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    • 1. 发明申请
    • APPARATUS AND METHOD FOR MEASURING SEMICONDUCTOR DEVICE
    • 测量半导体器件的装置和方法
    • US20100219340A1
    • 2010-09-02
    • US12713261
    • 2010-02-26
    • Young-Seok KIMJong-Sun PEAKYoung-Nam KIMHyung-Suk CHOSun-Jin KANGBu-Dl YOO
    • Young-Seok KIMJong-Sun PEAKYoung-Nam KIMHyung-Suk CHOSun-Jin KANGBu-Dl YOO
    • G01N23/20
    • H01L22/20H01L22/12
    • An apparatus for measuring a semiconductor device is provided. The apparatus includes a beam emitter configured to irradiate an electron beam onto a sample having the entire region composed of a critical dimension (CD) region, which is formed by etching or development, and a normal region connected to the CD region, and an analyzer electrically connected to the beam emitter, and configured to select and set a wavelength range of a region in which a difference in reflectance between the CD region and the normal region occurs, after obtaining reflectance from the electron beam reflected by a surface of the sample according to the wavelength of the electron beam. A method of measuring a semiconductor device using the measuring apparatus is also provided. Therefore, it is possible to minimize a change in reflectance due to the thickness and properties of the semiconductor device, and set a wavelength range to monitor a specific wavelength, thereby accurately measuring and analyzing a CD value of a measurement part of the semiconductor device.
    • 提供了一种用于测量半导体器件的设备。 该装置包括:射束发射器,被配置为将电子束照射到具有通过蚀刻或显影形成的临界尺寸(CD)区域和连接到CD区域的法线区域构成的整个区域的样品上;以及分析器 电连接到射束发射器,并且被配置为在从由样品表面反射的电子束获得反射率之后,选择和设置发生CD区域和法线区域之间的反射率差的区域的波长范围, 到电子束的波长。 还提供了使用测量装置测量半导体器件的方法。 因此,可以使半导体器件的厚度和特性的反射率变化最小化,并且设定波长范围来监视特定波长,从而精确地测量和分析半导体器件的测量部分的CD值。
    • 2. 发明申请
    • CAMERA MODULE
    • 相机模块
    • US20070241273A1
    • 2007-10-18
    • US11457766
    • 2006-07-14
    • Young-Seok KIMHyeok-Hwan KWONHyun-Kyu CHOIHwan-Chul LEE
    • Young-Seok KIMHyeok-Hwan KWONHyun-Kyu CHOIHwan-Chul LEE
    • H01J5/02
    • H01L27/14636H01L27/14621H01L27/14625H01L27/14634H01L2224/05548H01L2224/05568H01L2224/05573H01L2224/056H01L2224/16225H01L2224/48091H04N5/2253H04N5/2254H04N5/2257H01L2924/00014
    • The present invention relates to a camera module, which comprises a packaged image sensor, an IR filter, a lens and a holder for holding these components and has a reduced overall size and height. A camera module according to the present invention comprises an image sensor package having a translucent substrate formed thereon; and a holder having a lower end attached to the translucent substrate of the image sensor package. At this time, the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the connecting portion is formed with an inner stepped portion so as to be attached to a peripheral portion of a top surface and a lateral surface of the translucent substrate. Alternatively, the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the horizontal portion is formed to be flat such that it is attached to a peripheral portion of a top surface of the translucent substrate. Otherwise, the holder comprises a horizontal portion formed with a through-hole, and a bottom surface of the horizontal portion is attached to at least a peripheral portion of a top surface of the translucent substrate.
    • 本发明涉及一种照相机模块,其包括封装的图像传感器,IR滤光器,透镜和用于保持这些部件的保持器,并且具有减小的总体尺寸和高度。 根据本发明的相机模块包括其上形成有透光性基板的图像传感器封装; 以及具有附接到图像传感器封装的透光性基板的下端的保持器。 此时,保持器包括形成有通孔的水平部分和从水平部分的边缘向下延伸的连接部分,并且连接部分的下端的端表面形成有内部台阶部分 以便附着到透光性基板的上表面和侧面的周边部。 或者,保持器包括形成有通孔的水平部分和从水平部分的边缘向下延伸的连接部分,并且水平部分的下端的端表面形成为平坦的,使得其被附接 到透光性基板的顶面的周边部。 否则,保持器包括形成有通孔的水平部分,并且水平部分的底表面附接到透光性基板的顶表面的至少周边部分。
    • 3. 发明申请
    • APPARATUS AND METHOD FOR AMPLIFYING POWER IN MOBILE TERMINAL
    • 移动终端放大功率的装置和方法
    • US20110294540A1
    • 2011-12-01
    • US13150523
    • 2011-06-01
    • Young-Seok KIM
    • Young-Seok KIM
    • H04W88/06H03F3/68
    • H03F3/24H03F1/56H03F3/189H03F2200/387
    • A transmission apparatus and a method thereof in a mobile terminal are provided. More particularly, an apparatus and a method for securing a space of a mobile terminal and reducing manufacturing costs by integrating power amplifying units into one module in the mobile terminal that supports a multi-mode are provided. The power amplifier of a mobile terminal includes a first amplifying unit and a second amplifying unit. The first amplifying unit defines a frequency of a GSM quad band as a low frequency band and a high frequency band, and then amplifies a signal of the low frequency band of the GSM quad band. The second amplifying unit amplifies a signal of the high frequency band of the GSM quad band and a signal of a TD-SCDMA band.
    • 提供了一种移动终端中的发送装置及其方法。 更具体地,提供了一种用于通过将功率放大单元集成到支持多模式的移动终端中的一个模块中来确保移动终端的空间并降低制造成本的装置和方法。 移动终端的功率放大器包括第一放大单元和第二放大单元。 第一放大单元将GSM四频带的频率定义为低频带和高频带,然后放大GSM四频带的低频带的信号。 第二放大单元放大GSM四频带的高频信号和TD-SCDMA频带的信号。
    • 6. 发明申请
    • APPARATUS, UNIT AND METHOD FOR TESTING IMAGE SENSOR PACKAGES
    • 装置,单元和测试图像传感器包的方法
    • US20080224721A1
    • 2008-09-18
    • US12127665
    • 2008-05-27
    • Young-Seok KIMHwan-Chul LEEJae-Cheol JU
    • Young-Seok KIMHwan-Chul LEEJae-Cheol JU
    • G01R31/26
    • H01L27/14618H01L2224/05548H01L2224/05568H01L2224/05573H01L2224/056H01L2224/16H01L2924/01077H01L2924/15311H01L2924/1532H01L2924/16195H01L2924/00014
    • The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages. A method for testing image sensor packages according to the present invention comprises the steps of connecting the image sensor packages to a tester module for performing tests for checking whether the image sensor packages are defective; and carrying out an open and short test and an image test for the image sensor packages while irradiating light on the image sensor packages through a lens or blocking the light.
    • 本发明涉及一种用于测试图像传感器封装的装置,单元和方法,其可以在组装成相机模块之前自动测试图像传感器封装是否有缺陷。 根据本发明的用于测试图像传感器封装的装置包括:座位单元,图像传感器封装件用于测试; 测试部分,具有在图像传感器封装之上的透镜和光源,以执行图像传感器封装的开放和短时测试和图像测试; 以及控制和处理单元,其具有用于执行图像传感器封装的开放和短期测试和图像测试的测试器模块。 根据本发明的用于测试图像传感器封装的方法包括以下步骤:将图像传感器封装连接到测试器模块,用于执行检查图像传感器封装是否有缺陷的测试; 并且通过透镜对图像传感器封装进行照射光或遮光时对图像传感器封装进行开放和短暂的测试和图像测试。
    • 7. 发明申请
    • APPARATUS, UNIT AND METHOD FOR TESTING IMAGE SENSOR PACKAGES
    • 装置,单元和测试图像传感器包的方法
    • US20070131881A1
    • 2007-06-14
    • US11457771
    • 2006-07-14
    • Young-Seok KIMHwan-Chul LEEJae-Cheol JU
    • Young-Seok KIMHwan-Chul LEEJae-Cheol JU
    • G01N21/88
    • H01L27/14618H01L2224/05548H01L2224/05568H01L2224/05573H01L2224/056H01L2224/16H01L2924/01077H01L2924/15311H01L2924/1532H01L2924/16195H01L2924/00014
    • The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages. A method for testing image sensor packages according to the present invention comprises the steps of connecting the image sensor packages to a tester module for performing tests for checking whether the image sensor packages are defective; and carrying out an open and short test and an image test for the image sensor packages while irradiating light on the image sensor packages through a lens or blocking the light.
    • 本发明涉及一种用于测试图像传感器封装的装置,单元和方法,其可以在组装成相机模块之前自动测试图像传感器封装是否有缺陷。 根据本发明的用于测试图像传感器封装的装置包括:座位单元,图像传感器封装件用于测试; 测试部分,具有在图像传感器封装之上的透镜和光源,以执行图像传感器封装的开放和短时测试和图像测试; 以及控制和处理单元,其具有用于执行图像传感器封装的开放和短期测试和图像测试的测试器模块。 根据本发明的用于测试图像传感器封装的方法包括以下步骤:将图像传感器封装连接到测试器模块,用于执行检查图像传感器封装是否有缺陷的测试; 并且通过透镜对图像传感器封装进行照射光或遮光时对图像传感器封装进行开放和短暂的测试和图像测试。