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    • 1. 发明授权
    • Conductive paste for terminal electrode of multilayer ceramic electronic part
    • 多层陶瓷电子部件端子电极用导电膏
    • US07368070B2
    • 2008-05-06
    • US11091135
    • 2005-03-28
    • Yuji AkimotoMegumi KawaharaTomoko Uchida
    • Yuji AkimotoMegumi KawaharaTomoko Uchida
    • H01B1/16
    • H01G4/30H01C1/148H01C17/283H01G4/2325
    • A conductive paste for a terminal electrode of a multilayer ceramic electronic part, comprising (A) a spherical conductive powder which comprises chiefly copper, and which has a vitreous thin film on at least a portion of the surfaces thereof, (B) a flaky conductive powder comprising chiefly copper, (C) a glass powder, and (D) an organic vehicle, and may further contain (E) an aliphatic amine. When baked to form terminal electrodes for multilayer ceramic electronic parts, this paste exhibits extremely superior binder removal characteristics at low temperatures, and furthermore, it is superior in terms of oxidation resistance, binder removal characteristics and firing characteristics with no need for strict control of the firing conditions, thereby dense terminal electrodes that are superior in terms of adhesion and conductivity can be formed.
    • 一种多层陶瓷电子部件的端子电极用导电性糊料,其特征在于,包括:(A)主要由铜构成的球状导电性粉末,其表面的至少一部分具有玻璃状薄膜,(B)片状导电性 主要包括铜的粉末,(C)玻璃粉末和(D)有机载体,并且还可以含有(E)脂族胺。 当烘烤以形成多层陶瓷电子部件的端子电极时,该糊料在低温下表现出极好的粘合剂去除特性,此外,它在抗氧化性,粘合剂去除特性和烧制特性方面优异,而不需要严格控制 因此能够形成密合性和导电性优异的致密末端电极。
    • 6. 发明授权
    • Electronic device, and its fabrication method
    • 具有具有中间氧化物层的端子电极的多层器件
    • US6124769A
    • 2000-09-26
    • US327169
    • 1999-06-07
    • Katsuhiko IgarashiSunao MasudaTomoko UchidaYasumichi TokuokaShigeki Sato
    • Katsuhiko IgarashiSunao MasudaTomoko UchidaYasumichi TokuokaShigeki Sato
    • H01C1/142H01C7/18H01C17/00H01G4/232H03H1/02
    • H01C1/142H01C17/006H01C7/18H01G4/40
    • The invention provides an electronic device comprising a first metal layer containing a first metal converted into an oxide upon firing in an oxidizing atmosphere and a second metal layer formed by firing of a second metal particle containing a metal that is not oxidized upon firing in an oxidizing atmosphere, with an intermediate oxide layer interleaved between these two metal layers. The intermediate oxide layer contains an oxide of the first metal contained in the first metal layer. Preferably, the second metal particle contained in the second metal layer is dispersed in the intermediate oxide layer. A uniform oxide layer is obtained at a simple step, and the resistance value provided by the oxide layer is easily controllable with high precision. It is thus possible to achieve an electronic device in which the bonding strength of the oxide layer with respect to the other metal-containing layer is improved with an improvement in the bonding strength with respect to lead wires.
    • 本发明提供了一种电子器件,其包括第一金属层,该第一金属层含有在氧化气氛中烧制时转化为氧化物的第一金属,以及第二金属层,其通过在氧化性气体中烧成含有不被氧化的金属的第二金属颗粒 在这两个金属层之间交错的中间氧化物层。 中间氧化物层含有第一金属层中含有的第一金属的氧化物。 优选地,包含在第二金属层中的第二金属颗粒分散在中间氧化物层中。 在简单的步骤中获得均匀的氧化物层,并且由氧化物层提供的电阻值以高精度容易地控制。 因此,通过提高相对于引线的接合强度,可以实现氧化物层相对于其他含金属层的接合强度提高的电子器件。