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1. 发明授权

US06767818B1 Method for forming electrically conductive bumps and devices formed 失效
标题翻译：形成导电凸块和器件的方法
公开(公告)号：US06767818B1
公开(公告)日：2004-07-27
申请号：US09634556
申请日：2000-08-07
申请人： Shyh-Ming Chang , Tai-Hong Chen , Yu-Te Hsieh , Chun-Ming Huang , Jui Ming Ni , Ching-Yun Chang , Jwo-Huei Jou
发明人： Shyh-Ming Chang , Tai-Hong Chen , Yu-Te Hsieh , Chun-Ming Huang , Jui Ming Ni , Ching-Yun Chang , Jwo-Huei Jou
IPC分类号： H01L2144
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/05624 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684 , H01L2224/05124 , H01L2224/05147
摘要： A method for forming electrically conductive bumps on a semiconductor substrate, or a semiconductor wafer and devices formed by the method are disclosed. In the method, a wafer that has an active surface, a plurality of conductive elements formed on the active surface and a passivation layer insulating the plurality of conductive bumps from each other is first provided. A first metal layer is then sputter deposited on top of the plurality of conductive elements and the passivation layer, followed by stencil printing a plurality of bumps of an insulating material on top of each one of the plurality of conductive elements. The plurality of bumps may be heat treated to a temperature of at least 100° C. for a period of at least 10 minutes for stress relief. A second metal layer is then sputter deposited on top of the plurality of bumps and the first metal layer. The first and the second metal layers are then patterned by a photolithographic process and formed by a wet or dry etching process to remove metal layers in areas in-between the plurality of bumps.
摘要翻译：公开了一种在半导体衬底或半导体晶片上形成导电凸块的方法以及通过该方法形成的器件。在该方法中，首先提供具有活性表面的晶片，形成在有源表面上的多个导电元件和使多个导电凸块彼此绝缘的钝化层。然后将第一金属层溅射沉积在多个导电元件和钝化层的顶部上，随后在多个导电元件中的每一个的顶部上模版印刷绝缘材料的多个凸块。多个凸起可以被热处理至至少100℃的温度至少10分钟的时间以减轻应力。然后将第二金属层溅射沉积在多个凸起和第一金属层的顶部上。然后通过光刻工艺对第一和第二金属层进行构图，并通过湿式或干式蚀刻工艺形成，以去除多个凸块之间的区域中的金属层。

2. 发明授权

US06919642B2 Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed 失效
标题翻译：用于将IC芯片接合到形成有虚设凸块和非导电粘合剂和结构的基板的方法
公开(公告)号：US06919642B2
公开(公告)日：2005-07-19
申请号：US10190276
申请日：2002-07-05
申请人： Yu-Te Hsieh , Shyh-Ming Chang , Wen-Ti Lin
发明人： Yu-Te Hsieh , Shyh-Ming Chang , Wen-Ti Lin
IPC分类号： H01L21/56 , H05K1/02 , H05K3/30 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/27 , H01L21/563 , H01L24/29 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H05K1/0271 , H05K3/305 , H01L2224/13111 , H01L2924/00015 , H01L2924/00 , H01L2224/05599
摘要： An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.
摘要翻译：通过非导电粘合剂粘合在一起的IC芯片/基板组件和用于形成组件的方法。该组件由在有源表面上形成的凸块的IC芯片，具有形成在顶面上的接合焊盘的基板构成，其中IC芯片和基板中的至少一个具有形成在凸块之间或接合焊盘和设置在IC芯片和基板之间的非导电粘合剂，其与与焊盘电连通的凸块面对面地连接在一起。

3. 发明申请

US20050250303A1 Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive 失效
标题翻译：将IC芯片接合到具有虚拟凸块和非导电粘合剂的基板的方法
公开(公告)号：US20050250303A1
公开(公告)日：2005-11-10
申请号：US11183590
申请日：2005-07-18
申请人： Yu-Te Hsieh , Shyh-Ming Chang , Wen-Ti Lin
发明人： Yu-Te Hsieh , Shyh-Ming Chang , Wen-Ti Lin
IPC分类号： H01L21/56 , H05K1/02 , H05K3/30 , H01L21/50
CPC分类号： H01L24/27 , H01L21/563 , H01L24/29 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H05K1/0271 , H05K3/305 , H01L2224/13111 , H01L2924/00015 , H01L2924/00 , H01L2224/05599
摘要： An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.
摘要翻译：通过非导电粘合剂粘合在一起的IC芯片/基板组件和用于形成组件的方法。该组件由在有源表面上形成的凸块的IC芯片，具有形成在顶面上的接合焊盘的基板构成，其中IC芯片和基板中的至少一个具有形成在凸块之间或接合焊盘和设置在IC芯片和基板之间的非导电粘合剂，其与与焊盘电连通的凸块面对面地连接在一起。

4. 发明授权

US06605491B1 Method for bonding IC chips to substrates with non-conductive adhesive 失效
标题翻译：用非导电粘合剂将IC芯片接合到基板的方法
公开(公告)号：US06605491B1
公开(公告)日：2003-08-12
申请号：US10152468
申请日：2002-05-21
申请人： Yu-Te Hsieh , Shyh-Ming Chang , Wen-Ti Lin
发明人： Yu-Te Hsieh , Shyh-Ming Chang , Wen-Ti Lin
IPC分类号： H01L2144
CPC分类号： H01L24/29 , H01L21/563 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/29111 , H01L2224/2929 , H01L2224/29386 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H01L2924/05442 , H01L2924/00014 , H01L2924/00015 , H01L2924/0665 , H01L2924/00
摘要： A method for bonding an IC chip by a non-conductive adhesive that contains between about 5 weight % and about 25 weight % of a non-conductive filler is described. The filler particles in the filler material must have a hardness that is higher, and preferably at least two times higher, than the metal material forming the bump. Moreover, the filler particles must be non-electrically conductive such that electrical shorts between a plurality of bumps on the IC chip do not occur. The concentration of the filler in the adhesive must be high enough so as to reduce the CTE of the adhesive to match that of the IC chip and the substrate, and low enough so as not to impede the electrical communication between the bumps on the IC chip and the bond pads on the substrate.
摘要翻译：描述了通过非导电粘合剂粘合IC芯片的方法，其包含约5重量％至约25重量％的非导电填料。填充材料中的填料颗粒必须具有比形成凸块的金属材料高的硬度，优选至少两倍的硬度。此外，填料颗粒必须是非导电的，使得不会发生IC芯片上的多个凸点之间的电短路。填料在粘合剂中的浓度必须足够高，以便减少粘合剂的CTE与IC芯片和基材的CTE相匹配，并且足够低，以免阻碍IC芯片上的凸块之间的电连通和衬底上的接合焊盘。

5. 发明授权

US07300865B2 Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive 失效
标题翻译：将IC芯片接合到具有虚拟凸块和非导电粘合剂的基板的方法
公开(公告)号：US07300865B2
公开(公告)日：2007-11-27
申请号：US11183590
申请日：2005-07-18
申请人： Yu-Te Hsieh , Shyh-Ming Chang , Wen-Ti Lin
发明人： Yu-Te Hsieh , Shyh-Ming Chang , Wen-Ti Lin
IPC分类号： H01L24/4763 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/27 , H01L21/563 , H01L24/29 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/3511 , H05K1/0271 , H05K3/305 , H01L2224/13111 , H01L2924/00015 , H01L2924/00 , H01L2224/05599
摘要： An IC chip/substrate assembly bonded together by a non-conductive adhesive and a method for forming the assembly. The assembly consists of an IC chip that has bumps formed on an active surface, a substrate that has bond pads formed on a top surface, wherein at least one of the IC chip and the substrate has dummy bumps formed in-between the bumps or the bond pads, and a non-conductive adhesive disposed in between and bonding the IC chip and the substrate together in a face-to-face relationship with the bumps in electrical communication with the bond pads.
摘要翻译：通过非导电粘合剂粘合在一起的IC芯片/基板组件和用于形成组件的方法。该组件由在有源表面上形成的凸块的IC芯片，具有形成在顶面上的接合焊盘的基板构成，其中IC芯片和基板中的至少一个具有形成在凸块之间或接合焊盘和设置在IC芯片和基板之间的非导电粘合剂，其与与焊盘电连通的凸块面对面地连接在一起。

6. 发明申请

US20110096219A1 IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：图像传感器封装及其制造方法
公开(公告)号：US20110096219A1
公开(公告)日：2011-04-28
申请号：US12795837
申请日：2010-06-08
申请人： Pen-Jung Lee , Yu-Te Hsieh , Chiung-Kun Chuang , Ling-Ta Su , Ming-Chieh Lin
发明人： Pen-Jung Lee , Yu-Te Hsieh , Chiung-Kun Chuang , Ling-Ta Su , Ming-Chieh Lin
IPC分类号： H04N5/335 , H01L31/18
CPC分类号： H01L31/0203 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L31/02325 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48227 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An image sensor package includes a substrate, an image sensor chip, a plurality of metal wires and an encapsulant. The substrate has an upper face, a lower face and a plurality of connecting pads arranged on the upper face. The image sensor chip has an active surface, a back surface opposite to the active surface and a plurality of bonding pads arranged on the active surface. The metal wires electrically connect the bonding pads of the image sensor chip to the connecting pads of the substrate. The transparent cover is arranged above the image sensor chip. A gap is formed between the transparent cover and the image sensor chip. The encapsulant is disposed around the transparent cover and the metal wires, and is used for sealing the metal wires and fixing the transparent cover above the image sensor chip.
摘要翻译：图像传感器封装包括基板，图像传感器芯片，多个金属线和密封剂。基板具有上表面，下表面和布置在上表面上的多个连接焊盘。图像传感器芯片具有活性表面，与活性表面相对的后表面和布置在活性表面上的多个接合焊盘。金属线将图像传感器芯片的接合焊盘电连接到衬底的连接焊盘。透明盖布置在图像传感器芯片的上方。在透明盖和图像传感器芯片之间形成间隙。密封剂设置在透明盖和金属丝周围，用于密封金属线并将透明盖固定在图像传感器芯片上方。

7. 发明申请

US20080106396A1 SIGNAL LIGHT FOR VEHICLE SIDE-VIEW MIRROR 审中-公开
标题翻译：车辆侧视镜的信号灯
公开(公告)号：US20080106396A1
公开(公告)日：2008-05-08
申请号：US11927133
申请日：2007-10-29
申请人： Yu-Te Hsieh
发明人： Yu-Te Hsieh
IPC分类号： B60Q1/34
CPC分类号： B60Q1/2665 , B60R1/1207 , G02B6/001 , G02B6/0038
摘要： A vehicle signal light includes a housing, a light-guiding unit, a light-emitting unit, and a light shield. The housing has a rear wall and a transparent front wall. The light-guiding unit is mounted in the housing, and includes a light-transmitting member and a refractive member. The light-transmitting member has front, rear, and first and second side surfaces. The refractive member includes first protrusions formed on the rear surface. The light-transmitting member and the refractive member are made of a light-transmissive material. The light-emitting unit is disposed proximate to the first and second side surfaces of the light-transmitting member, and emits light into the light-transmitting member. The light shield is disposed adjacent to the rear surface and reflects light emitted thereon toward the housing front wall.
摘要翻译：车辆信号灯包括壳体，导光单元，发光单元和遮光罩。外壳有一个后壁和一个透明的前壁。导光单元安装在壳体中，并且包括透光构件和折射构件。透光构件具有前，后，以及第一和第二侧表面。折射构件包括形成在后表面上的第一突起。透光构件和折射构件由透光材料制成。发光单元设置在靠近透光构件的第一和第二侧表面处，并将光发射到透光构件中。遮光板邻近后表面设置，并将其上的光向壳体前壁反射。

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