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    • 9. 发明授权
    • Photodiode manufacturing method and photodiodes
    • 光电二极管制造方法和光电二极管
    • US08564087B2
    • 2013-10-22
    • US13148091
    • 2010-02-15
    • Kazuhisa YamamuraAkira SakamotoTerumasa Nagano
    • Kazuhisa YamamuraAkira SakamotoTerumasa Nagano
    • H01L31/00H01L29/06H01L21/00
    • H01L31/1804H01L31/02327H01L31/02363H01L31/035281Y02E10/547
    • A semiconductor substrate 2 is dry etched before an insulating layer 4 is exposed, whereby a hole H1 penetrating through the semiconductor substrate 2 and reaching the insulating layer 4 is formed at a position corresponding to a photosensitive region S1. Next, an irregular asperity 22 is formed in a surface 7 of an n+ type embedded layer 6 exposed in the hole H1. The surface of the n+ type embedded layer 6 exposed in the hole H1 through the insulating layer 4 is irradiated with a picosecond to femtosecond pulsed laser beam, whereby the insulating layer 4 is removed and the surface 7 of the n+ type embedded layer 6 exposed in the hole H1 is roughened by the picosecond to femtosecond pulsed laser beam, to form the irregular asperity 22 in the entire area of the surface 7. Then the substrate with the irregular asperity 22 therein is subjected to a thermal treatment.
    • 在绝缘层4露出之前对半导体衬底2进行干蚀刻,从而在对应于感光区域S1的位置处形成贯穿半导体衬底2并到达绝缘层4的孔H1。 接下来,在露出在孔H1中的n +型嵌入层6的表面7中形成不规则的凹凸22。 通过绝缘层4暴露在孔H1中的n +型嵌入层6的表面用皮秒照射到飞秒脉冲激光束,由此去除绝缘层4,并将n +型嵌入层6的表面7暴露在 通过皮秒对飞秒脉冲激光束使孔H1粗糙化,在表面7的整个区域中形成不规则的凹凸22。然后对其中具有不规则凹凸22的基板进行热处理。