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    • 9. 发明授权
    • Electromechanical memory devices and methods of manufacturing the same
    • 机电存储器件及其制造方法
    • US07947558B2
    • 2011-05-24
    • US12720276
    • 2010-03-09
    • Eunjung YunSung-Young LeeDong-Won Kim
    • Eunjung YunSung-Young LeeDong-Won Kim
    • H01L21/336
    • H01L27/10H01L2924/0002H01L2924/00
    • In a memory device and a method of forming the same, in one embodiment, the memory device comprises a first word line structure on a substrate, the first word line structure extending in a first direction. A bit line is provided over the first word line structure and spaced apart from the first word line by a first gap, the bit line extending in a second direction transverse to the first direction. A second word line structure is provided over the bit line and spaced apart from the bit line by a second gap, the second word line structure extending in the first direction. The bit line is suspended between the first word line structure and the second word line structure such that the bit line deflects to be electrically coupled with a top portion of the first word line structure through the first gap in a first bent position and deflects to be electrically coupled with a bottom portion of the second word line structure through the second gap in a second bent position, and is isolated from the first word line structure and the second word line structure in a rest position.
    • 在一种存储器件及其形成方法中,在一个实施例中,存储器件包括在衬底上的第一字线结构,第一字线结构沿第一方向延伸。 位线设置在第一字线结构之上并且与第一字线间隔开第一间隙,位线沿横向于第一方向的第二方向延伸。 第二字线结构设置在位线上并与位线间隔第二间隙,第二字线结构沿第一方向延伸。 位线悬挂在第一字线结构和第二字线结构之间,使得位线在第一弯曲位置通过第一间隙偏转以与第一字线结构的顶部电耦合,并且偏转为 在第二弯曲位置通过第二间隙与第二字线结构的底部电耦合,并且在静止位置与第一字线结构和第二字线结构隔离。
    • 10. 发明申请
    • Gate-all-around type semiconductor device and method of manufacturing the same
    • 栅极全周型半导体器件及其制造方法
    • US20100314604A1
    • 2010-12-16
    • US12805776
    • 2010-08-19
    • Sung-Dae SukDong-Won KimKyoung-Hwan Yeo
    • Sung-Dae SukDong-Won KimKyoung-Hwan Yeo
    • H01L29/775
    • H01L29/78696B82Y10/00H01L29/0665H01L29/0673H01L29/42392
    • The gate-all-around (GAA) type semiconductor device may include source/drain layers, a nanowire channel, a gate electrode and an insulation layer pattern. The source/drain layers may be disposed at a distance in a first direction on a semiconductor substrate. The nanowire channel may connect the source/drain layers. The gate electrode may extend in a second direction substantially perpendicular to the first direction. The gate electrode may have a height in a third direction substantially perpendicular to the first and second directions and may partially surround the nanowire channel. The insulation layer pattern may be formed between and around the source/drain layers on the semiconductor substrate and may cover the nanowire channel and a portion of the gate electrode. Thus, a size of the gate electrode may be reduced, and/or a gate induced drain leakage (GIDL) and/or a gate leakage current may be reduced.
    • 栅极全能(GAA)型半导体器件可以包括源极/漏极层,纳米线沟道,栅电极和绝缘层图案。 源极/漏极层可以在半导体衬底上沿第一方向设置一定距离。 纳米线通道可以连接源极/漏极层。 栅电极可以在基本上垂直于第一方向的第二方向上延伸。 栅电极可以具有基本上垂直于第一和第二方向的第三方向的高度,并且可以部分地包围纳米线通道。 绝缘层图案可以形成在半导体衬底上的源极/漏极层之间和周围,并且可以覆盖纳米线沟道和栅电极的一部分。 因此,可以减小栅电极的尺寸,和/或栅极感应漏极泄漏(GIDL)和/或栅极泄漏电流可能降低。