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    • 3. 发明授权
    • On-die parametric test modules for in-line monitoring of context dependent effects
    • 片上参数测试模块,用于在线监控上下文相关效应
    • US08664968B2
    • 2014-03-04
    • US12890146
    • 2010-09-24
    • Gregory Charles BaldwinThomas J. AtonKayvan SadraOluwamuyiwa Oluwagbemiga OlubuyideYoun Sung Choi
    • Gregory Charles BaldwinThomas J. AtonKayvan SadraOluwamuyiwa Oluwagbemiga OlubuyideYoun Sung Choi
    • G01R31/3187
    • G01R31/2831
    • An integrated circuit (IC) die has an on-die parametric test module. A semiconductor substrate has die area, and a functional IC formed on an IC portion of the die area including a plurality of circuit elements configured for performing a circuit function. The on-die parametric test module is formed on the semiconductor substrate in a portion of the die area different from the IC portion. The on-die parametric test module includes a reference layout that provides at least one active reference MOS transistor, wherein the active reference MOS transistor has a reference spacing value for each of a plurality of context dependent effect parameters. A plurality of different variant layouts are included on the on-die parametric test module. Each variant layout provides at least one active variant MOS transistor that provides a variation with respect to the reference spacing value for at least one of the context dependent effect parameters.
    • 集成电路(IC)管芯具有管芯上的参数测试模块。 半导体衬底具有管芯区域,以及形成在管芯区域的IC部分上的功能IC,包括被配置为执行电路功能的多个电路元件。 在与IC部分不同的管芯区域的一部分中,在半导体衬底上形成管芯上参数测试模块。 片上参数测试模块包括提供至少一个有源参考MOS晶体管的参考布局,其中有源参考MOS晶体管具有针对多个上下文相关效应参数中的每一个的参考间隔值。 在片上参数测试模块上包括多个不同的变体布局。 每个变体布局提供至少一个有源变体MOS晶体管,其针对上下文相关效应参数中的至少一个提供关于参考间隔值的变化。
    • 5. 发明授权
    • Integrated circuit having silicide block resistor
    • 具有硅化物阻抗电阻的集成电路
    • US08748256B2
    • 2014-06-10
    • US13366903
    • 2012-02-06
    • Song ZhaoGregory Charles BaldwinShashank S. EkboteYoun Sung Choi
    • Song ZhaoGregory Charles BaldwinShashank S. EkboteYoun Sung Choi
    • H01L27/088
    • H01L27/0629
    • A method for forming an integrated circuit (IC) including a silicide block poly resistor (SIBLK poly resistor) includes forming a dielectric isolation region in a top semiconductor surface of a substrate. A polysilicon layer is formed including patterned resistor polysilicon on the dielectric isolation region and gate polysilicon on the top semiconductor surface. Implanting is performed using a first shared metal-oxide-semiconductor (MOS)/resistor polysilicon implant level for simultaneously implanting the patterned resistor polysilicon and gate polysilicon of a MOS transistor with at least a first dopant. Implanting is then performed using a second shared MOS/resistor polysilicon implant level for simultaneously implanting the patterned resistor polysilicon, gate polysilicon and source and drain regions of the MOS transistor with at least a second dopant. A metal silicide is formed on a first and second portion of a top surface of the patterned resistor polysilicon to form the SIBLK poly resistor.
    • 一种形成包括硅化物阻挡多晶硅电阻(SIBLK聚电阻)的集成电路(IC)的方法包括在衬底的顶部半导体表面中形成介电隔离区。 形成多晶硅层,其包括在电介质隔离区域上的图案化电阻多晶硅和顶部半导体表面上的栅极多晶硅。 使用第一共享金属氧化物半导体(MOS)/电阻器多晶硅注入电平进行植入,以同时用至少第一掺杂剂注入MOS图案化的多晶硅和栅极多晶硅。 然后使用第二共享MOS /电阻器多晶硅注入电平进行植入,以同时用至少第二掺杂剂注入MOS图案化电阻器多晶硅,栅极多晶硅以及MOS晶体管的源极和漏极区域。 金属硅化物形成在图案化电阻器多晶硅的顶表面的第一和第二部分上以形成SIBLK多晶硅电阻器。