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1. 发明申请

US20100055393A1 MULTILAYER CERAMIC SUBSTRATE 有权
标题翻译：多层陶瓷基板
公开(公告)号：US20100055393A1
公开(公告)日：2010-03-04
申请号：US12467542
申请日：2009-05-18
申请人： Yun Hwi PARK , Bong Gyun Kim , Yoon Hyuck Choi
发明人： Yun Hwi PARK , Bong Gyun Kim , Yoon Hyuck Choi
IPC分类号： B32B3/10
CPC分类号： H05K3/4061 , H05K1/0242 , H05K3/4629 , H05K2201/0269 , H05K2201/096 , H05K2203/082 , Y10T428/24322 , Y10T428/24926
摘要： There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material.
摘要翻译：提供了一种包括能够防止导电性和信号损失的双层结构的导电通孔的多层陶瓷基板。多层陶瓷基板包括：多个电介质层; 以及形成在所述电介质层的至少一部分上的电路图形部分，所述电路图形部分包括至少一个导电通路和导电图案，其中所述至少一个导电通孔包括外周部分和内周部分，沿着贯穿电介质层的通路孔的内壁形成的周边部分，并且由包含金属的第一导电材料形成，并且内周部分填充在外周部分中，并由具有收缩起始温度的第二导电材料形成高于第一导电材料的收缩起始温度。

2. 发明申请

US20120007781A1 ANTENNA MODULE 审中-公开
标题翻译：天线模块
公开(公告)号：US20120007781A1
公开(公告)日：2012-01-12
申请号：US12984081
申请日：2011-01-04
申请人： Joo Yong KIM , Dong Young KIM , Kwang Jae OH , Yun Hwi PARK , Bong Gyun KIM , Yoon Hyuck CHOI , Seok Chool YOON
发明人： Joo Yong KIM , Dong Young KIM , Kwang Jae OH , Yun Hwi PARK , Bong Gyun KIM , Yoon Hyuck CHOI , Seok Chool YOON
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0407 , H01Q1/2283 , H01Q1/38 , H01Q19/005
摘要： There is provided an antenna module. The antenna module according to the present invention may include a patch antenna resonator formed on a surface of a dielectric substrate; and a surface wave-radiation resonator disposed to be separated from the patch antenna resonator, and formed to surround the patch antenna resonator so that signals from the patch antenna resonator are radiated. In this instance, the signals may flow on the surface of the dielectric substrate.
摘要翻译：提供了天线模块。根据本发明的天线模块可以包括形成在电介质基板的表面上的贴片天线谐振器; 以及布置成与贴片天线谐振器分离的表面波辐射谐振器，并且形成为围绕贴片天线谐振器，从而辐射来自贴片天线谐振器的信号。在这种情况下，信号可以在电介质基片的表面上流动。

3. 发明申请

US20130017504A1 FURNACE 审中-公开
标题翻译：炉
公开(公告)号：US20130017504A1
公开(公告)日：2013-01-17
申请号：US13473215
申请日：2012-05-16
申请人： Won Hee YOO , Yun Hwi PARK , Byeung Gyu CHANG
发明人： Won Hee YOO , Yun Hwi PARK , Byeung Gyu CHANG
IPC分类号： F27D19/00 , F27D21/04
CPC分类号： H01L21/67248 , F27B2005/143 , F27D21/0014 , F27D2019/0025 , H01L21/67109
摘要： Disclosed herein is a furnace, including: a body having a space formed therein; a plurality of thermocouples disposed in the body and vertically movably coupled with the body; a plurality of heating elements dispose in the body; and a control unit that receives temperature data from the thermocouples to control temperature of the heating elements, whereby the furnace can measure and control the temperature for each portion of the internal space to form uniform temperature distribution, in particular, make temperature distribution of the heat applied to the fired matter uniform to obtain high-quality fired matter.
摘要翻译：本文公开了一种炉，包括：具有形成在其中的空间的主体; 多个热电偶，其布置在所述主体中并与所述主体垂直地可移动地联接; 多个加热元件配置在体内; 以及控制单元，其接收来自热电偶的温度数据以控制加热元件的温度，由此炉子可以测量和控制内部空间的每个部分的温度，以形成均匀的温度分布，特别是使得热量的温度分布适用于烧制物均匀，以获得高品质的发射物质。

4. 发明申请

US20120037610A1 CERAMIC FIRING FURNACE 审中-公开
标题翻译：陶瓷火炉
公开(公告)号：US20120037610A1
公开(公告)日：2012-02-16
申请号：US12985001
申请日：2011-01-05
申请人： Won Hee YOO , Byeung Gyu CHANG , Yun Hwi PARK
发明人： Won Hee YOO , Byeung Gyu CHANG , Yun Hwi PARK
IPC分类号： F27B14/06
CPC分类号： F27B17/0041 , F27B5/06 , F27B5/16 , F27B17/0075 , F27B2005/165
摘要： A ceramic firing furnace is provided. A uniform gas atmosphere is formed in the ceramic firing furnace to thus minimize a defective ceramic substrate when the ceramic substrate is fired. The ceramic firing furnace includes: a case having an internal space in which a shaped body is disposed; a heating element disposed in the interior of the case and radiating heat; and a plurality of air supply units fastened through the case such that the plurality of air supply units are rotatable by an external force, and supplying a gas to the internal space of the case.
摘要翻译：提供陶瓷烧制炉。在陶瓷烧制炉中形成均匀的气体气氛，从而使陶瓷基板烧成时的陶瓷基板不良。陶瓷烧制炉包括：具有内部空间的壳体，成形体设置在该内部空间中; 设置在壳体内部并辐射热量的加热元件; 以及多个空气供给单元，其通过所述壳体紧固，使得所述多个供气单元能够通过外力旋转，并且将气体供应到所述壳体的内部空间。

5. 发明申请

US20100020499A1 ELECTRONIC CHIP MODULE 有权
标题翻译：电子芯片模块
公开(公告)号：US20100020499A1
公开(公告)日：2010-01-28
申请号：US12425111
申请日：2009-04-16
申请人： Tae Soo LEE , Yun Hwi PARK
发明人： Tae Soo LEE , Yun Hwi PARK
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , H01L23/3737 , H01L2924/0002 , H01L2924/09701 , H05K1/0206 , H05K1/0306 , H05K3/0061 , H05K3/386 , H05K2201/10287 , H01L2924/00
摘要： Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside.
摘要翻译：提供一种具有能够提高散热效率的散热器的电子芯片模块。模块电路板的底面和散热器的上表面通过使用金属线彼此直接接触，使得在安装到模块电路板上的发热装置芯片的操作期间产生的热可以有效地消散到外面。

6. 发明申请

US20090184779A1 WIRELESS COMMUNICATION MODULE 审中-公开
标题翻译：无线通信模块
公开(公告)号：US20090184779A1
公开(公告)日：2009-07-23
申请号：US12336102
申请日：2008-12-16
申请人： Yun Hee CHO , Yun Hwi PARK
发明人： Yun Hee CHO , Yun Hwi PARK
IPC分类号： H03H5/00
CPC分类号： H05K1/165 , H03H7/0123 , H03H7/1791 , H03H7/383 , H03H7/422 , H03H2001/0085 , H05K1/0237 , H05K1/0298 , H05K2201/1006
摘要： A wireless communication module includes a laminated substrate where a plurality of dielectric sheets are laminated, a band pass filter, a balun circuit, and first and second matching circuits. The band pass filter is formed in the laminated substrate. The balun circuit is formed in the laminated substrate, and includes an unbalanced element having one end connected to the band pass filter. The first and second matching circuits are formed in the laminated substrate, and each of them is connected to one end of each of balanced elements of the balun circuit. Herein, at least one of the band pass filter, the balun circuit, the first matching circuit, and the second matching circuit is formed between the dielectric sheets of the laminated substrate using a distributed element.
摘要翻译：无线通信模块包括层叠多个电介质片的层叠基板，带通滤波器，平衡 - 不平衡转换电路以及第一和第二匹配电路。带通滤波器形成在层叠基板中。平衡 - 不平衡转换电路形成在层压基板中，并且包括具有连接到带通滤波器的一端的不平衡元件。第一和第二匹配电路形成在层压基板中，并且它们中的每一个连接到平衡 - 不平衡转换电路的每个平衡元件的一端。这里，使用分散元件在层叠基板的电介质片之间形成带通滤波器，平衡 - 不平衡变换电路，第一匹配电路和第二匹配电路中的至少一个。

7. 发明申请

US20120048602A1 METHOD OF MANUFACTURING CERAMIC SUBSTRATE FOR PROBE CARD AND CERAMIC SUBSTRATE FOR PROBE CARD 审中-公开
标题翻译：用于探针卡的陶瓷基板和探针卡的陶瓷基板的制造方法
公开(公告)号：US20120048602A1
公开(公告)日：2012-03-01
申请号：US13051564
申请日：2011-03-18
申请人： Taek Jung LEE , Byeung Gyu CHANG , Yun Hwi PARK
发明人： Taek Jung LEE , Byeung Gyu CHANG , Yun Hwi PARK
IPC分类号： H05K1/09 , B23P17/00 , H05K1/11 , B29C65/54
CPC分类号： H05K3/4092 , G01R1/07342 , G01R1/07378 , G01R3/00 , H05K3/225 , H05K3/326 , H05K3/4061 , H05K3/4629 , Y10T29/4998
摘要： There is provided a method of manufacturing a ceramic substrate for a probe card and a ceramic substrate for a probe card. The method includes preparing a ceramic substrate having a via electrode provided therein; filling a void formed between the ceramic substrate and the via electrode with a filling material including thermosetting resin; and curing the filling material. Since the void formed between the ceramic substrate and the via electrode is removed, fixation strength between the via electrode and a probe tip can be increased and a defect such as a hollow at the periphery of the via electrode can be prevented.
摘要翻译：提供了一种用于探针卡的陶瓷基板和探针卡的陶瓷基板的制造方法。该方法包括制备其中设置有通孔电极的陶瓷基板; 用包含热固性树脂的填充材料填充形成在陶瓷基板和通孔电极之间的空隙; 并固化填充材料。由于陶瓷基板和通路电极之间形成的空隙被去除，所以可以增加通孔电极和探针尖端之间的固定强度，并且可以防止在通路电极周围的缺陷如中空部分。

8. 发明申请

US20100171200A1 SEMICONDUCTOR CHIP PACKAGE 审中-公开
标题翻译：半导体芯片包装
公开(公告)号：US20100171200A1
公开(公告)日：2010-07-08
申请号：US12727067
申请日：2010-03-18
申请人： Tae Soo LEE , Yun Hwi PARK
发明人： Tae Soo LEE , Yun Hwi PARK
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L23/13 , H01L23/15 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/451 , H01L2224/48227 , H01L2224/48235 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2224/85 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/15787 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor chip package includes a main board; a ceramic substrate having a cavity within which at least one chip is electrically mounted, the cavity being placed at a lower portion of the ceramic substrate facing the main board; and a conductive shielding layer provided with a predetermined thickness on the outside of the ceramic substrate. The ceramic substrate includes: at least one first ground line electrically connecting the conductive shielding layer with the main board; at least one second ground line electrically connecting the conductive shielding layer with the chip; and at least one signal line electrically connecting the chip with the main board. Thus, manufacturing costs are lowered because of the reduced number of components being used, miniaturization in device design can be achieved because of the small volume of the package, and the ground performance can be improved.
摘要翻译：半导体芯片封装包括主板; 陶瓷基板，其具有至少一个芯片电气安装的空腔，所述空腔设置在所述陶瓷基板的面对所述主板的下部; 以及在陶瓷基板的外侧设置有规定厚度的导电性屏蔽层。陶瓷基板包括：将导电屏蔽层与主板电连接的至少一个第一接地线; 将所述导电屏蔽层与所述芯片电连接的至少一个第二接地线; 以及将芯片与主板电连接的至少一个信号线。因此，由于使用的部件数量减少，制造成本降低，因为可以实现小型化的装置设计，因为包装体积小，并且可以提高地面性能。

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