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1. 发明授权

US08258502B2 Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones 有权
标题翻译：用硅氧烷封装的发光器件和用于制备硅氧烷的可固化硅氧烷组合物
公开(公告)号：US08258502B2
公开(公告)日：2012-09-04
申请号：US12223133
申请日：2007-02-01
申请人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
发明人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
IPC分类号： H01L35/24
CPC分类号： C08K5/5425 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
摘要翻译：组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。通过将组合物施加到光源上然后固化来制造发光器件。组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。

2. 发明申请

US20100276721A1 Light Emitting Device Encapsulated with Silicones and Curable Silicone Compositions for Preparing the Silicones 有权
标题翻译：用硅酮封装的发光装置和用于制备硅氧烷的可固化硅酮组合物
公开(公告)号：US20100276721A1
公开(公告)日：2010-11-04
申请号：US12223133
申请日：2007-02-01
申请人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
发明人： Makoto Yoshitake , Masashi Murakami , Yoshitsugu Morita , Tomoko Kato , Hiroji Enami , Masayoshi Terada , Brian Harkness , Tammy Cheng , Michelle Cummings , Ann Norris , Malinda Howell
IPC分类号： H01L33/62 , C08L83/05
CPC分类号： C08K5/5425 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08K5/5435 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/00
摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.
摘要翻译：组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。通过将组合物施加到光源上然后固化来制造发光器件。组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。

3. 发明申请

US20070112147A1 Curable organopolysiloxane composition and semiconductor device 有权
标题翻译：固化有机聚硅氧烷组合物和半导体器件
公开(公告)号：US20070112147A1
公开(公告)日：2007-05-17
申请号：US10573505
申请日：2004-09-14
申请人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Tomoko Kato
发明人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Tomoko Kato
IPC分类号： C08L83/04 , H01L21/56 , B32B27/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70 , H01L2224/48091 , H01L2224/48247 , H01L2924/1301 , Y10T428/31663 , C08L83/00 , H01L2924/00014 , H01L2924/00
摘要： A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.
摘要翻译：一种可固化的有机聚硅氧烷组合物，其包含（A）每分子具有至少两个烯基和至少一个芳基的直链有机聚硅氧烷，（B）每分子具有至少一个烯基和至少一个芳基的支链有机聚硅氧烷，并具有硅氧烷由以下通式表示的单元：RsiO 2/3，（C）分子链的两个末端被每分子具有至少一个芳基的硅键合氢原子封闭的直链有机聚硅氧烷和（ D）硅氢化反应催化剂，以及其半导体元件涂覆有上述组合物的固化产物的半导体器件。可固化的有机基聚硅氧烷组合物显示出低粘度，优异的填充性能和固化性，并且固化性优异，可以形成具有大折射率，高透光率和对基材的高粘附性的软化固化物，以及半导体器件显示出优异的可靠性。

4. 发明授权

US07527871B2 Curable organopolysiloxane composition and semiconductor device 有权
标题翻译：固化有机聚硅氧烷组合物和半导体器件
公开(公告)号：US07527871B2
公开(公告)日：2009-05-05
申请号：US10573505
申请日：2004-09-14
申请人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Tomoko Kato
发明人： Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Tomoko Kato
IPC分类号： B32B9/04 , C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70 , H01L2224/48091 , H01L2224/48247 , H01L2924/1301 , Y10T428/31663 , C08L83/00 , H01L2924/00014 , H01L2924/00
摘要： A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.
摘要翻译：一种可固化的有机聚硅氧烷组合物，其包含（A）每分子具有至少两个烯基和至少一个芳基的直链有机聚硅氧烷，（B）每分子具有至少一个烯基和至少一个芳基的支链有机聚硅氧烷，并具有硅氧烷由以下通式表示的单元：RsiO2 / 3，（C）分子链的两个末端被每个分子具有至少一个芳基的硅键合氢原子封闭的线性有机聚硅氧烷，（D）硅氢化反应催化剂，和其半导体元件用上述组成的固化产物涂覆的半导体器件。可固化的有机基聚硅氧烷组合物显示出低粘度，优异的填充性能和固化性，并且固化性优异，可以形成具有大折射率，高透光率和对基材的高粘附性的软化固化物，以及半导体器件显示出优异的可靠性。

5. 发明申请

US20110227235A1 Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, and Optical Semiconductor Device 有权
标题翻译：固化有机聚硅氧烷组合物，光半导体元件密封剂和光半导体器件
公开(公告)号：US20110227235A1
公开(公告)日：2011-09-22
申请号：US13062374
申请日：2009-09-04
申请人： Makoto Yoshitake , Hiroji Enami , Tomoko Kato , Masayoshi Terada
发明人： Makoto Yoshitake , Hiroji Enami , Tomoko Kato , Masayoshi Terada
IPC分类号： H01L23/28 , C08G77/04
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , C08L83/00 , H01L2924/00
摘要： A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.
摘要翻译：一种可固化的有机聚硅氧烷组合物和光学半导体元件密封剂，每个包含（A）具有至少2个烯基的二有机聚硅氧烷，其中所有硅氧烷单元的至少70摩尔％是甲基苯基硅氧烷单元，三甲基-1,3,5-三苯基环三硅氧烷和1,3,5,7-四甲基-1,3,5,7-四苯基环四硅氧烷不超过5重量％，（B）具有至少2个硅键合的有机聚硅氧烷其中至少15摩尔％的与硅键合的有机基团是苯基的氢原子，和（C）氢化硅烷化反应催化剂。一种光学半导体器件，其中壳体内的光学半导体元件由上述组合物用固化产物密封。

6. 发明授权

US08373286B2 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device 有权
标题翻译：可固化的有机聚硅氧烷组合物，光学半导体元件密封剂和光学半导体器件
公开(公告)号：US08373286B2
公开(公告)日：2013-02-12
申请号：US13062374
申请日：2009-09-04
申请人： Makoto Yoshitake , Hiroji Enami , Tomoko Kato , Masayoshi Terada
发明人： Makoto Yoshitake , Hiroji Enami , Tomoko Kato , Masayoshi Terada
IPC分类号： H01L23/29
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , C08L83/00 , H01L2924/00
摘要： A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.
摘要翻译：一种可固化的有机聚硅氧烷组合物和光学半导体元件密封剂，每个包含（A）具有至少2个烯基的二有机聚硅氧烷，其中所有硅氧烷单元的至少70摩尔％是甲基苯基硅氧烷单元，三甲基-1,3,5-三苯基环三硅氧烷和1,3,5,7-四甲基-1,3,5,7-四苯基环四硅氧烷不超过5重量％，（B）具有至少2个硅键合的有机聚硅氧烷其中至少15摩尔％的与硅键合的有机基团是苯基的氢原子，和（C）氢化硅烷化反应催化剂。一种光学半导体器件，其中壳体内的光学半导体元件由上述组合物用固化产物密封。

7. 发明授权

US08153202B2 Method of manufacturing a layered silicone composite material 有权
标题翻译：层状有机硅复合材料的制造方法
公开(公告)号：US08153202B2
公开(公告)日：2012-04-10
申请号：US13009982
申请日：2011-01-20
申请人： Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
发明人： Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
IPC分类号： B05D5/00 , B05D1/38 , B05D3/10
CPC分类号： C08J7/047 , C08J2383/04 , C08J2483/00 , C08K5/56 , C09D183/04 , Y10T428/31663 , C08L83/00
摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.
摘要翻译：一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。

8. 发明授权

US08044153B2 Curable silicone composition 有权
标题翻译：可固化硅酮组合物
公开(公告)号：US08044153B2
公开(公告)日：2011-10-25
申请号：US12093053
申请日：2006-11-08
申请人： Shinichi Yamamoto , Tomoko Kato , Hiroji Enami , Yoshitsugu Morita
发明人： Shinichi Yamamoto , Tomoko Kato , Hiroji Enami , Yoshitsugu Morita
IPC分类号： C08G77/12 , C08G77/20 , C08L83/05 , C08L83/07
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L83/00 , C08K5/56
摘要： A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.
摘要翻译：至少包含以下组分的可固化的硅氧烷组合物：（A）在一个分子中具有至少两个烯基的二有机聚硅氧烷; （B）将至少两种具有不同质均分子量的树脂状有机聚硅氧烷降低成标准聚苯乙烯测量的凝胶渗透色谱法，并由SiO 4/2单元，R 12 R 2 SiO 1/2单元和R 13 SiO 1/2单元组成，其中R 1 是不含脂族不饱和键的任意取代的一价烃基，R 2是烯基; （C）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 具有优异的流动性和填充能力，并且即使组合物含有形成具有适当强度和硬度的固化的硅氧烷体所需的树脂状有机聚硅氧烷，也可以制备而不具有极高的粘度。

9. 发明申请

US20090118441A1 Curable Silicone Composition 有权
标题翻译：可固化硅酮组合物
公开(公告)号：US20090118441A1
公开(公告)日：2009-05-07
申请号：US12093053
申请日：2006-11-08
申请人： Shinichi Yamamoto , Tomoko Kato , Hiroji Enami , Yoshitsugu Morita
发明人： Shinichi Yamamoto , Tomoko Kato , Hiroji Enami , Yoshitsugu Morita
IPC分类号： C08L83/05
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L83/00 , C08K5/56
摘要： A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.
摘要翻译：至少包含以下组分的可固化的硅氧烷组合物：（A）在一个分子中具有至少两个烯基的二有机聚硅氧烷; （B）将至少两种具有不同质均分子量的树脂状有机聚硅氧烷降低成标准聚苯乙烯测量的凝胶渗透色谱法，并由SiO 4/2单元，R 12 R 2 SiO 1/2单元和R 13 SiO 1/2单元组成，其中R 1 是不含脂族不饱和键的任意取代的一价烃基，R 2是烯基; （C）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 具有优异的流动性和填充能力，并且即使组合物含有形成具有适当强度和硬度的固化的硅氧烷体所需的树脂状有机聚硅氧烷，也可以制备而不具有极高的粘度。

10. 发明申请

US20070134425A1 Method of manufacturing a layered silicone composite material 有权
标题翻译：层状有机硅复合材料的制造方法
公开(公告)号：US20070134425A1
公开(公告)日：2007-06-14
申请号：US10580798
申请日：2004-11-24
申请人： Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
发明人： Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
IPC分类号： B05D3/02 , B32B9/04
CPC分类号： C08J7/047 , C08J2383/04 , C08J2483/00 , C08K5/56 , C09D183/04 , Y10T428/31663 , C08L83/00
摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.
摘要翻译：一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。

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