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    • 3. 发明申请
    • SPATIAL INFORMATION DETECTING APPARATUS
    • 空间信息检测装置
    • US20090045359A1
    • 2009-02-19
    • US12096019
    • 2007-10-10
    • Minoru KumaharaYusuke HashimotoShinji SakamotoYuji Takada
    • Minoru KumaharaYusuke HashimotoShinji SakamotoYuji Takada
    • G01N21/84
    • G01S17/36G01S7/4913G01S7/4915G01S7/493G01S7/497G01S17/89
    • In an apparatus using an intensity-modulated light for detection of spatial information based upon light intensity of light reflected from a target space, a timing synchronization circuit is provided to synchronize a phase of the intensity-modulated light from a light-emitting element with a timing of operating a light-receiving element receiving the intensity-modulated light. The light-receiving element is caused to operate for enabling the detection of intensity of the received light for each of a plurality of phase regions within one cycle of the intensity-modulated light. The timing synchronization circuit functions to compare a cyclic variation determining the operation of the light-receiving element with a cyclic variation associated with an output from a light-emitting element driving circuit in order to keep a constant phase difference between these two cyclic variations.
    • 在使用强度调制光用于基于从目标空间反射的光的光强度来检测空间信息的装置中,提供定时同步电路以使来自发光元件的强度调制光的相位与 操作接收强度调制光的光接收元件的定时。 导致光接收元件操作,以便能够在强度调制光的一个周期内检测多个相位区域中的每一个的接收光的强度。 定时同步电路用于将确定光接收元件的操作的循环变化与与发光元件驱动电路的输出相关联的循环变化进行比较,以便在这两个循环变化之间保持恒定的相位差。
    • 4. 发明授权
    • Spatial information detecting apparatus
    • 空间信息检测装置
    • US07755743B2
    • 2010-07-13
    • US12096019
    • 2007-10-10
    • Minoru KumaharaYusuke HashimotoShinji SakamotoYuji Takada
    • Minoru KumaharaYusuke HashimotoShinji SakamotoYuji Takada
    • G01C3/08
    • G01S17/36G01S7/4913G01S7/4915G01S7/493G01S7/497G01S17/89
    • In an apparatus using an intensity-modulated light for detection of spatial information based upon light intensity of light reflected from a target space, a timing synchronization circuit is provided to synchronize a phase of the intensity-modulated light from a light-emitting element with a timing of operating a light-receiving element receiving the intensity-modulated light. The light-receiving element is caused to operate for enabling the detection of intensity of the received light for each of a plurality of phase regions within one cycle of the intensity-modulated light. The timing synchronization circuit functions to compare a cyclic variation determining the operation of the light-receiving element with a cyclic variation associated with an output from a light-emitting element driving circuit in order to keep a constant phase difference between these two cyclic variations.
    • 在使用强度调制光用于基于从目标空间反射的光的光强度来检测空间信息的装置中,提供定时同步电路以使来自发光元件的强度调制光的相位与 操作接收强度调制光的光接收元件的定时。 导致光接收元件操作,以便能够在强度调制光的一个周期内检测多个相位区域中的每一个的接收光的强度。 定时同步电路用于将确定光接收元件的操作的循环变化与与发光元件驱动电路的输出相关联的循环变化进行比较,以便在这两个循环变化之间保持恒定的相位差。
    • 6. 发明申请
    • WAFER CONVEYANCE METHOD AND WAFER CONVEYANCE DEVICE
    • 波浪输送方法和波浪输送装置
    • US20090297302A1
    • 2009-12-03
    • US12468576
    • 2009-05-19
    • Shinji Sakamoto
    • Shinji Sakamoto
    • H01L21/677
    • H01L21/6735H01L21/67712H01L21/67718
    • In order to make it possible to reduce the occurrence of physical damage to wafers during conveyance, a state is established in which wafers W are contained in a wafer cassette 1 standing approximately vertically, and the wafer cassette 1 is conveyed, in this state in which the wafers W are contained in the wafer cassette 1 standing approximately vertically, so that the planes of the wafers W are approximately parallel to the direction of conveyance. Since the wafers are kept in the state of standing approximately vertically, it is possible to reduce the occurrence of bending, as happens when they are held horizontally. Moreover, since the wafer cassette 1 is conveyed while keeping the planes of the wafers approximately parallel to the direction of conveyance, accordingly it is possible to reduce the increase of weight which acts upon the wafers W in the direction perpendicular to their planes caused by acceleration due to vertical shifting, horizontal shifting, or vertical vibration; and therefore it is possible to reduce the occurrence of bending of the wafers W.
    • 为了减少在输送过程中对晶片的物理损坏的可能性,建立了一种状态,其中晶片盒1被容纳在大致垂直放置的晶片盒1中,晶片盒1被传送,在这种状态下 晶片盒1容纳在大致垂直放置的晶片盒1中,使得晶片W的平面大致平行于输送方向。 由于晶片保持大致垂直地站立的状态,因此可以在水平保持时发生弯曲的发生。 此外,由于晶片盒1被输送,同时保持晶片的平面大致平行于输送方向,因此可以减少由加速度引起的垂直于它们的平面的方向作用在晶片W上的重量的增加 由于垂直移动,水平移动或垂直振动; 因此可以减少晶片W的弯曲的发生。
    • 8. 发明授权
    • Method for measuring semiconductor wafer profile and device for measuring the same used therefor
    • 用于测量半导体晶片轮廓的方法和用于测量其的装置
    • US08339594B2
    • 2012-12-25
    • US12953523
    • 2010-11-24
    • Shinji Sakamoto
    • Shinji Sakamoto
    • G01N21/00
    • G01B11/24
    • Disclosed is a method for measuring a profile using a device for measuring the profile in which included are: a distance measuring means 2 for measuring the distance to an edge region of a semiconductor wafer 12 in such a manner that light is emitted to be reflected at the edge region and to be detected; a first swing mechanism swingably supporting the distance measuring means 2; and a second swing mechanism swingably supporting the first swing mechanism, the method comprising the steps of: locating angles of the first swing mechanism each of which gives a maximum intensity of received light at each of predetermined angles of the second swing mechanism thereof; calculating contour points using coordinate transformation, thereby enabling points-related data to be acquired to represent a contour profile of the edge region. Thus, the method can be used for edge profile measurement of large-diameter wafers.
    • 公开了一种使用用于测量轮廓的装置来测量轮廓的方法,其中包括:距离测量装置2,用于测量与半导体晶片12的边缘区域的距离,使得发射光以在 边缘区域并被检测; 可摆动地支撑距离测量装置2的第一摆动机构; 以及可摆动地支撑所述第一摆动机构的第二摆动机构,所述方法包括以下步骤:将所述第一摆动机构的角度定位,其中,所述第一摆动机构在其第二摆动机构的每个预定角度处给出最大的接收光强度; 使用坐标变换计算轮廓点,从而能够获取点相关数据以表示边缘区域的轮廓线。 因此,该方法可用于大直径晶片的边缘轮廓测量。