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1. 发明申请

US20100285723A1 POLISHING APPARATUS 有权
标题翻译：抛光装置
公开(公告)号：US20100285723A1
公开(公告)日：2010-11-11
申请号：US12437315
申请日：2009-05-07
申请人： Yu-Liang Lin , Chien Ling Hwang , Jean Wang , Chen-Hua Yu
发明人： Yu-Liang Lin , Chien Ling Hwang , Jean Wang , Chen-Hua Yu
IPC分类号： B24B49/16 , B24B7/22 , B24B49/08 , B24B53/02 , B24B57/02
CPC分类号： B24B57/02 , B24B37/107 , B24B53/017 , H01L21/02052
摘要： A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad operable to contact the wafer while the polishing pad is rotating, and a slurry coating system providing a slurry to the polishing pad for polishing the wafer.
摘要翻译：提供了一种用于处理晶片的化学机械抛光（CMP）装置，其包括用于以面朝上的方向支撑待加工的晶片的板，与该板相对的抛光头，其中抛光头包括可旋转的抛光垫，在抛光垫旋转的同时接触晶片;以及浆料涂覆系统，其向抛光垫提供浆料以抛光晶片。

2. 发明授权

US08133097B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US08133097B2
公开(公告)日：2012-03-13
申请号：US12437315
申请日：2009-05-07
申请人： Yu-Liang Lin , Chien Ling Hwang , Jean Wang , Chen-Hua Yu
发明人： Yu-Liang Lin , Chien Ling Hwang , Jean Wang , Chen-Hua Yu
IPC分类号： B24B7/22 , B24B57/02
CPC分类号： B24B57/02 , B24B37/107 , B24B53/017 , H01L21/02052
摘要： A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad operable to contact the wafer while the polishing pad is rotating, and a slurry coating system providing a slurry to the polishing pad for polishing the wafer.
摘要翻译：提供了一种用于处理晶片的化学机械抛光（CMP）装置，其包括用于以面朝上的方向支撑待加工的晶片的板，与该板相对的抛光头，其中抛光头包括可旋转的抛光垫，在抛光垫旋转的同时接触晶片;以及浆料涂覆系统，其向抛光垫提供浆料以抛光晶片。

3. 发明申请

US20090317214A1 NOVEL WAFER'S AMBIANCE CONTROL 有权
标题翻译：新浪潮的安全控制
公开(公告)号：US20090317214A1
公开(公告)日：2009-12-24
申请号：US12435861
申请日：2009-05-05
申请人： Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Ming-che Ho , Chien-Ling Hwang , Jui-Pin Hung
发明人： Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Ming-che Ho , Chien-Ling Hwang , Jui-Pin Hung
IPC分类号： H01L21/00 , H01L21/677 , H01L21/67 , B65D81/26 , F25B29/00
CPC分类号： H01L21/67772 , H01L21/67017 , Y10S414/135
摘要： A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.
摘要翻译：公开了一种半导体制造系统，接口系统，载体和用于提供环境受控环境的方法。半导体制造系统包括多个处理室; 至少一个接口系统，其中所述接口系统包括第一环境控制元件; 至少一个载体，其中载体包括第二环境控制元件; 以及耦合到所述多个处理室，所述至少一个接口系统和所述至少一个载体的控制模块。

4. 发明授权

US08827695B2 Wafer's ambiance control 有权
标题翻译：晶圆的氛围控制
公开(公告)号：US08827695B2
公开(公告)日：2014-09-09
申请号：US12435861
申请日：2009-05-05
申请人： Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Ming-che Ho , Chien-Ling Hwang , Jui-Pin Hung
发明人： Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Ming-che Ho , Chien-Ling Hwang , Jui-Pin Hung
IPC分类号： F27D15/00 , H01L21/677 , H01L21/67
CPC分类号： H01L21/67772 , H01L21/67017 , Y10S414/135
摘要： A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.
摘要翻译：公开了一种半导体制造系统，接口系统，载体和用于提供环境受控环境的方法。半导体制造系统包括多个处理室; 至少一个接口系统，其中所述接口系统包括第一环境控制元件; 至少一个载体，其中载体包括第二环境控制元件; 以及耦合到所述多个处理室，所述至少一个接口系统和所述至少一个载体的控制模块。

5. 发明申请

US20070032180A1 Slurry residence time enhancement system 审中-公开
标题翻译：泥浆停留时间增强系统
公开(公告)号：US20070032180A1
公开(公告)日：2007-02-08
申请号：US11199607
申请日：2005-08-08
申请人： Chien Hwang , Yu-Liang Lin , Chia-Ming Yang , Cheng Chan , Jean Wang , Chen-Hua Yu
发明人： Chien Hwang , Yu-Liang Lin , Chia-Ming Yang , Cheng Chan , Jean Wang , Chen-Hua Yu
IPC分类号： B24B29/00
CPC分类号： B24B57/02 , B24B37/04
摘要： A slurry residence time enhancement system for a chemical mechanical polishing apparatus having a base, a platen on the base, a polishing pad on the platen and a polishing head over the polishing pad is disclosed. The system includes at least one slurry distribution unit having a slurry distribution member for positioning on the polishing pad. In operation of the CMP apparatus, the slurry distribution member redirects polishing slurry on the polishing pad to the polishing head. The system may alternatively or additionally include a rim for upward extension from the base and a seal for insertion between the platen and the polishing pad adjacent to the rim.
摘要翻译：公开了一种用于化学机械抛光设备的浆料停留时间增强系统，其具有底座，底座上的压板，压板上的抛光垫和抛光垫上的抛光头。该系统包括至少一个浆料分配单元，其具有用于定位在抛光垫上的浆料分配构件。在CMP装置的操作中，浆料分配构件将抛光垫上的抛光浆料重新定向到抛光头。系统可以可选地或另外地包括用于从基座向上延伸的边缘和用于插入在压板和与边缘相邻的抛光垫之间的密封件。

6. 发明授权

US08109407B2 Apparatus for storing substrates 有权
标题翻译：用于存储基板的装置
公开(公告)号：US08109407B2
公开(公告)日：2012-02-07
申请号：US11755508
申请日：2007-05-30
申请人： Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Jui-Pin Hung , Ming-Shih Yeh
发明人： Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Jui-Pin Hung , Ming-Shih Yeh
IPC分类号： B65D45/28 , B65D53/06
CPC分类号： H01L21/67373 , H01L21/67376 , H01L21/67389
摘要： An apparatus includes an enclosure and a door configured to seal the enclosure. The door includes a plate. A rotational apparatus is disposed over the plate. At least one first member with a first arm extends from a first rib of the first member. At least one second member with a second arm extends from a second rib of the second member. The first and second arms are connected to the rotational apparatus. At least one corner member has a first edge. The first edge has a shape corresponding to a shape of a corner of the frame. The corner member is connected to a first end of the third arm. A second end of the third arm is connected to the rotational apparatus. A sealing material is disposed along a first longitudinal side of the first rib and a second longitudinal side of the second rib.
摘要翻译：一种装置包括外壳和构造成密封外壳的门。门包括一个板。旋转装置设置在板上。具有第一臂的至少一个第一构件从第一构件的第一肋延伸。具有第二臂的至少一个第二构件从第二构件的第二肋延伸。第一和第二臂连接到旋转装置。至少一个角部件具有第一边缘。第一边缘具有与框架的角部的形状对应的形状。角部件连接到第三臂的第一端。第三臂的第二端连接到旋转装置。密封材料沿着第一肋的第一纵向侧面和第二肋的第二纵向侧面设置。

7. 发明申请

US20080298933A1 SUBSTRATE CARRIER, PORT APPARATUS AND FACILITY INTERFACE AND APPARATUS INCLUDING SAME 有权
标题翻译：底板承载器，端口装置和设备接口以及包括其中的设备
公开(公告)号：US20080298933A1
公开(公告)日：2008-12-04
申请号：US11754789
申请日：2007-05-29
申请人： Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Fu-Kang Tien , Jui-Pin Hung
发明人： Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Fu-Kang Tien , Jui-Pin Hung
IPC分类号： H01L21/00
CPC分类号： H01L21/67017 , H01L21/67393 , H01L21/67772
摘要： An apparatus includes a first enclosure, a first door, at least one first valve, at least one inlet diffuser and at least one substrate holder. The first enclosure has a first opening. The first door is configured to seal the first opening. The first valve is coupled to the first enclosure. The inlet diffuser is coupled to the first valve and configured to provide a first gas with a temperature substantially higher than a temperature of an environment around the first enclosure. Each substrate holder disposed within the first enclosure supports at least one substrate.
摘要翻译：一种装置包括第一外壳，第一门，至少一个第一阀，至少一个入口扩散器和至少一个基板支架。第一个外壳具有第一个开口。第一个门被配置为密封第一个开口。第一阀联接到第一外壳。入口扩散器联接到第一阀并且被配置为提供具有基本上高于围绕第一外壳的环境的温度的温度的第一气体。设置在第一外壳内的每个衬底保持器支撑至少一个衬底。

8. 发明申请

US20080121526A1 ADJUSTABLE ANODE ASSEMBLY FOR A SUBSTRATE WET PROCESSING APPARATUS 有权
标题翻译：可调式阳极装置用于基板湿处理装置
公开(公告)号：US20080121526A1
公开(公告)日：2008-05-29
申请号：US11563515
申请日：2006-11-27
申请人： Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Lawrance Sheu
发明人： Yi-Li Hsiao , Chen-Hua Yu , Jean Wang , Lawrance Sheu
IPC分类号： C25D5/04 , C25D17/10 , C25D17/00
CPC分类号： C25D17/12 , C25D7/123 , C25D17/001
摘要： An adjustable anode assembly for a wet processing apparatus to allow selective tuning of the electrical field density distribution within a wet process chemical of the apparatus, which in turn allows the process specification or specifications to be selectively varied across the process surface of a wafer when processed by the apparatus. The adjustable anode assembly includes an anode which may be divided into several plates, at least one of which is capable of being moved from a first plane to at least a second plane.
摘要翻译：一种用于湿处理设备的可调节阳极组件，用于允许选择性地调节设备的湿法化学品中的电场密度分布，这又允许在处理过程中跨过晶片的工艺表面选择性地改变工艺规格或规格通过该装置。可调节阳极组件包括阳极，该阳极可分为多个板，其中至少一个能够从第一平面移动到至少第二平面。

9. 发明申请

US20070068803A1 PVD TARGET WITH END OF SERVICE LIFE DETECTION CAPABILITY 有权
标题翻译： PVD目标终止服务生命检测能力
公开(公告)号：US20070068803A1
公开(公告)日：2007-03-29
申请号：US11427602
申请日：2006-06-29
申请人： Yi-Li Hsiao , Jerry Hwang , Jyh-Cherng Sheu , Lawrance Sheu , Jean Wang , Chen-Hua Yu
发明人： Yi-Li Hsiao , Jerry Hwang , Jyh-Cherng Sheu , Lawrance Sheu , Jean Wang , Chen-Hua Yu
IPC分类号： C23C14/00
CPC分类号： C23C14/54 , C23C14/3407 , C23C14/3414 , H01J37/3435 , H01J37/3479 , H01J37/3482
摘要： A PVD target structure for use in physical vapor deposition. The PVD target structure includes a consumable slab of source material and one or more detectors for indicating when the slab of source material is approaching or has been reduced to a given quantity representing a service lifetime endpoint of the target structure.
摘要翻译：用于物理气相沉积的PVD靶结构。 PVD目标结构包括源材料的可消耗板和一个或多个检测器，用于指示源材料的板块何时接近或已经被减少到表示目标结构的使用寿命终点的给定量。

10. 发明授权

US09177843B2 Preventing contamination in integrated circuit manufacturing lines 有权
标题翻译：防止集成电路生产线上的污染
公开(公告)号：US09177843B2
公开(公告)日：2015-11-03
申请号：US11771734
申请日：2007-06-29
申请人： Chien-Ming Sung , Simon Wang , Jia-Ren Chen , Henry Lo , Chen-Hua Yu , Jean Wang , Kewei Zuo
发明人： Chien-Ming Sung , Simon Wang , Jia-Ren Chen , Henry Lo , Chen-Hua Yu , Jean Wang , Kewei Zuo
IPC分类号： H01L21/677 , H01L21/673 , H01L21/67
CPC分类号： H01L21/67393 , H01L21/67017 , H01L21/67161 , H01L21/67703 , Y10S414/139
摘要： A semiconductor manufacturing line includes an inert environment selected from the group consisting essentially of an inert airtight wafer holder, an inert wafer transport channel, an inert production tool, an inert clean room, and combinations thereof.
摘要翻译：半导体生产线包括从基本上由惰性气密晶片保持器，惰性晶片输送通道，惰性生产工具，惰性洁净室及其组合组成的组中选择的惰性环境。

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