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1. 发明授权

US06501525B2 Method for interconnecting a flat panel display having a non-transparent substrate and devices formed 失效
标题翻译：用于互连具有不透明基板的平板显示器和形成的装置的方法
公开(公告)号：US06501525B2
公开(公告)日：2002-12-31
申请号：US09732863
申请日：2000-12-08
申请人： Yuan-Chang Huang , Tai-Hong Chen
发明人： Yuan-Chang Huang , Tai-Hong Chen
IPC分类号： G02F11335
CPC分类号： G02F1/13452 , G02F1/1345 , G02F1/136277 , H05K1/0269 , H05K3/323 , H05K3/361 , H05K2201/0108 , H05K2203/166
摘要： A method for simultaneously forming a flat display panel and bonding to a printed circuit board is disclosed in which a silicon wafer is first supplied and then coated with an alignment layer, a multiplicity of spacers are then mounted to the wafer before it is severed into a multiplicity of dies. A frame seal is then applied to the periphery of the die, while a multiplicity of metal leads is formed on the die for electrical communication with a multiplicity of thin film transistors. A glass plate is then assembled to the silicon substrate by the frame seal, while simultaneously bonded to a printed circuit board in a bonder apparatus under pressure by utilizing a conductive material such as silver paste, an anisotropic conductive film or an isotropic conductive adhesive. The bonding of the printed circuit board to the flat panel display module occurs simultaneously with the formation of interconnections between the printed circuit board and the multiplicity of metal leads on the silicon substrate through a multiplicity of transparent electrodes formed on the glass plate of the flat panel display. The present invention novel structure allows the use of a conventional alignment apparatus such as CCD for optical alignment and a conventional bonder apparatus since a glass substrate is completely exposed and optical transmission can be achieved through the flat panel display module.
摘要翻译：公开了一种同时形成平板显示面板并结合印刷电路板的方法，其中首先提供硅晶片，然后涂覆取向层，然后将许多间隔物安装到晶片上，然后将其切割成多重的模具然后将框架密封件施加到管芯的周边，同时在管芯上形成多个金属引线以与多个薄膜晶体管电连通。然后通过框架密封将玻璃板组装到硅衬底，同时通过利用诸如银膏，各向异性导电膜或各向同性导电粘合剂的导电材料在压力下在粘合装置中同时结合印刷电路板。印刷电路板与平板显示模块的接合与印刷电路板和硅基板上的多个金属引线之间的互连通过形成在平板玻璃板上的多个透明电极同时发生显示。本发明的新颖结构允许使用诸如用于光学对准的CCD的常规对准装置和常规的接合装置，因为玻璃基板被完全暴露，并且可以通过平板显示模块实现光传输。

2. 发明申请

US20070170523A1 CIRCUIT SUBSTRATE AND PACKAGING THEREOF AND THE METHOD FOR FABRICATING THE PACKAGING 审中-公开
标题翻译：电路基板及其包装及其制造方法
公开(公告)号：US20070170523A1
公开(公告)日：2007-07-26
申请号：US11468341
申请日：2006-08-30
申请人： Yao-Sheng Lin , Tai-Hong Chen
发明人： Yao-Sheng Lin , Tai-Hong Chen
IPC分类号： H01L29/76
CPC分类号： H05K3/361 , G02F1/13452 , H01L23/49838 , H01L23/4985 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/81136 , H01L2224/81801 , H01L2224/83136 , H01L2224/838 , H01L2924/00013 , H01L2924/01006 , H01L2924/01033 , H01L2924/0781 , H01L2924/12044 , H01L2924/351 , H05K1/111 , H05K3/225 , H05K3/323 , H05K2201/09427 , H05K2201/09663 , H05K2203/175 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00
摘要： A circuit substrate and its packaging and the method for fabricating the packaging are provided. A plurality of electrodes are formed on the surface of the circuit substrate, the electrodes are formed with fork structures, so that when the circuit substrate expands/contracts due to thermal processes, such that the probability of alignment with electrodes of an external circuit board is increased. Meanwhile, overlapping portions of the fork structures with the electrodes of the circuit board can be cut away to avoid short circuit. Thus, electrode misalignment due to electrode pitch variation of the traditional circuit substrate as a result of thermal deformation can be effectively eliminated.
摘要翻译：提供电路基板及其封装及其制造方法。多个电极形成在电路基板的表面上，电极形成有叉形结构，使得当电路基板由于热处理而膨胀/收缩时，使得与外部电路板的电极对准的概率为增加。同时，叉结构与电路板的电极的重叠部分可以被切掉以避免短路。因此，可以有效地消除由于热变形导致的传统电路基板的电极间距变化导致的电极未对准。

3. 发明授权

US5906725A Method for preparing nickel-zinc-copper or nickel-zinc alloy electroplating solutions from zinc-containing waste articles having a nickel/copper electroplating layer 失效
标题翻译：从具有镍/铜电镀层的含锌废物制备镍 - 锌 - 铜或镍 - 锌合金电镀溶液的方法
公开(公告)号：US5906725A
公开(公告)日：1999-05-25
申请号：US880995
申请日：1997-06-23
申请人： Jing-Chie Lin , Jyh-Yeong Lin , Tai-Hong Chen , Fong-Ru Yang , Jyh-Herng Chen
发明人： Jing-Chie Lin , Jyh-Yeong Lin , Tai-Hong Chen , Fong-Ru Yang , Jyh-Herng Chen
IPC分类号： C25D21/14 , C25D3/58 , C25D3/56 , C25D21/12
CPC分类号： C25D21/14
摘要： A zinc-containing waste article is recycled by a method in which the zinc of the waste article is recovered in a molten state while the unmolten nickel/copper electroplating layer of the waste article is dissolved in an acidic solution to form a nickel-zinc alloy or a nickel-zinc-copper alloy electroplating solution.
摘要翻译：一种含锌废物通过废弃物品的锌在熔融状态下回收的方法再循环，而废物的未熔融镍/铜电镀层溶解在酸性溶液中形成镍 - 锌合金或镍 - 锌 - 铜合金电镀液。

4. 发明申请

US20070210457A1 COMPOSITE BUMP 失效
标题翻译：复合BUMP
公开(公告)号：US20070210457A1
公开(公告)日：2007-09-13
申请号：US11308180
申请日：2006-03-10
申请人： Ji-Cheng Lin , Yao-Sheng Lin , Shyh-Ming Chang , Su-Tsai Lu , Hsien-Chie Cheng , Tai-Hong Chen
发明人： Ji-Cheng Lin , Yao-Sheng Lin , Shyh-Ming Chang , Su-Tsai Lu , Hsien-Chie Cheng , Tai-Hong Chen
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L24/10 , H01L23/49811 , H01L24/13 , H01L2224/05567 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/00 , H01L2224/05599
摘要： A composite bump suitable for disposing on a substrate pad is provided. The composite bump includes a compliant body and an outer conductive layer. The coefficient of thermal expansion (CTE) of the compliant body is between 5 ppm/° C. and 200 ppm/° C. The outer conductive layer covers the compliant body and is electrically connected to the pad. The compliant body can provide a stress buffering effect for a bonding operation. Furthermore, by setting of the CTE of the compliant body within a preferable range, damages caused by thermal stress are reduced while the bonding effect is enhanced.
摘要翻译：提供了适合于设置在基板焊盘上的复合凸块。复合凸块包括柔性本体和外导电层。柔性体的热膨胀系数（CTE）在5ppm /℃和200ppm /℃之间。外部导电层覆盖柔性体并与衬垫电连接。柔性体可以为粘接操作提供应力缓冲效果。此外，通过将柔性体的CTE设定在优选范围内，由于热应力引起的损伤降低，同时结合效果增强。

5. 发明授权

US06767818B1 Method for forming electrically conductive bumps and devices formed 失效
标题翻译：形成导电凸块和器件的方法
公开(公告)号：US06767818B1
公开(公告)日：2004-07-27
申请号：US09634556
申请日：2000-08-07
申请人： Shyh-Ming Chang , Tai-Hong Chen , Yu-Te Hsieh , Chun-Ming Huang , Jui Ming Ni , Ching-Yun Chang , Jwo-Huei Jou
发明人： Shyh-Ming Chang , Tai-Hong Chen , Yu-Te Hsieh , Chun-Ming Huang , Jui Ming Ni , Ching-Yun Chang , Jwo-Huei Jou
IPC分类号： H01L2144
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/05624 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684 , H01L2224/05124 , H01L2224/05147
摘要： A method for forming electrically conductive bumps on a semiconductor substrate, or a semiconductor wafer and devices formed by the method are disclosed. In the method, a wafer that has an active surface, a plurality of conductive elements formed on the active surface and a passivation layer insulating the plurality of conductive bumps from each other is first provided. A first metal layer is then sputter deposited on top of the plurality of conductive elements and the passivation layer, followed by stencil printing a plurality of bumps of an insulating material on top of each one of the plurality of conductive elements. The plurality of bumps may be heat treated to a temperature of at least 100° C. for a period of at least 10 minutes for stress relief. A second metal layer is then sputter deposited on top of the plurality of bumps and the first metal layer. The first and the second metal layers are then patterned by a photolithographic process and formed by a wet or dry etching process to remove metal layers in areas in-between the plurality of bumps.
摘要翻译：公开了一种在半导体衬底或半导体晶片上形成导电凸块的方法以及通过该方法形成的器件。在该方法中，首先提供具有活性表面的晶片，形成在有源表面上的多个导电元件和使多个导电凸块彼此绝缘的钝化层。然后将第一金属层溅射沉积在多个导电元件和钝化层的顶部上，随后在多个导电元件中的每一个的顶部上模版印刷绝缘材料的多个凸块。多个凸起可以被热处理至至少100℃的温度至少10分钟的时间以减轻应力。然后将第二金属层溅射沉积在多个凸起和第一金属层的顶部上。然后通过光刻工艺对第一和第二金属层进行构图，并通过湿式或干式蚀刻工艺形成，以去除多个凸块之间的区域中的金属层。

6. 发明授权

US08604613B2 Electronic assembly having a multilayer adhesive structure 有权
标题翻译：具有多层粘合剂结构的电子组件
公开(公告)号：US08604613B2
公开(公告)日：2013-12-10
申请号：US12237578
申请日：2008-09-25
申请人： Su-Tsai Lu , Tai-Hong Chen
发明人： Su-Tsai Lu , Tai-Hong Chen
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/12 , H01L23/3114 , H01L23/49811 , H01L23/49822 , H01L23/49838 , H01L24/11 , H01L24/17 , H01L24/29 , H01L24/83 , H01L24/90 , H01L2224/05001 , H01L2224/05022 , H01L2224/05567 , H01L2224/114 , H01L2224/116 , H01L2224/13016 , H01L2224/13099 , H01L2224/16225 , H01L2224/29082 , H01L2224/29083 , H01L2224/2929 , H01L2224/293 , H01L2224/29499 , H01L2224/325 , H01L2224/73104 , H01L2224/73204 , H01L2224/81801 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83851 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01L2924/3025 , H01L2924/01007 , H01L2924/00 , H01L2924/00012 , H01L2224/05541 , H01L2224/05005 , H01L2224/05599 , H01L2224/05099
摘要： An electronic device comprises a substrate and a number of bump units over the substrate, wherein each of the bump units includes an electrically insulating bump-forming body extending in a first direction, and at least two conductive layers separated from each other on the electrically insulating bump-forming body, the at least two conductive layers extending in a second direction orthogonal to the first direction.
摘要翻译：电子器件包括衬底和衬底上的多个凸块单元，其中每个凸块单元包括沿第一方向延伸的电绝缘凸块形成体，以及在电绝缘上彼此分离的至少两个导电层所述至少两个导电层在与所述第一方向正交的第二方向上延伸。

7. 发明申请

US20090026611A1 ELECTRONIC ASSEMBLY HAVING A MULTILAYER ADHESIVE STRUCTURE 有权
标题翻译：具有多层粘结结构的电子组件
公开(公告)号：US20090026611A1
公开(公告)日：2009-01-29
申请号：US12237578
申请日：2008-09-25
申请人： Su-Tsai Lu , Tai-Hong Chen
发明人： Su-Tsai Lu , Tai-Hong Chen
IPC分类号： H01L21/60 , H01L23/498
CPC分类号： H01L24/12 , H01L23/3114 , H01L23/49811 , H01L23/49822 , H01L23/49838 , H01L24/11 , H01L24/17 , H01L24/29 , H01L24/83 , H01L24/90 , H01L2224/05001 , H01L2224/05022 , H01L2224/05567 , H01L2224/114 , H01L2224/116 , H01L2224/13016 , H01L2224/13099 , H01L2224/16225 , H01L2224/29082 , H01L2224/29083 , H01L2224/2929 , H01L2224/293 , H01L2224/29499 , H01L2224/325 , H01L2224/73104 , H01L2224/73204 , H01L2224/81801 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83851 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01L2924/3025 , H01L2924/01007 , H01L2924/00 , H01L2924/00012 , H01L2224/05541 , H01L2224/05005 , H01L2224/05599 , H01L2224/05099
摘要： An electronic device comprises a substrate and a number of bump units over the substrate, wherein each of the bump units includes an electrically insulating bump-forming body extending in a first direction, and at least two conductive layers separated from each other on the electrically insulating bump-forming body, the at least two conductive layers extending in a second direction orthogonal to the first direction.
摘要翻译：电子器件包括衬底和衬底上的多个凸块单元，其中每个凸块单元包括沿第一方向延伸的电绝缘凸块形成体，以及在电绝缘上彼此分离的至少两个导电层所述至少两个导电层在与所述第一方向正交的第二方向上延伸。

8. 发明授权

US5888373A Method for repairing nickel-zinc-copper or nickel-zinc alloy electroplating solutions from acidic waste solutions containing nickel and zinc ions and electroplating thereof 失效
标题翻译：从含有镍和锌离子的酸性废溶液中修复镍 - 锌 - 铜或镍 - 锌合金电镀液的方法及其电镀
公开(公告)号：US5888373A
公开(公告)日：1999-03-30
申请号：US880998
申请日：1997-06-23
申请人： Jin-Chie Lin , Chih-Chia Chen , Tai-Hong Chen , Fong-Ru Yang , Jyh-Herng Chen
发明人： Jin-Chie Lin , Chih-Chia Chen , Tai-Hong Chen , Fong-Ru Yang , Jyh-Herng Chen
IPC分类号： C25D21/14 , C25D3/58
CPC分类号： C25D21/14
摘要： A method for preparing a nickel-zinc-copper or nickel-zinc alloy electroplating solution from at least one electroplating waste solution and/or at least one acidic leach solution of metal scrap containing nickel and/or zinc ions is disclosed. The method involves mixing two or more than two of solutions of the electroplating waste solutions and the acidic leach solutions, and optionally water, so that the ion concentrations of Ni, Zn, Cu, Fe, Cr and Pb of the resulting mixed solution are within the following ion concentrations:15 gdm.sup.-3
摘要翻译：公开了一种从至少一种电镀废液和/或含有镍和/或锌离子的金属废料的至少一种酸性浸出溶液制备镍 - 锌 - 铜或镍 - 锌合金电镀溶液的方法。该方法包括混合电镀废液和酸性浸出溶液以及任选的水中的两种或两种以上的溶液，使得所得混合溶液中的Ni，Zn，Cu，Fe，Cr和Pb的离子浓度在以下离子浓度：15gdm-3

9. 发明授权

US08247908B2 Circuit substrate and method for utilizing packaging of the circuit substrate 有权
标题翻译：电路基板和利用电路基板封装的方法
公开(公告)号：US08247908B2
公开(公告)日：2012-08-21
申请号：US12843251
申请日：2010-07-26
申请人： Yao-Sheng Lin , Tai-Hong Chen
发明人： Yao-Sheng Lin , Tai-Hong Chen
IPC分类号： H01L23/52
CPC分类号： H05K3/361 , G02F1/13452 , H01L23/49838 , H01L23/4985 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/81 , H01L24/83 , H01L24/98 , H01L2224/0401 , H01L2224/05599 , H01L2224/13016 , H01L2224/2929 , H01L2224/293 , H01L2224/81136 , H01L2224/81801 , H01L2224/81903 , H01L2224/83101 , H01L2224/83136 , H01L2224/838 , H01L2224/83851 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0781 , H01L2924/12044 , H01L2924/15788 , H01L2924/351 , H05K1/111 , H05K3/225 , H05K3/323 , H05K3/4092 , H05K2201/09427 , H05K2201/09663 , H05K2203/175 , H01L2924/00
摘要： A circuit substrate and the method for fabricating a packaging of the circuit substrate are provided. A plurality of electrodes are formed on the surface of the circuit substrate, the electrodes are formed with fork structures over an connection section of the circuit substrate, so that when the circuit substrate expands/contracts due to thermal processes, the probability of alignment with electrodes of an external circuit board is increased by easily detaching the fork structure overlapping an electrode of the external circuit board which is not corresponding to the fork structure of the electrode of the circuit substrate, so as to avoid short circuit. Thus, electrode misalignment due to electrode pitch variation of the traditional circuit substrate as a result of thermal deformation can be effectively eliminated.
摘要翻译：提供电路基板和制造电路基板的封装的方法。多个电极形成在电路基板的表面上，电极在电路基板的连接部分上形成有叉结构，使得当电路基板由于热处理而膨胀/收缩时，与电极对准的概率通过容易地分离与外部电路板的与电路基板的电极的叉结构不相对应的电极重叠的叉结构来增加外部电路板，以避免短路。因此，可以有效地消除由于热变形导致的传统电路基板的电极间距变化引起的电极未对准。

10. 发明授权

US08023060B2 Flexible display 有权
标题翻译：灵活显示
公开(公告)号：US08023060B2
公开(公告)日：2011-09-20
申请号：US11926113
申请日：2007-10-28
申请人： Yao-Sheng Lin , Tai-Hong Chen , Su-Yu Fun
发明人： Yao-Sheng Lin , Tai-Hong Chen , Su-Yu Fun
IPC分类号： G02F1/1333
CPC分类号： G06F1/1615 , G02F1/133305 , G02F2201/54 , G06F1/1652
摘要： A flexible display including a flexible display panel and a flexible hollow supporting structure is provided. The flexible display panel has a first end and a second end opposite to each other. The flexible hollow supporting structure is integrated with the flexible display panel and extends from the first end to the second end of the flexible display panel. In addition, a supporting medium can be infused into the flexible hollow supporting structure so as to stretch and support the flexible display panel.
摘要翻译：提供了包括柔性显示面板和柔性中空支撑结构的柔性显示器。柔性显示面板具有彼此相对的第一端和第二端。柔性中空支撑结构与柔性显示面板一体化并从柔性显示面板的第一端延伸到第二端。此外，可以将支撑介质输入到柔性中空支撑结构中，以便拉伸和支撑柔性显示面板。

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