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1. 发明授权

US07087457B2 Die bonding method and apparatus 有权
标题翻译：芯片接合方法和装置
公开(公告)号：US07087457B2
公开(公告)日：2006-08-08
申请号：US10772936
申请日：2004-02-05
申请人： Yoshiyuki Ogata , Hisashi Arai
发明人： Yoshiyuki Ogata , Hisashi Arai
IPC分类号： H01L21/58 , H05K13/04
CPC分类号： H01L21/67259 , H01L21/67144 , Y10T29/49131
摘要： A die bonding method and apparatus that performs bonding position detection and bonding inspection without lowering the productivity, in which after a bonding head has bonded a semiconductor chip to an island, the bonding head is moved to a wafer to pick up a semiconductor chip and is returned to the island; and during this period, an island used for bonding inspection (that is the island on which bonding has just been performed) and an island used for position detection (that is the island on which bonding is to be done next) are imaged by a camera in the same visual field, and inspection of the bonding conditions of the island used for inspection and detection of the position of the island used for position detection are performed based on the acquired image data.
摘要翻译：一种在不降低生产率的情况下执行结合位置检测和接合检查的芯片接合方法和装置，其中在将半导体芯片接合到岛上的接合头之后，将接合头移动到晶片以拾取半导体芯片，并且是回到岛上在此期间，用于粘接检查的岛（即刚刚进行接合的岛）和用于位置检测的岛（即接下来要进行接合的岛）用摄像机成像在相同的视场中，基于获取的图像数据进行用于检查的岛的接合条件的检查和用于位置检测的岛的位置的检测。

2. 发明授权

US6070780A Bonding apparatus 失效
标题翻译：接合装置
公开(公告)号：US6070780A
公开(公告)日：2000-06-06
申请号：US1183
申请日：1997-12-30
申请人： Masayuki Shimura , Hisashi Arai , Masaki Okawara
发明人： Masayuki Shimura , Hisashi Arai , Masaki Okawara
IPC分类号： H01L21/60 , B23K20/00 , H01L21/50 , H01L21/52 , B23K37/00 , B23K1/00 , B23K15/00 , B23K37/04
CPC分类号： H01L24/85 , B23K20/004 , H01L24/78 , B23K2201/36 , H01L2224/48247 , H01L2224/78 , H01L2224/85 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/01082
摘要： A bonding device equipped with a heating block for heating, for instance, a lead frame upon which bonding is performed including vacuum suction nozzles, which are installed above the heating block so as to lift the lead frame, and an air-cylinder, which raises and lowers the vacuum suction nozzles. The lead frame is lifted from the heating block by the vacuum suction nozzles, thus being prevented from being overly heated by the heating block.
摘要翻译：一种装配有用于加热的加热块的接合装置，例如，其上进行结合的引线框架，包括真空吸嘴，其安装在加热块上方以提升引线框架;以及气缸，其升高并降低真空吸嘴。引线框架通过真空吸嘴从加热块提升，从而防止加热块过度加热。

3. 发明授权

US07334238B2 Optical disc device having fixing parts for directly fixing a frame of the optical disk device to an electronic device 失效
标题翻译：具有用于将光盘装置的框架直接固定到电子装置的固定部件的光盘装置
公开(公告)号：US07334238B2
公开(公告)日：2008-02-19
申请号：US10827522
申请日：2004-04-20
申请人： Yuji Tanaka , Kazuo Matsumoto , Takeshi Watanabe , Masanobu Aramaki , Hidetaka Taguchi , Shingo Sagata , Yuichi Uchikawa , Takashi Morishita , Fumihide Maeda , Masanari Esaki , Hirohisa Koizumi , Shinichi Tokumaru , Hiroki Kokubu , Hisashi Arai , Takeshi Sugimoto
发明人： Yuji Tanaka , Kazuo Matsumoto , Takeshi Watanabe , Masanobu Aramaki , Hidetaka Taguchi , Shingo Sagata , Yuichi Uchikawa , Takashi Morishita , Fumihide Maeda , Masanari Esaki , Hirohisa Koizumi , Shinichi Tokumaru , Hiroki Kokubu , Hisashi Arai , Takeshi Sugimoto
IPC分类号： G11B33/02 , G11B17/03 , G11B17/04
CPC分类号： G11B33/121
摘要： The present invention includes a frame, an optical pick-up module fixed to the frame and a circuit board forming a control circuit fixed to the frame. The frame has fixing parts to other members.
摘要翻译：本发明包括一个框架，一个固定在框架上的光学拾取模块和一个形成固定在框架上的控制电路的电路板。框架具有固定部件到其他部件。

4. 发明申请

US20080037408A1 OPTICAL DISK DEVICE 审中-公开
标题翻译：光盘设备
公开(公告)号：US20080037408A1
公开(公告)日：2008-02-14
申请号：US11844985
申请日：2007-08-24
申请人： Yuji TANAKA , Kazuo Matsumoto , Takeshi Watanabe , Masanobu Aramaki , Hidetaka Taguchi , Shingo Sagata , Yuichi Uchikawa , Takashi Morishita , Fumihide Maeda , Masanari Esaki , Hirohisa Koizumi , Shinichi Tokumaru , Hiroki Kokubu , Hisashi Arai , Takeshi Sugimoto
发明人： Yuji TANAKA , Kazuo Matsumoto , Takeshi Watanabe , Masanobu Aramaki , Hidetaka Taguchi , Shingo Sagata , Yuichi Uchikawa , Takashi Morishita , Fumihide Maeda , Masanari Esaki , Hirohisa Koizumi , Shinichi Tokumaru , Hiroki Kokubu , Hisashi Arai , Takeshi Sugimoto
IPC分类号： G11B7/00
CPC分类号： G11B33/121
摘要： The present invention includes a frame, an optical pick-up module fixed to the frame and a circuit board forming a control circuit fixed to the frame. The frame has fixing parts to other members.
摘要翻译：本发明包括一个框架，一个固定在框架上的光学拾取模块和一个形成固定在框架上的控制电路的电路板。框架具有固定部件到其他部件。

5. 发明授权

US6059846A Bonding wire height inspection device 失效
标题翻译：接线高度检测装置
公开(公告)号：US6059846A
公开(公告)日：2000-05-09
申请号：US42843
申请日：1998-03-17
申请人： Hisashi Arai , Masaru Inomata , Masayuki Shimura
发明人： Hisashi Arai , Masaru Inomata , Masayuki Shimura
IPC分类号： H01L21/66 , H01L21/00 , H01L21/60
CPC分类号： H01L21/67288 , H01L24/78 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/78 , H01L2224/859 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , Y10T29/41
摘要： A device for inspecting a high loop of a wire bonded on, for instance, a lead frame including a frame carrying stand, which guides and supports a lead frame, and an inspection roller, which is installed directly above the frame carrying stand. The inspection roller has frame pressing parts made as an insulating part so as to press the side portions of the lead frame against the frame carrying stand 31; and the inspection roller further has a wire detection part made as conductive parts provided between the frame pressing ring. A step or height difference between the frame pressing parts and the wire detection part is formed so as to be equal to the upper-limit value of the maximum height of wire loops formed by the bonded wire, and high loops that exceed the upper-limit value are detected by way of an electric current that flows when the wire detection part contacts the bonded wire.
摘要翻译：用于检查在例如引导框架上检查线圈的高回路的装置，所述引线框架包括引导框架的框架承载架和引导框架的支撑件以及安装在框架承载架正上方的检查辊。检查辊具有制成绝缘部分的框架按压部分，以将引线框架的侧部压靠在框架承载台31上; 并且检查辊还具有设置在框架按压环之间的导电部件的线检测部。框架按压部和线检测部之间的台阶或高度差形成为与由接合线形成的线圈的最大高度的上限值相等，超过上限的高回路通过在线检测部与接合线接触时流动的电流来检测值。

6. 发明授权

US5651492A Heating device for a bonding apparatus 失效
标题翻译：用于粘合装置的加热装置
公开(公告)号：US5651492A
公开(公告)日：1997-07-29
申请号：US714941
申请日：1996-09-17
申请人： Hisashi Arai , Nobuharu Moriya
发明人： Hisashi Arai , Nobuharu Moriya
IPC分类号： H01L21/52 , B23K3/08 , H01L21/60
CPC分类号： B23K3/085 , B23K2201/36
摘要： A heating device used in a bonding apparatus including a cover which is provided on a heating body so as to cover a guide groove which guides lead frames; and gas grooves are formed in the heating body so as to run along the guide groove, and an inert gas is supplied into the gas grooves so that the inert gas prevents the entry of air from the joining surfaces of the heating body and cover.
摘要翻译：一种加热装置，其用于包括盖的接合装置，所述盖设置在加热体上以覆盖引导引线框架的引导槽; 并且在加热体中形成气体槽，以沿着引导槽延伸，并且惰性气体被供应到气体槽中，使得惰性气体防止空气从加热体和盖的接合表面进入。

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