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    • 10. 发明授权
    • Method for light exposure
    • 曝光方法
    • US06677108B2
    • 2004-01-13
    • US09907345
    • 2001-07-17
    • Nobuyuki MatsuzawaShigeo Irie
    • Nobuyuki MatsuzawaShigeo Irie
    • G03C556
    • G03F7/2039G03F7/2004Y10S430/167Y10S430/168
    • A light exposure method in which, when a resist layer is selectively exposed to one of X-rays containing soft X-rays, vacuum ultraviolet light rays and ultraviolet rays containing extreme ultraviolet light rays for patterning the resist layer to a pre-set shape, a high molecular material having pre-set oxygen content ratio (no) and density (&rgr;) is applied to form a resist layer having a film thickness not less than 250 nm. Since the high molecular material having the pre-set oxygen content ratio (no) and density (&rgr;) is used, a resist pattern of a better shape may be obtained even if the resist layer is of an increased thickness of not less than 250 nm. Since the film thickness of the resist layer is not less than 250 nm, it is possible to construct a lithographic process superior in etching resistance to realize ultra-fine machining than was heretofore possible.
    • 一种曝光方法,其中当将抗蚀剂层选择性地暴露于含有软X射线的X射线之一,真空紫外光线和包含用于将抗蚀剂层图案化为预定形状的极紫外光的紫外线时, 施加具有预设氧含量比(No)和密度(rho))的高分子材料以形成膜厚度不小于250nm的抗蚀剂层。 由于使用具有预设氧含量比(no)和密度(rho)的高分子材料,因此即使抗蚀剂层的厚度增加到不小于250nm,也可以获得更好形状的抗蚀剂图案 。 由于抗蚀剂层的膜厚度不小于250nm,因此可以构造抗蚀性优异的平版印刷工艺,以实现超细加工。