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    • 2. 发明授权
    • Epoxy resin, mercato curing agent and polysulfide adduct
    • 环氧树脂,mercato固化剂和多硫化物加合物
    • US5128424A
    • 1992-07-07
    • US732078
    • 1991-07-18
    • Vincent D. McGinnisKazumi NejigakiDuryodhan Mangaraj
    • Vincent D. McGinnisKazumi NejigakiDuryodhan Mangaraj
    • C08G59/66C09J163/00
    • C08G59/66C09J163/00
    • Broadly, the present invention is directed to an adhesive composition which comprises an epoxy resin, an effective amount of a mercapto curing agent or curative for said epoxy resin, and a compatibilizing amount of a polysulfide compound which has a performance improving fraction of its --SH groups rendered unreactive with the epoxy groups in said composition. Optionally, the adhesive composition can contain amine or amide curing agents in addition to the mercapto curative. Advantageously, at least about 5% of the number of reactive thiol groups of the polysulfide compound are rendered unreactive, advantageously at least about 25%, and preferably at least about 50%. Preferred polysulfide compatibilizing compounds are adducts of a polysulfide and a component which contains functionality reactive with a thiol group, but which contains no residual functionality reactive with epoxy groups in the composition once the polysulfide adduct is formed. Another aspect of the present invention is a method for improving the performance of an adhesive composition of an epoxy resin and a mercapto curative, which method comprises incorporating a compatibilizing amount of polysulfide compound which has had a performance improving fraction of its --SH groups rendered unreactive with epoxy groups in the composition. The polysulfide compatibilizing adduct is formed by the reaction of a polysulfide and a component that contains functionality reactive with thiol groups, but which contains no residual functionality reactive with epoxy groups in the adduct.
    • 广泛地,本发明涉及一种粘合剂组合物,其包含环氧树脂,有效量的巯基固化剂或所述环氧树脂的固化剂,以及相容剂量的具有-SH的性能提高分数的多硫化合物 所述组合物中的环氧基团不反应。 任选地,粘合剂组合物除了巯基固化剂之外还可含有胺或酰胺固化剂。 有利的是,多硫化物化合物的反应性硫醇基团的数量的至少约5%为非反应性,有利地为至少约25%,优选至少约50%。 优选的多硫化物相容化合物是多硫化物和含有与硫醇基反应的官能团的组分的加合物,但是一旦形成多硫化物加合物,其不含在组合物中与环氧基反应的残余官能团。 本发明的另一方面是提高环氧树脂和巯基固化剂的粘合剂组合物的性能的方法,该方法包括加入相容剂量的多硫化物,其具有不反应的-SH基团的性能提高分数 在组合物中具有环氧基团。 多硫相容化加合物是通过多硫化物和含有与硫醇基反应的官能团的组分的反应形成的,但不包含与加合物中的环氧基反应的残余官能团。
    • 4. 发明授权
    • One-pack type thermosetting composition
    • 一包式热固性组合物
    • US4912152A
    • 1990-03-27
    • US264388
    • 1988-10-31
    • Kazumi NejigakiKenichi KurosawaIsao NishiwakiYukihiro Okubo
    • Kazumi NejigakiKenichi KurosawaIsao NishiwakiYukihiro Okubo
    • C08G18/10C08G18/70
    • C08G18/703C08G18/10C08G2190/00
    • A one-pack type thermosetting composition comprising (A) at least one polyisocyanate compound having dispersed therein (B) at least one compound selected from the group consisting of (1) a solid polyfunctional compound having at least one functional group selected from the group consisting of hydrazino, primary amido and sulfamoyl groups, (2) a solid compound having at least one amidino group and (3) a solid compound having a heterocyclic ring and a plurality of active hydrogen atoms, or a one-pack type thermosetting composition comprising (A') a mixture consisting of (a) at least one polyisocyanate compound and (b) at least one high boiling polar compound, having dispersed therein (B') a solid polyfunctional compound having at least one active hydrogen atom. Said one-pack type thermosetting composition is storable and suitable for use in adhesives, sealing materials, coatings and shaped articles of resin.
    • 一种单组分型热固性组合物,其包含(A)至少一种其中分散有的多异氰酸酯化合物(B)至少一种选自以下的化合物:(1)具有至少一个选自以下的官能团的固体多官能化合物: 的肼基,伯酰胺基和氨磺酰基,(2)具有至少一个脒基的固体化合物和(3)具有杂环和多个活性氢原子的固体化合物,或单组分型热固性组合物,其包含( A')由(a)至少一种多异氰酸酯化合物和(b)至少一种分散在其中的高沸点极性化合物(B')组成的混合物,其具有至少一个活性氢原子的固体多官能化合物。 所述单组分型热固性组合物可储存并适用于粘合剂,密封材料,涂料和成型树脂制品。