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1. 发明申请

US20050268723A1 Pressure sensor apparatus 有权
标题翻译：压力传感器装置
公开(公告)号：US20050268723A1
公开(公告)日：2005-12-08
申请号：US10918404
申请日：2004-08-16
申请人： Yukiharu Akiyama , Hisato Umemaru
发明人： Yukiharu Akiyama , Hisato Umemaru
IPC分类号： G01L19/06 , F02P5/00 , G01L9/00 , G01L19/00
CPC分类号： G01L19/0627 , F02D2200/0406 , G01L19/0038 , G01L19/0636
摘要： A pressure sensor apparatus having capability of preventing invasion of foreign materials into a pressure sensor with a simplified structure includes the pressure sensor (1) for detecting pressure of a fluid for measurement, and a sensor container (2) for housing therein the pressure sensor (1). The sensor container (2) is connected to a pressure intake port (13) formed in a pipe (12) through which the fluid for measurement flows. The sensor container (2) includes a wall (17) for defining a second compartment (16) located in opposition to the pressure intake port (13) and a first compartment (15) having a pressure introducing port (14) for introducing the fluid for measurement extracted through the pressure intake port (13) to the pressure sensor (1).
摘要翻译：具有能够以简化的结构防止异物侵入压力传感器的能力的压力传感器装置包括用于检测用于测量的流体的压力的压力传感器（1）和用于容纳压力传感器的传感器容器（2） 1）。传感器容器（2）连接到形成在管（12）中的压力进入口（13），流体用于测量流体。传感器容器（2）包括用于限定与压力进气口（13）相对的第二隔室（16）的壁（17）和具有用于引入流体的压力引入口（14）的第一隔室（15）用于通过压力进入口（13）提取到压力传感器（1）的测量。

2. 发明授权

US6029523A Pressure sensor 失效
标题翻译：压力传感器
公开(公告)号：US6029523A
公开(公告)日：2000-02-29
申请号：US201841
申请日：1998-12-01
申请人： Yukiharu Akiyama , Hisato Umemaru
发明人： Yukiharu Akiyama , Hisato Umemaru
IPC分类号： G01L19/00 , G01L9/00 , G01L19/14 , G01L7/00
CPC分类号： G01L19/14
摘要： To suppress the projection of an O ring when a plurality of O rings fitted onto a pipe are inserted into the respective O ring storage chambers of a cup, first and second O ring storage chambers corresponding to the plurality of O rings are formed in the cup, and the line diameter of an O ring which is inserted later is made larger than the line diameter of the O ring which is first inserted.
摘要翻译：为了抑制O形环的突起，当安装在管上的多个O形环插入到杯的各个O形环储存室中时，在杯中形成与多个O形环相对应的第一和第二O形环储存室并且稍后插入的O形环的线径大于首先插入的O形环的直径。

3. 发明授权

US07104136B2 Multi-compartment pressure sensor housing apparatus 有权
标题翻译：多隔室压力传感器外壳装置
公开(公告)号：US07104136B2
公开(公告)日：2006-09-12
申请号：US10918404
申请日：2004-08-16
申请人： Yukiharu Akiyama , Hisato Umemaru
发明人： Yukiharu Akiyama , Hisato Umemaru
IPC分类号： G01L7/08 , G01L7/00
CPC分类号： G01L19/0627 , F02D2200/0406 , G01L19/0038 , G01L19/0636
摘要： A pressure sensor apparatus having capability of preventing invasion of foreign materials into a pressure sensor with a simplified structure includes the pressure sensor (1) for detecting pressure of a fluid for measurement, and a sensor container (2) for housing therein the pressure sensor (1). The sensor container (2) is connected to a pressure intake port (13) formed in a pipe (12) through which the fluid for measurement flows. The sensor container (2) includes a wall (17) for defining a second compartment (16) located in opposition to the pressure intake port (13) and a first compartment (15) having a pressure introducing port (14) for introducing the fluid for measurement extracted through the pressure intake port (13) to the pressure sensor (1).
摘要翻译：具有能够以简化的结构防止异物侵入压力传感器的能力的压力传感器装置包括用于检测用于测量的流体的压力的压力传感器（1）和用于容纳压力传感器的传感器容器（2） 1）。传感器容器（2）连接到形成在管（12）中的压力进入口（13），流体用于测量流体。传感器容器（2）包括用于限定与压力进气口（13）相对的第二隔室（16）的壁（17）和具有用于引入流体的压力引入口（14）的第一隔室（15）用于通过压力进入口（13）提取到压力传感器（1）的测量。

4. 发明申请

US20070096332A1 Electronic component, module, module assembling method, module identification method and module environment setting method 审中-公开
标题翻译：电子元件，模块，模块组装方法，模块识别方法和模块环境设置方法
公开(公告)号：US20070096332A1
公开(公告)日：2007-05-03
申请号：US10558269
申请日：2004-05-28
申请人： Tomotoshi Satoh , Yoshihiko Nemoto , Kenji Takahashi , Yukiharu Akiyama
发明人： Tomotoshi Satoh , Yoshihiko Nemoto , Kenji Takahashi , Yukiharu Akiyama
IPC分类号： H01L23/52
CPC分类号： H01L24/06 , H01L23/481 , H01L25/0657 , H01L29/0657 , H01L2224/0401 , H01L2224/05554 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06555 , H01L2225/06562 , H01L2225/06593 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01055 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10155 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/3011
摘要： An electronic component capable of being assembled into a module in the form of a stack of a plurality of layers is provided. Terminals of terminal groups (31 to 36) are formed so as to have rotational symmetry of a predetermined fold-number or have rotational symmetry and symmetry with respect to the plane containing a symmetric axis line. The terminals (A0 to A7, RFCG) of common connection terminal groups (32, 36) have connecting portions formed on the both surfaces in a stacking direction. Among the terminals of individual connection terminal groups (31, 33), a specific terminal CS; KEY has a connection portion formed at least on one of the both surfaces in the stacking direction while the remaining associated terminals NC; DMY have connection portions formed on the both surfaces in the stacking direction. When such electronic components (20) are stacked so as to be shifted from each other by the angle obtained by dividing 360 degrees by the predetermined fold-number or in addition in the inverted state, it is possible to assemble a module using the electronic components (20) having the same configuration.
摘要翻译：提供能够组装成多层叠层形式的模块的电子部件。端子组（31〜36）的端子形成为具有预定折叠数的旋转对称，或者相对于包含对称轴线的平面具有旋转对称性和对称性。公共连接端子组（32,36）的端子（A 0〜A 7，RFCG）具有在层叠方向上形成在两面的连接部。在各个连接端子组（31,33）的端子中，具体端子CS; KEY具有在层叠方向上形成在两个表面中的至少一个上的连接部分，而剩余的关联端子NC; DMY在层叠方向的两面形成有连接部。当这样的电子部件（20）被堆叠以便以360度除以预定的折叠数，或者在倒置状态下相互偏移所获得的角度时，可以使用电子部件（20）具有相同的构造。

5. 发明授权

US06472727B2 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US06472727B2
公开(公告)日：2002-10-29
申请号：US09771648
申请日：2001-01-30
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
IPC分类号： H01L23495
CPC分类号： H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48465 , H01L2224/48472 , H01L2224/50 , H01L2224/73215 , H01L2224/85951 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , Y10T29/4913 , Y10T29/49169 , H01L2924/20753 , H01L2224/05599
摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

6. 发明授权

US06353255B2 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US06353255B2
公开(公告)日：2002-03-05
申请号：US09764378
申请日：2001-01-19
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
IPC分类号： H01L23435
CPC分类号： H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48465 , H01L2224/48472 , H01L2224/50 , H01L2224/73215 , H01L2224/85951 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , Y10T29/4913 , Y10T29/49169 , H01L2924/20753 , H01L2224/05599
摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

7. 发明授权

US06342726B2 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US06342726B2
公开(公告)日：2002-01-29
申请号：US09449834
申请日：1999-11-26
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masanori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe
IPC分类号： H01L23495
CPC分类号： H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48465 , H01L2224/48472 , H01L2224/50 , H01L2224/73215 , H01L2224/85951 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , Y10T29/4913 , Y10T29/49169 , H01L2924/20753 , H01L2224/05599
摘要： A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

8. 发明授权

US08404586B2 Manufacturing method for semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US08404586B2
公开(公告)日：2013-03-26
申请号：US11635044
申请日：2006-12-07
申请人： Kazumasa Tanida , Mitsuo Umemoto , Yukiharu Akiyama
发明人： Kazumasa Tanida , Mitsuo Umemoto , Yukiharu Akiyama
IPC分类号： H01L21/44
CPC分类号： H01L25/0657 , H01L23/481 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/05008 , H01L2224/05009 , H01L2224/05026 , H01L2224/05147 , H01L2224/1134 , H01L2224/13021 , H01L2224/13025 , H01L2224/13144 , H01L2224/16145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/04941 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A manufacturing method for a semiconductor device includes: the step of preparing a semiconductor chip which is provided with a functional element formed on a front surface side of a semiconductor substrate, a feedthrough electrode which is placed within a through hole that penetrates the semiconductor substrate, a front surface side connection member which protrudes from the front surface, and a rear surface side connection member which has a joining surface within a recess that is formed in a rear surface; the step of preparing a solid state device where a solid state device side connection member for connection to the front surface side connection member is formed on one surface; and the joining step of making the front surface of the semiconductor chip face the first surface of the solid state device by holding the rear surface of the semiconductor chip, and of joining the front surface side connection member to the solid state device side connection member.
摘要翻译：半导体装置的制造方法包括：准备半导体芯片的步骤，该半导体芯片设置有形成在半导体基板的正面侧的功能元件，放置在贯通半导体基板的通孔内的馈通电极，从前表面突出的前表面侧连接构件和在形成在后表面的凹部内具有接合表面的后表面侧连接构件; 制备固态器件的步骤，其中在一个表面上形成用于连接到前表面侧连接部件的固态器件侧连接部件; 并且通过保持半导体芯片的后表面并将前表面侧连接构件接合到固态器件侧连接构件，使半导体芯片的前表面面向固态器件的第一表面的接合步骤。

9. 发明申请

US20070080457A1 Manufacturing method for semiconductor device, semiconductor device and semiconductor chip 有权
标题翻译：半导体器件，半导体器件和半导体芯片的制造方法
公开(公告)号：US20070080457A1
公开(公告)日：2007-04-12
申请号：US11635044
申请日：2006-12-07
申请人： Kazumasa Tanida , Mitsuo Umemoto , Yukiharu Akiyama
发明人： Kazumasa Tanida , Mitsuo Umemoto , Yukiharu Akiyama
IPC分类号： H01L21/00 , H01L21/44 , H01L23/48
CPC分类号： H01L25/0657 , H01L23/481 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/05008 , H01L2224/05009 , H01L2224/05026 , H01L2224/05147 , H01L2224/1134 , H01L2224/13021 , H01L2224/13025 , H01L2224/13144 , H01L2224/16145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2924/00014 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/04941 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A manufacturing method for a semiconductor device includes: the step of preparing a semiconductor chip which is provided with a functional element formed on a front surface side of a semiconductor substrate, a feedthrough electrode which is placed within a through hole that penetrates the semiconductor substrate, a front surface side connection member which protrudes from the front surface, and a rear surface side connection member which has a joining surface within a recess that is formed in a rear surface; the step of preparing a solid state device where a solid state device side connection member for connection to the front surface side connection member is formed on one surface; and the joining step of making the front surface of the semiconductor chip face the first surface of the solid state device by holding the rear surface of the semiconductor chip, and of joining the front surface side connection member to the solid state device side connection member.
摘要翻译：半导体装置的制造方法包括：准备半导体芯片的步骤，该半导体芯片设置有形成在半导体基板的正面侧的功能元件，放置在贯通半导体基板的通孔内的馈通电极，从前表面突出的前表面侧连接构件和在形成在后表面的凹部内具有接合表面的后表面侧连接构件; 制备固态器件的步骤，其中在一个表面上形成用于连接到前表面侧连接部件的固态器件侧连接部件; 并且通过保持半导体芯片的后表面并将前表面侧连接构件接合到固态器件侧连接构件，使半导体芯片的前表面面向固态器件的第一表面的接合步骤。

10. 发明授权

US07091620B2 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US07091620B2
公开(公告)日：2006-08-15
申请号：US11116209
申请日：2005-04-28
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

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