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    • 3. 发明授权
    • Nitride semiconductor light emitting device having a silver p-contact
    • 具有银p接触的氮化物半导体发光器件
    • US06194743B1
    • 2001-02-27
    • US09212150
    • 1998-12-15
    • You KondohSatoshi WatanabeYawara KanekoShigeru NakagawaNorihide Yamada
    • You KondohSatoshi WatanabeYawara KanekoShigeru NakagawaNorihide Yamada
    • H01L3300
    • H01L33/42H01L33/40H01L2224/4847
    • A light emitting device constructed on a substrate. The device includes an n-type semiconductor layer in contact with the substrate, an active layer for generating light, the active layer being in electrical contact with the n-type semiconductor layer. A p-type semiconductor layer is in electrical contact with the active layer, and a p-electrode is in electrical contact with the p-type semiconductor layer. The p-electrode includes a layer of silver in contact with the p-type semiconductor layer. In the preferred embodiment of the present invention, the n-type semiconductor layer and the p-type semiconductor layer are constructed from group III nitride semiconductor materials. In one embodiment of the invention, the silver layer is sufficiently thin to be transparent. In other embodiments, the silver layer is thick enough to reflect most of the light incident thereon. A fixation layer is preferably provided over the silver layer. The fixation layer may be a dielectric or a conductor, the choice depending on whether or not the silver layer is transparent.
    • 构造在基板上的发光器件。 该器件包括与衬底接触的n型半导体层,用于产生光的有源层,有源层与n型半导体层电接触。 p型半导体层与有源层电接触,p电极与p型半导体层电接触。 p电极包括与p型半导体层接触的银层。 在本发明的优选实施例中,n型半导体层和p型半导体层由III族氮化物半导体材料构成。 在本发明的一个实施方案中,银层足够薄以使其透明。 在其它实施例中,银层足够厚以反射入射到其上的大部分光。 优选在银层上设置固定层。 固定层可以是电介质或导体,这取决于银层是否透明。
    • 6. 发明授权
    • Wavelength monitor using hybrid approach
    • 使用混合方式的波长监视器
    • US06486984B1
    • 2002-11-26
    • US09326338
    • 1999-06-07
    • Douglas M. BaneyNorihide YamadaSatoshi WatanabeShigeru NakagawaYoshikatsu Ichimura
    • Douglas M. BaneyNorihide YamadaSatoshi WatanabeShigeru NakagawaYoshikatsu Ichimura
    • H04J1402
    • H04J14/02H04B10/00
    • A method and a system for monitoring specific channels in a WDM system involve splitting a WDM signal into multiple parallel signals, filtering the parallel signals with corresponding individually tunable filters in order to pass specific channels to each filter, and then detecting the presence of passed channels with dedicated detectors that correspond to the tunable filters. In a preferred embodiment, the initial WDM signal is demultiplexed by wavelength into multiple different transmission groups and each filter can be individually tuned over a channel range that corresponds to the range of channels within the transmission group that is directed to the filter. The preferred individually tunable filters are vertical cavity filters formed utilizing semiconductor wafer processing techniques, and the preferred photodetectors are simple low cost single-cell photodetectors.
    • 用于监测WDM系统中的特定信道的方法和系统包括将WDM信号分割为多个并行信号,用相应的单独可调谐滤波器对并行信号进行滤波,以便将特定信道传送到每个滤波器,然后检测通过的信道的存在 具有与可调滤波器对应的专用检测器。 在优选实施例中,初始WDM信号被波长解复用为多个不同的传输组,并且每个滤波器可以在对应于指向滤波器的传输组内的信道范围的信道范围上单独调谐。 优选的单独可调滤波器是利用半导体晶片处理技术形成的垂直腔滤波器,并且优选的光电检测器是简单的低成本单单元光电探测器。
    • 7. 发明授权
    • Method for fabricating semiconductor laser facets using combined cleave
and polish technique
    • 使用组合切割和抛光技术制造半导体激光刻面的方法
    • US6077720A
    • 2000-06-20
    • US213124
    • 1998-12-15
    • Yoshifumi YamaokaSatoshi WatanabeNorihide YamadaEric Marenger
    • Yoshifumi YamaokaSatoshi WatanabeNorihide YamadaEric Marenger
    • H01L21/301H01L21/304H01L33/02H01S5/00H01S5/02H01S5/028H01S5/323H01L21/00H01L21/46
    • H01S5/0201H01S5/0202H01S5/0213H01S5/028H01S5/32341Y10S438/959
    • A method for fabricating opto-electronic devices having a surface that includes a first mirror facet in a first semiconductor layer deposited on a wafer. The mirror facet is located in a first facet plane. In the method of the present invention, the wafer is divided along a first line to create a segment having the mirror facet located therein. The segment is fixed to a fixture that moves in relation to a dicing disk that has a first planar surface in which polishing grit is embedded. The segment is fixed to a mounting surface such that the first plane is aligned parallel to the first planar surface of the dicing disk. The dicing disk is caused to rotate while the first planar surface is in contact with the segment, but not in contact with the mounting surface, thereby polishing a surface of the segment. For opto-electronic devices that include a second mirror facet in a second facet plane, the second facet plane being parallel to the first facet plane and displaced therefrom, the wafer is also divided along the second line such that the segment also includes the second facet plane. The second mirror surface is polished by causing the dicing disk to rotate while the second planar surface is in contact with the segment along the second line. The present invention can be practiced with a conventional dicing saw.
    • 一种用于制造具有在沉积在晶片上的第一半导体层中包括第一镜面的表面的光电器件的方法。 镜面位于第一小平面。 在本发明的方法中,沿着第一条线分割晶片以形成具有位于其中的镜面的部分。 该段被固定到相对于具有嵌入抛光砂粒的第一平坦表面的切割盘移动的夹具。 该段固定到安装表面,使得第一平面平行于切割盘的第一平面表面对准。 当第一平面与片段接触而不与安装表面接触时,切割盘旋转,从而抛光片段的表面。 对于在第二面平面中包括第二镜面的光电子器件,第二刻面平行于第一刻面并从其移位,晶片也沿第二线分割,使得该片段还包括第二刻面 飞机 第二镜面通过使切割盘旋转而第二平面与沿着第二线的片段接触而被抛光。 本发明可以用传统的切割锯来实现。