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    • 5. 发明申请
    • Generating sets of tailored laser pulses
    • 生成一组定制的激光脉冲
    • US20050041976A1
    • 2005-02-24
    • US10921765
    • 2004-08-18
    • Yunlong SunRobert Hainsey
    • Yunlong SunRobert Hainsey
    • B23K20060101B23K26/06B23K26/38H01S20060101H04J14/02
    • H01L23/5258B23K26/0613B23K26/0622B23K2101/40H01L2924/0002H01L2924/00
    • In a master oscillator power amplifier, a driver (208) of a diode laser (202) is specially controlled to generate a set of two or more injection laser pulses that are injected into a power amplifier (204) operated in an unsaturated state to generate a set (50) of laser pulses (52) that replicate the temporal power profile of the injection laser pulses to remove a conductive link (22) and/or its overlying passivation layer (44) in a memory or other IC chip. Each set (50) includes at least one specially tailored pulse (52) and/or two or more pulses (50) having different temporal power profiles. The duration of the set (50) is short enough to be treated as a single “pulse” by conventional positioning systems (380) to perform on-the-fly link removal without stopping.
    • 在主振荡器功率放大器中,特别地控制二极管激光器(202)的驱动器(208),以产生注入到以不饱和状态操作的功率放大器(204)中的两个或更多个注入激光脉冲的集合,以产生 一组(50)激光脉冲(52),其复制所述注入激光脉冲的时间功率分布以去除存储器或其它IC芯片中的导电连接(22)和/或其上覆钝化层(44)。 每个组(50)包括具有不同时间功率分布的至少一个特别定制的脉冲(52)和/或两个或更多个脉冲(50)。 集合(50)的持续时间足够短以被常规定位系统(380)视为单个“脉冲”,以在不停止的情况下执行即时链路去除。
    • 7. 发明授权
    • Photonic milling using dynamic beam arrays
    • 使用动态光束阵列进行光子研磨
    • US08178818B2
    • 2012-05-15
    • US12235294
    • 2008-09-22
    • Brian W. BairdKelly J. BrulandRobert Hainsey
    • Brian W. BairdKelly J. BrulandRobert Hainsey
    • B23K26/02B23K26/04
    • B23K26/03
    • A laser processing system includes a beam positioning system to align beam delivery coordinates relative to a workpiece. The beam positioning system generates position data corresponding to the alignment. The system also includes a pulsed laser source and a beamlet generation module to receive a laser pulse from the pulsed laser source. The beamlet generation module generates a beamlet array from the laser pulse. The beamlet array includes a plurality of beamlet pulses. The system further includes a beamlet modulator to selectively modulate the amplitude of each beamlet pulse in the beamlet array, and beamlet delivery optics to focus the modulated beamlet array onto one or more targets at locations on the workpiece corresponding to the position data.
    • 激光处理系统包括用于使输送坐标相对于工件对准的光束定位系统。 光束定位系统产生对准的位置数据。 该系统还包括脉冲激光源和子束产生模块,以从脉冲激光源接收激光脉冲。 子波束生成模块从激光脉冲生成小波阵列。 子束阵列包括多个子束脉冲。 该系统还包括一个子束调制器,用于选择性地调制子束阵列中的每个子束脉冲的振幅,以及子束传递光学器件,用于将调制的子束阵列聚焦到与位置数据对应的工件上的位置上的一个或多个目标上。
    • 9. 发明申请
    • PHOTONIC MILLING USING DYNAMIC BEAM ARRAYS
    • 使用动态光束阵列的光电铣削
    • US20090242522A1
    • 2009-10-01
    • US12235294
    • 2008-09-22
    • Brian W. BairdKelly J. BrulandRobert Hainsey
    • Brian W. BairdKelly J. BrulandRobert Hainsey
    • B23K26/00
    • B23K26/03
    • A laser processing system includes a beam positioning system to align beam delivery coordinates relative to a workpiece. The beam positioning system generates position data corresponding to the alignment. The system also includes a pulsed laser source and a beamlet generation module to receive a laser pulse from the pulsed laser source. The beamlet generation module generates a beamlet array from the laser pulse. The beamlet array includes a plurality of beamlet pulses. The system further includes a beamlet modulator to selectively modulate the amplitude of each beamlet pulse in the beamlet array, and beamlet delivery optics to focus the modulated beamlet array onto one or more targets at locations on the workpiece corresponding to the position data.
    • 激光处理系统包括用于使输送坐标相对于工件对准的光束定位系统。 光束定位系统产生对准的位置数据。 该系统还包括脉冲激光源和子束产生模块,以从脉冲激光源接收激光脉冲。 子波束生成模块从激光脉冲生成小波阵列。 子束阵列包括多个子束脉冲。 该系统还包括一个子束调制器,用于选择性地调制子束阵列中的每个子束脉冲的振幅,以及子束传递光学器件,用于将调制的子束阵列聚焦到与位置数据对应的工件上的位置上的一个或多个目标上。