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1. 发明授权

US07422982B2 Method and apparatus for electroprocessing a substrate with edge profile control 失效
标题翻译：用边缘轮廓控制对基底进行电处理的方法和装置
公开(公告)号：US07422982B2
公开(公告)日：2008-09-09
申请号：US11483843
申请日：2006-07-07
申请人： You Wang , Jie Diao , Stan D. Tsai , Lakshmanan Karuppiah
发明人： You Wang , Jie Diao , Stan D. Tsai , Lakshmanan Karuppiah
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： B23H5/08 , C25D17/10 , C25D17/12 , C25D21/12
摘要： A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially inward of the first electrode with a bias that is different than the bias applied to the first electrode. In one embodiment, the first electrode is coated with an inert material and in this way the same polish rate is obtained with a lower potential level applied to the first electrode.
摘要翻译：提供了一种用于电子处理衬底的方法和装置。在一个实施例中，用于对衬底进行电处理的方法包括以下步骤：偏置第一电极以在电极和衬底之间建立第一电处理区，并且以不同于第一电极的偏压来偏置设置在第一电极的径向内侧的第二电极施加到第一电极的偏压。在一个实施例中，第一电极被涂覆有惰性材料，并且以这种方式获得相同的抛光速率，并且施加到第一电极的较低电位电平。

2. 发明申请

US20070254485A1 ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：电化学机械抛光磨料组合物
公开(公告)号：US20070254485A1
公开(公告)日：2007-11-01
申请号：US11735801
申请日：2007-04-16
申请人： Daxin Mao , You Wang , Junzi Zhao , Stan D. Tsai , Renhe Jia , Jie Diao , Yongqi Hu , Lakshmanan Karuppiah
发明人： Daxin Mao , You Wang , Junzi Zhao , Stan D. Tsai , Renhe Jia , Jie Diao , Yongqi Hu , Lakshmanan Karuppiah
IPC分类号： H01L21/461 , H01L21/302 , C09K13/00
CPC分类号： H01L21/32125 , B23H5/08 , C09G1/02 , C09K3/1409 , C09K3/1463 , C25F3/02 , H01L21/7684
摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In certain embodiments, a composition for processing a substrate having a conductive material layer disposed thereon is provided wherein the composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, an amount of a pH adjusting agent sufficient to provide a pH between about 3 and about 10, anionic polymer abrasive particles, and a solvent. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
摘要翻译：提供了用于处理其上设置有导电材料层的基板的组合物和方法。在某些实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其中所述组合物包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，一定量的pH调节剂，提供约3至约10个的阴离子聚合物研磨剂颗粒和溶剂之间的pH。该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

3. 发明申请

US20070235344A1 Process for high copper removal rate with good planarization and surface finish 审中-公开
标题翻译：具有良好的平坦化和表面光洁度的高铜去除率的工艺
公开(公告)号：US20070235344A1
公开(公告)日：2007-10-11
申请号：US11399560
申请日：2006-04-06
申请人： Renhe Jia , You Wang , Gerald Alonzo , Yongqi Hu , Zhihong Wang , Jie Diao , Stan D Tsai , Alpay Yilmaz , Lakshmanan Karuppiah , Liang-Yuh Chen
发明人： Renhe Jia , You Wang , Gerald Alonzo , Yongqi Hu , Zhihong Wang , Jie Diao , Stan D Tsai , Alpay Yilmaz , Lakshmanan Karuppiah , Liang-Yuh Chen
IPC分类号： B23H5/08
CPC分类号： B23H5/08 , C25F3/02 , H01L21/32125
摘要： A method for electrochemical mechanical polishing (ECMP) is disclosed. The polishing rate and surface finish of the layer on the wafer are improved by controlling the surface speed of both the platen and head, controlling the current applied to the pad, and preselecting the density of the perforations on the fully conductive polishing pad. ECMP produces much higher removal rates, good surface finishes, and good planarization efficiency at a lower down force. Generally, increasing the surface speed of both the platen and the head will increase the surface smoothness. Also, increasing the current density on the wafer will increase the surface smoothness. There is virtually no difference in the smoothness of the wafer surface between the center, middle, and edge of the wafer. For copper, removal rates of 10,000 Å/min and greater can be achieved.
摘要翻译：公开了一种用于电化学机械抛光（ECMP）的方法。通过控制压板和头部的表面速度，控制施加到垫的电流以及预选在全导电抛光垫上的穿孔密度来提高晶片上层的抛光速率和表面光洁度。 ECMP在较低的下压力下产生高得多的去除率，良好的表面光洁度和良好的平面化效率。通常，增加压板和头部的表面速度将增加表面平滑度。此外，增加晶片上的电流密度将增加表面平滑度。在晶片的中心，中间和边缘之间的晶片表面的平滑度几乎没有差别。对于铜，可以实现10,000 / min以上的去除率。

4. 发明授权

US07504018B2 Electrochemical method for Ecmp polishing pad conditioning 失效
标题翻译： Ecmp抛光垫调理电化学方法
公开(公告)号：US07504018B2
公开(公告)日：2009-03-17
申请号：US11554928
申请日：2006-10-31
申请人： You Wang , Stan D. Tsai , Lakshmanan Karuppiah , Jie Diao , Renhe Jia , Alpay Yilmaz
发明人： You Wang , Stan D. Tsai , Lakshmanan Karuppiah , Jie Diao , Renhe Jia , Alpay Yilmaz
IPC分类号： C25F7/00 , C25F3/16
CPC分类号： B23H5/08 , B24B37/042 , B24B37/046 , B24B53/017 , C25F1/00 , H01L21/32125
摘要： A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
摘要翻译：提供了一种调节Ecmp垫的方法。在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在衬垫组件的顶表面和电极之间提供电偏置电压，以及电化学去除衬垫顶表面的污染物。

5. 发明授权

US07344432B2 Conductive pad with ion exchange membrane for electrochemical mechanical polishing 失效
标题翻译：带离子交换膜的导电垫用于电化学机械抛光
公开(公告)号：US07344432B2
公开(公告)日：2008-03-18
申请号：US11555145
申请日：2006-10-31
申请人： Liang-Yun Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid A. Mavliev , Stan D. Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
发明人： Liang-Yun Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid A. Mavliev , Stan D. Tsai , You Wang , Jie Diao , Renhe Jia , Lakshmanan Karuppiah , Robert Ewald
IPC分类号： B23H5/06 , B23H3/00 , B24D11/02 , C25F3/30 , B24B49/00 , H05K3/07
CPC分类号： B24B37/046 , B24B27/0023 , B24B37/24 , B24B37/26 , B24D3/34 , B82Y30/00
摘要： An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.
摘要翻译：提供了一种用于处理基板表面的制造和设备。在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括具有至少部分导电的抛光表面的主体的抛光制品。电极设置在其间具有介电材料的抛光表面下方。可以在抛光表面和电介质材料中形成多个孔，以至少部分地将电极暴露于抛光表面。可以在电极和抛光表面之间设置膜，其可透过离子和电流，以促进电极和抛光表面之间的连续性。

6. 发明申请

US20080014709A1 Method and apparatus for electroprocessing a substrate with edge profile control 失效
公开(公告)号：US20080014709A1
公开(公告)日：2008-01-17
申请号：US11483843
申请日：2006-07-07
申请人： You Wang , Jie Diao , Stan D. Tsai , Lakshmanan Karuppiah
发明人： You Wang , Jie Diao , Stan D. Tsai , Lakshmanan Karuppiah
IPC分类号： H01L21/76
CPC分类号： B23H5/08 , C25D17/10 , C25D17/12 , C25D21/12
摘要： A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially inward of the first electrode with a bias that is different than the bias applied to the first electrode. In one embodiment, the first electrode is coated with an inert material and in this way the same polish rate is obtained with a lower potential level applied to the first electrode.

7. 发明申请

US20070158207A1 Methods for electrochemical processing with pre-biased cells 审中-公开
标题翻译：使用预偏置电池进行电化学处理的方法
公开(公告)号：US20070158207A1
公开(公告)日：2007-07-12
申请号：US11326647
申请日：2006-01-06
申请人： Jie Diao , Renhe Jia , You Wang , Gerald Alonzo , Stan Tsai , Lakshmanan Karuppiah
发明人： Jie Diao , Renhe Jia , You Wang , Gerald Alonzo , Stan Tsai , Lakshmanan Karuppiah
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B24B53/017 , C25F1/00 , C25F3/02
摘要： A method for electrochemically processing a substrate is provided. In one embodiment, the method includes performing a conditioning procedure on a processing pad having a plurality of process cells, energizing the process cells by applying a voltage to the conditioned processing pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized process cells. In another embodiment, a method for polishing a substrate includes placing an unused conductive pad having a plurality of process cells on a platen of a processing system, breaking in the pad on the platen, energizing the process cells by applying a voltage to the broken-in pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized cells.
摘要翻译：提供了一种用于电化学处理衬底的方法。在一个实施例中，该方法包括在具有多个处理单元的处理垫上执行调节程序，通过向经调节的处理垫施加电压来激励处理单元，将其上布置有至少一个导电层的基板放置在通电并且在通电的处理单元中去除导电层的至少一部分。在另一个实施例中，用于抛光衬底的方法包括将具有多个处理单元的未使用的导电焊盘放置在处理系统的压板上，在压板上的焊盘中断开，在衬垫中，将具有至少其上设置有导电层的衬底放置在通电焊盘上，以及去除通电电池中的至少一部分导电层。

8. 发明申请

US20060249395A1 Process and composition for electrochemical mechanical polishing 审中-公开
标题翻译：电化学机械抛光的工艺和组成
公开(公告)号：US20060249395A1
公开(公告)日：2006-11-09
申请号：US11389867
申请日：2006-03-27
申请人： You Wang , Junzi Zhao , Jie Diao , Renhe Jia , Stan Tsai , Lakshmanan Karuppiah , Robert Ewald
发明人： You Wang , Junzi Zhao , Jie Diao , Renhe Jia , Stan Tsai , Lakshmanan Karuppiah , Robert Ewald
IPC分类号： C09K13/00 , B23H9/00 , B23H3/00
CPC分类号： C09K3/1463 , B23H5/08
摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a leveler a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
摘要翻译：提供了用于处理其上设置有导电材料层的基板的组合物和方法。在一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，整理剂，溶剂，并且pH在约3至约10之间。该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

9. 发明申请

US20080035474A1 APPARATUS FOR ELECTROPROCESSING A SUBSTRATE WITH EDGE PROFILE CONTROL 审中-公开
标题翻译：用于电镀具有边缘型材控制的基板的装置
公开(公告)号：US20080035474A1
公开(公告)日：2008-02-14
申请号：US11877356
申请日：2007-10-23
申请人： You Wang , Jie DIAO , Stan TSAI , Lakshmanan Karuppiah
发明人： You Wang , Jie DIAO , Stan TSAI , Lakshmanan Karuppiah
IPC分类号： C25B9/00
CPC分类号： B23H5/08 , C25D17/10 , C25D17/12 , C25D21/12
摘要： Embodiments of the invention generally provide methods and apparatuses for electroprocessing a substrate. In one embodiment, an apparatus for electrochemically processing the substrate includes a conductive processing surface adapted for processing a substrate thereon, and a polishing head for retaining the substrate against the processing surface. At least one drive mechanism provides relative motion between the conductive processing surface and the substrate. A first electrode is disposed below the conductive processing surface and is comprised of a first material. A second electrode is disposed radially inward of the first electrode and comprised of a second material.
摘要翻译：本发明的实施方案通常提供用于对基底进行电处理的方法和装置。在一个实施例中，用于电化学处理衬底的装置包括适于在其上处理衬底的导电处理表面和用于将衬底保持在处理表面上的抛光头。至少一个驱动机构在导电处理表面和基底之间提供相对运动。第一电极设置在导电处理表面下方并且由第一材料构成。第二电极设置在第一电极的径向内侧并由第二材料构成。

10. 发明申请

US20080020682A1 Method for conditioning a polishing pad 审中-公开
标题翻译：调整抛光垫的方法
公开(公告)号：US20080020682A1
公开(公告)日：2008-01-24
申请号：US11490883
申请日：2006-07-21
申请人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Jim Atkinson , Lakshmanan Karuppiah , Liang-Yuh Chen
发明人： Renhe Jia , Jie Diao , You Wang , Stan Tsai , Jim Atkinson , Lakshmanan Karuppiah , Liang-Yuh Chen
IPC分类号： B24B1/00
CPC分类号： B24B53/017
摘要： A method of conditioning processing pads increases the removal rate of conductive material from a substrate surface during polishing. In this method, the direction of rotation of the processing pad relative to the conditioning disc during conditioning is opposite the direction of rotation of the processing pad relative to the substrate during polishing.
摘要翻译：调整处理垫的方法在抛光期间增加导电材料从衬底表面的去除速率。在这种方法中，处理衬垫相对于调理盘在调节期间的旋转方向与抛光期间相对于衬底相对于处理垫的旋转方向。

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