Masuru Nakamura , Satoshi Kobayashi , Yukio Morishige
IPC分类号： B23K26/00 , B23K26/40 , B23K101/40 , B28D5/00 , H01L21/301 , H01L21/304 , H01L21/78 , H01L21/46
CPC分类号： H01L21/3043 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D5/0011 , H01L21/78
摘要： A method of dividing a wafer along predetermined dividing lines, comprising the steps of a deteriorated layer forming step for applying a pulse laser beam capable of passing through the wafer along the dividing lines to form deteriorated layers in the inside of the wafer along the dividing lines; an extensible protective tape affixing step for affixing an extensible protective tape to one side of the wafer before or after the deteriorated layer forming step; and a dividing step for dividing the wafer along the deteriorated layers by expanding the protective tape affixed to the wafer after the deteriorated layer forming step.
摘要翻译：一种沿着预定分割线分割晶片的方法，包括以下步骤：劣化层形成步骤，用于施加能够沿着分割线穿过晶片的脉冲激光束，以沿着分割线在晶片内部形成劣化层 ; 用于将可延伸保护带固定在劣化层形成步骤之前或之后的晶片的一侧的可延伸的保护带固定步骤; 以及分割步骤，用于通过在劣化层形成步骤之后扩展固定在晶片上的保护带，沿着劣化层分割晶片。

7. 发明申请

US20050082264A1 Laser beam machine 审中-公开
标题翻译：激光束机
公开(公告)号：US20050082264A1
公开(公告)日：2005-04-21
申请号：US10961219
申请日：2004-10-12
申请人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige , Masaru Nakamura , Masahiro Murata
发明人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige , Masaru Nakamura , Masahiro Murata
IPC分类号： B23K26/00 , B23K26/03 , B23K101/40 , H01L21/301
CPC分类号： B23K26/032 , B23K26/03 , B23K26/034 , B23K2101/40
摘要： A laser beam machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, wherein the machine further comprises a light detection means for detecting light of a processing portion of the workpiece to which a laser beam is applied from the laser beam application means and a control means for judging whether the output value of the light detection means falls within a predetermined permissible range.
摘要翻译：一种激光束机，包括用于保持工件的卡盘台和用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，其中该机器还包括光检测装置，用于检测从激光束施加装置施加激光束的工件和用于判断光检测装置的输出值是否落在预定容许范围内的控制装置。

8. 发明申请

US20050170613A1 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US20050170613A1
公开(公告)日：2005-08-04
申请号：US11047585
申请日：2005-02-02
申请人： Masahiro Murata , Yusuke Nagai , Yukio Morishige , Satoshi Kobayashi , Naoki Ohmiya
发明人： Masahiro Murata , Yusuke Nagai , Yukio Morishige , Satoshi Kobayashi , Naoki Ohmiya
IPC分类号： B23K26/00 , B23K26/40 , B23K101/40 , B28D5/00 , H01L21/301 , H01L21/46 , H01L21/68 , H01L21/78 , H05K3/00
CPC分类号： H01L21/6836 , B23K26/40 , B23K26/57 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B28D5/0052 , H01L21/78 , H01L2221/68327
摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, comprising: a frame holding step for affixing the back surface of the wafer to a dicing tape mounted on an annular frame; a deteriorated layer forming step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines, from the side of the front surface of the wafer held on the frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a picking up step for picking up each chip from the expanded dicing tape.
摘要翻译：沿着分割线划分具有由在前表面上以格子图案形成的分割线划分的区域中形成的功能元件的晶片的方法，包括：框架保持步骤，用于将晶片的背面固定到切割带安装在环形框架上; 劣化层形成步骤，用于通过从晶片的前表面侧沿分割线施加能够穿过晶片的脉冲激光束沿晶片内部的分割线形成劣化层; 在框架上举行分割步骤，通过沿着由保持在框架上的晶片形成劣化层的分割线施加外力，沿着分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及用于从扩展的切割胶带拾取每个芯片的拾取步骤。

9. 发明授权

US07449396B2 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US07449396B2
公开(公告)日：2008-11-11
申请号：US11047585
申请日：2005-02-02
申请人： Masahiro Murata , Yusuke Nagai , Yukio Morishige , Satoshi Kobayashi , Naoki Ohmiya
发明人： Masahiro Murata , Yusuke Nagai , Yukio Morishige , Satoshi Kobayashi , Naoki Ohmiya
IPC分类号： H01L21/301
CPC分类号： H01L21/6836 , B23K26/40 , B23K26/57 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B28D5/0052 , H01L21/78 , H01L2221/68327
摘要： A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, comprising: a frame holding step for affixing the back surface of the wafer to a dicing tape mounted on an annular frame; a deteriorated layer forming step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines, from the side of the front surface of the wafer held on the frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a picking up step for picking up each chip from the expanded dicing tape.
摘要翻译：沿着分割线划分具有由在前表面上以格子图案形成的分割线划分的区域中形成的功能元件的晶片的方法，包括：框架保持步骤，用于将晶片的背面固定到切割带安装在环形框架上; 劣化层形成步骤，用于通过从晶片的前表面侧沿分割线施加能够穿过晶片的脉冲激光束沿晶片内部的分割线形成劣化层; 在框架上举行分割步骤，通过沿着由保持在框架上的晶片形成劣化层的分割线施加外力，沿着分割线将晶片分割成单个芯片; 扩展步骤，用于通过拉伸固定到划分成单个芯片的晶片上的切割带来扩大芯片之间的间隔; 以及用于从扩展的切割胶带拾取每个芯片的拾取步骤。

10. 发明申请

US20050082267A1 Laser beam machine 审中-公开
标题翻译：激光束机
公开(公告)号：US20050082267A1
公开(公告)日：2005-04-21
申请号：US10950813
申请日：2004-09-28
申请人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige , Masaru Nakamura , Masahiro Murata
发明人： Yusuke Nagai , Satoshi Kobayashi , Yukio Morishige , Masaru Nakamura , Masahiro Murata
IPC分类号： B23K26/00 , B23K26/03
CPC分类号： B23K26/03 , B23K2101/40
摘要： A laser beam machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser to the workpiece held on the chuck table, wherein the machine further comprises a processing sound wave detection means for detecting processing sound waves generated when a laser beam is applied to the workpiece from the laser beam application means and a control means for judging whether a detection signal from the processing sound wave detection means falls within a predetermined permissible range.
摘要翻译：一种激光束机，包括用于保持工件的卡盘台和用于将激光施加到保持在卡盘台上的工件的激光束施加装置，其中，该机器还包括处理声波检测装置，用于检测当激光束从激光束施加装置施加到工件，以及用于判断来自处理声波检测装置的检测信号是否落在预定允许范围内的控制装置。

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