专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100276721A1 Light Emitting Device Encapsulated with Silicones and Curable Silicone Compositions for Preparing the Silicones 有权
标题翻译：用硅酮封装的发光装置和用于制备硅氧烷的可固化硅酮组合物
公开(公告)号：US20100276721A1
公开(公告)日：2010-11-04
申请号：US12223133
申请日：2007-02-01
申请人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
发明人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
IPC分类号： H01L33/62 , C08L83/05
CPC分类号： C08K5/5425 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
摘要翻译：组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。通过将组合物施加到光源上然后固化来制造发光器件。组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。

2. 发明授权

US08258502B2 Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones 有权
标题翻译：用硅氧烷封装的发光器件和用于制备硅氧烷的可固化硅氧烷组合物
公开(公告)号：US08258502B2
公开(公告)日：2012-09-04
申请号：US12223133
申请日：2007-02-01
申请人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
发明人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
IPC分类号： H01L35/24
CPC分类号： C08K5/5425 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
摘要翻译：组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。通过将组合物施加到光源上然后固化来制造发光器件。组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。

3. 发明申请

US20090179180A1 Curable Organopolysiloxane Composition and Semiconductor Device 有权
标题翻译：固化有机聚硅氧烷组合物和半导体器件
公开(公告)号：US20090179180A1
公开(公告)日：2009-07-16
申请号：US12306049
申请日：2007-06-18
申请人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Makoto Yoshitake
发明人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Makoto Yoshitake
IPC分类号： C08F283/12 , H01J63/02
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70 , H01L2224/48091 , H01L2924/1301 , C08L83/00 , C08L2666/14 , H01L2924/00014 , H01L2924/00
摘要： A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13 (where R1 is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c (where R2 is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.
摘要翻译：可固化的有机基聚硅氧烷组合物至少包含以下组分：由以下通式表示的有机聚硅氧烷（A）：R13SiO（R12SiO）mSiR13（其中R1是一价烃基，“m”是0-100的整数）; 由下列平均单元式表示的有机聚硅氧烷（B）：（R2SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（其中R2是一价烃基，“a”，“b”和 “c”是具体数字）; 在一个分子中平均具有至少两个与硅键合的芳基并且平均具有至少两个与硅键合的氢原子的有机聚硅氧烷（C）; 和氢化硅烷化反应催化剂（D）; 其特征在于良好的填充性和固化性，并且当固化时，形成具有高折射率，高透光率和对各种基材的强粘附性的固化体。

4. 发明授权

US08080614B2 Curable organopolysiloxane composition and semiconductor device 有权
标题翻译：可固化有机聚硅氧烷组合物和半导体器件
公开(公告)号：US08080614B2
公开(公告)日：2011-12-20
申请号：US12306049
申请日：2007-06-18
申请人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Makoto Yoshitake
发明人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Makoto Yoshitake
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70 , H01L2224/48091 , H01L2924/1301 , C08L83/00 , C08L2666/14 , H01L2924/00014 , H01L2924/00
摘要： A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13 (where R1 is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c (where R2 is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.
摘要翻译：可固化的有机聚硅氧烷组合物至少包含以下组分：由以下通式表示的有机聚硅氧烷（A）：R13SiO（R12SiO）mSiR13（其中R1是一价烃基，“m”是0-100的整数）; 由下列平均单元式表示的有机聚硅氧烷（B）：（R2SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（其中R2是一价烃基，“a”，“b”和 “c”是具体数字）; 在一个分子中平均具有至少两个与硅键合的芳基和平均至少两个与硅键合的氢原子的有机聚硅氧烷（C）; 和氢化硅烷化反应催化剂（D）; 其特征在于良好的填充性和固化性，并且当固化时，形成具有高折射率，高透光率和对各种基材的强粘附性的固化体。

5. 发明申请

US20070112147A1 Curable organopolysiloxane composition and semiconductor device 有权
标题翻译：固化有机聚硅氧烷组合物和半导体器件
公开(公告)号：US20070112147A1
公开(公告)日：2007-05-17
申请号：US10573505
申请日：2004-09-14
申请人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Tomoko Kato
发明人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Tomoko Kato
IPC分类号： C08L83/04 , H01L21/56 , B32B27/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70 , H01L2224/48091 , H01L2224/48247 , H01L2924/1301 , Y10T428/31663 , C08L83/00 , H01L2924/00014 , H01L2924/00
摘要： A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.
摘要翻译：一种可固化的有机聚硅氧烷组合物，其包含（A）每分子具有至少两个烯基和至少一个芳基的直链有机聚硅氧烷，（B）每分子具有至少一个烯基和至少一个芳基的支链有机聚硅氧烷，并具有硅氧烷由以下通式表示的单元：RsiO 2/3，（C）分子链的两个末端被每分子具有至少一个芳基的硅键合氢原子封闭的直链有机聚硅氧烷和（ D）硅氢化反应催化剂，以及其半导体元件涂覆有上述组合物的固化产物的半导体器件。可固化的有机基聚硅氧烷组合物显示出低粘度，优异的填充性能和固化性，并且固化性优异，可以形成具有大折射率，高透光率和对基材的高粘附性的软化固化物，以及半导体器件显示出优异的可靠性。

6. 发明授权

US07527871B2 Curable organopolysiloxane composition and semiconductor device 有权
标题翻译：固化有机聚硅氧烷组合物和半导体器件
公开(公告)号：US07527871B2
公开(公告)日：2009-05-05
申请号：US10573505
申请日：2004-09-14
申请人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Tomoko Kato
发明人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Tomoko Kato
IPC分类号： B32B9/04 , C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70 , H01L2224/48091 , H01L2224/48247 , H01L2924/1301 , Y10T428/31663 , C08L83/00 , H01L2924/00014 , H01L2924/00
摘要： A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.
摘要翻译：一种可固化的有机聚硅氧烷组合物，其包含（A）每分子具有至少两个烯基和至少一个芳基的直链有机聚硅氧烷，（B）每分子具有至少一个烯基和至少一个芳基的支链有机聚硅氧烷，并具有硅氧烷由以下通式表示的单元：RsiO2 / 3，（C）分子链的两个末端被每个分子具有至少一个芳基的硅键合氢原子封闭的线性有机聚硅氧烷，（D）硅氢化反应催化剂，和其半导体元件用上述组成的固化产物涂覆的半导体器件。可固化的有机基聚硅氧烷组合物显示出低粘度，优异的填充性能和固化性，并且固化性优异，可以形成具有大折射率，高透光率和对基材的高粘附性的软化固化物，以及半导体器件显示出优异的可靠性。

7. 发明授权

US08373286B2 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device 有权
标题翻译：可固化的有机聚硅氧烷组合物，光学半导体元件密封剂和光学半导体器件
公开(公告)号：US08373286B2
公开(公告)日：2013-02-12
申请号：US13062374
申请日：2009-09-04
申请人： Makoto Yoshitake , Hiroji Enami , Tomoko Kato , Masayoshi Terada
发明人： Makoto Yoshitake , Hiroji Enami , Tomoko Kato , Masayoshi Terada
IPC分类号： H01L23/29
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , C08L83/00 , H01L2924/00
摘要： A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.
摘要翻译：一种可固化的有机聚硅氧烷组合物和光学半导体元件密封剂，每个包含（A）具有至少2个烯基的二有机聚硅氧烷，其中所有硅氧烷单元的至少70摩尔％是甲基苯基硅氧烷单元，三甲基-1,3,5-三苯基环三硅氧烷和1,3,5,7-四甲基-1,3,5,7-四苯基环四硅氧烷不超过5重量％，（B）具有至少2个硅键合的有机聚硅氧烷其中至少15摩尔％的与硅键合的有机基团是苯基的氢原子，和（C）氢化硅烷化反应催化剂。一种光学半导体器件，其中壳体内的光学半导体元件由上述组合物用固化产物密封。

8. 发明申请

US20110227235A1 Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, and Optical Semiconductor Device 有权
标题翻译：固化有机聚硅氧烷组合物，光半导体元件密封剂和光半导体器件
公开(公告)号：US20110227235A1
公开(公告)日：2011-09-22
申请号：US13062374
申请日：2009-09-04
申请人： Makoto Yoshitake , Hiroji Enami , Tomoko Kato , Masayoshi Terada
发明人： Makoto Yoshitake , Hiroji Enami , Tomoko Kato , Masayoshi Terada
IPC分类号： H01L23/28 , C08G77/04
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , C08L83/00 , H01L2924/00
摘要： A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.
摘要翻译：一种可固化的有机聚硅氧烷组合物和光学半导体元件密封剂，每个包含（A）具有至少2个烯基的二有机聚硅氧烷，其中所有硅氧烷单元的至少70摩尔％是甲基苯基硅氧烷单元，三甲基-1,3,5-三苯基环三硅氧烷和1,3,5,7-四甲基-1,3,5,7-四苯基环四硅氧烷不超过5重量％，（B）具有至少2个硅键合的有机聚硅氧烷其中至少15摩尔％的与硅键合的有机基团是苯基的氢原子，和（C）氢化硅烷化反应催化剂。一种光学半导体器件，其中壳体内的光学半导体元件由上述组合物用固化产物密封。

9. 发明授权

US06881807B2 Addition-curable silicone gel composition 有权
标题翻译：可加成固化的硅胶组合物
公开(公告)号：US06881807B2
公开(公告)日：2005-04-19
申请号：US10476055
申请日：2002-04-15
申请人： Masayoshi Terada , Hiroji Enami
发明人： Masayoshi Terada , Hiroji Enami
IPC分类号： C08L83/07 , C08K3/00 , C08K5/00 , C08K5/5419 , C08K5/56 , C08L83/04 , C08L83/05 , H01L23/24 , C08G77/12
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K5/0091 , C08K5/5419 , C08K5/56 , C08L2205/02 , C08L83/00 , C08L2666/44 , C08L2666/54
摘要： A silicone gel composition is characterized by excellent storage stability in a non-cured state and by high adhesion to a substrate and long-term stability of consistency at elevated temperatures after curing. The silicone gel composition comprises: a polyorganosiloxane (A), which consists of polyorganosiloxane (A-1) that contains R(CH3)2SiO2/2 units, RsiO3/2 units R(CH3)2SiO1/2 units, and polydiorganosiloxane (A-2) that contains R(CH3)2SiO2/2 units and R(CH3)2SiO1/2 units, and R(CH3) which contains in one molecule two silicon-bonded hydrogen atoms; an addition-reaction platinum catalyst (C); an organosilicon compound (D) selected from silane of the general formula (R1O)nSiR24-n or a partially hydrolyzed condensate thereof; and an organic titanium compound (E).
摘要翻译：硅凝胶组合物的特征在于在非固化状态下具有优异的储存稳定性和通过对基材的高粘附性以及在固化后的高温下的长期稳定性。硅氧烷凝胶组合物包括：聚有机硅氧烷（A），其由含有R（CH 3 3）2 SiO 2/2/2的聚有机硅氧烷（A-1）单元R 3 O 3/2单元R（CH 3 3）2 SiO 2 1/2单元，和含有R（CH 3 3）2 SiO 2/2/2单元的聚二有机硅氧烷（A-2）和R（CH 3）3 2个/或2个/ 2个单元，和在一个分子中含有两个与硅键合的氢原子的R（CH 3） ; 加成反应铂催化剂（C）; 选自通式（R 1）O的硅烷的有机硅化合物（D）N 2 SiR 2 S 4 - 或其部分水解的缩合物; 和有机钛化合物（E）。

10. 发明申请

US20110254047A1 Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, And Optical Semiconductor Device 有权
标题翻译：固化有机聚硅氧烷组合物，光半导体元件密封剂和光半导体器件
公开(公告)号：US20110254047A1
公开(公告)日：2011-10-20
申请号：US13126440
申请日：2009-10-30
申请人： Makoto Yoshitake , Takashi Sagawa , Masayoshi Terada
发明人： Makoto Yoshitake , Takashi Sagawa , Masayoshi Terada
IPC分类号： H01L33/52 , C08G77/38
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2224/48091 , H01L2224/48247 , H01L2924/09701 , H01L2924/12044 , C08L83/00 , C08L2666/52 , C08L2666/54 , H01L2924/00014
摘要： A hydrosilylation reaction-curable organopolysiloxane composition comprising (A) a methylpheny-lalkenylpolysiloxane that has at least two alkenyl groups wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole % is comprised of phenyl groups, (B) a methylphenylhydrogenpolysiloxane that has at least two Si-bonded hydrogen atoms wherein diphenylsiloxane units are no more than 5 mole % and at least 20 mole 1% is comprised of phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor element sealant comprising this composition. An optical semiconductor device sealed with this optical semiconductor element sealant.
摘要翻译：一种氢化硅烷化反应可固化的有机聚硅氧烷组合物，其包含（A）具有至少两个烯基的甲基苯基 - 烯基聚硅氧烷，其中二苯基硅氧烷单元不大于5摩尔％且至少20摩尔％由苯基组成，（B）甲基苯基氢聚硅氧烷，具有至少两个Si键合的氢原子，其中二苯基硅氧烷单元不大于5摩尔％，并且至少20摩尔1％由苯基组成，和（C）氢化硅烷化反应催化剂。包含该组合物的光学半导体元件密封剂。用该光学半导体元件密封剂密封的光学半导体器件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式