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    • 8. 发明授权
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US07012284B2
    • 2006-03-14
    • US10837780
    • 2004-05-04
    • Seok Beom ChoiBang Won OhHee Seok Choi
    • Seok Beom ChoiBang Won OhHee Seok Choi
    • H01L33/00
    • H01L33/32H01L33/025
    • Disclosed herein is a nitride semiconductor light emitting device. The nitride semiconductor light emitting device comprises an n-type nitride semiconductor layer on a substrate, an active layer formed on the n-type nitride semiconductor layer so that a portion of the n-type nitride semiconductor layer is exposed, a p-type nitride semiconductor layer formed on the active layer, a high-concentration dopant area on the p-type nitride semiconductor layer, a counter doping area on the high-concentration dopant areas, an n-side electrode formed on an exposed portion of the n-type nitride semiconductor layer, and a p-side electrode formed on the counter doping area. A satisfactory ohmic contact for the p-side electrode is provided by an ion implantation process and heat treatment.
    • 这里公开了一种氮化物半导体发光器件。 氮化物半导体发光器件包括在衬底上的n型氮化物半导体层,形成在n型氮化物半导体层上的有源层,以使n型氮化物半导体层的一部分露出,p型氮化物 形成在有源层上的半导体层,p型氮化物半导体层上的高浓度掺杂剂区域,高浓度掺杂剂区域上的相对掺杂区域,形成在n型氮化物半导体层的暴露部分上的n侧电极 氮化物半导体层和形成在反掺杂区域上的p侧电极。 通过离子注入工艺和热处理提供了用于p侧电极的令人满意的欧姆接触。