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    • 3. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US4403392A
    • 1983-09-13
    • US152305
    • 1980-05-22
    • Jiro OshimaMasaharu AoyamaSeiji YasudaToshio Yonezawa
    • Jiro OshimaMasaharu AoyamaSeiji YasudaToshio Yonezawa
    • H01L29/43H01L21/225H01L21/28H01L21/321H01L23/522H01L23/532
    • H01L23/53271H01L21/2257H01L21/28H01L21/321H01L23/5226H01L2924/0002Y10S438/92
    • A method for manufacturing a semiconductor device having a high breakdown voltage and a high reliability, comprises (a) forming on a semiconductor substrate an insulating layer having a diffusion window; (b) forming an impurity-doped poly-silicon layer on the insulating layer and on that portion of the semiconductor substrate which is exposed through the diffusion window; (c) forming an undoped poly-silicon layer on the impurity-doped poly-silicon layer; (d) thermally oxidizing the substrate with the insulating layer, impurity-doped poly-silicon layer and undoped poly-silicon layer, thus diffusing the impurity from the impurity-doped poly-silicon layer into the semiconductor substrate through the diffusion window and converting the undoped poly-silicon layer to a silicon oxide layer; (e) forming on the silicon oxide layer an oxidation-resisting mask layer in a desired pattern; and (f) thermally oxidizing the substrate with the insulating layer, impurity-doped poly-silicon layer, silicon oxide layer and mask layer, thus converting those portions of the impurity-doped poly-silicon layer which lie beneath those portions of the silicon oxide layer which are exposed through the mask layer to impurity-doped silicon oxide layers, whereby the remaining portions of the impurity-doped poly-silicon layer provide an interconnection electrode layer having a desired pattern.
    • 一种制造具有高击穿电压和高可靠性的半导体器件的方法,包括:(a)在半导体衬底上形成具有扩散窗的绝缘层; (b)在绝缘层上形成掺杂杂质的多晶硅层,以及通过扩散窗露出的部分半导体衬底; (c)在杂质掺杂的多晶硅层上形成未掺杂的多晶硅层; (d)用绝缘层,杂质掺杂的多晶硅层和未掺杂的多晶硅层热氧化衬底,从而通过扩散窗将杂质从杂质掺杂的多晶硅层扩散到半导体衬底中,并将 未掺杂的多晶硅层到氧化硅层; (e)在所述氧化硅层上形成所需图案的抗氧化掩模层; 和(f)用绝缘层,杂质掺杂的多晶硅层,氧化硅层和掩模层热氧化衬底,从而转换位于氧化硅部分之下的杂质掺杂多晶硅层的那些部分 层,其通过掩模层暴露于杂质掺杂的氧化硅层,由此杂质掺杂多晶硅层的剩余部分提供具有期望图案的互连电极层。
    • 10. 发明授权
    • Leukemic cell-adsorbing material containing lectin protein from Agrocybe cylindracea or jequirity plant seed
    • 含有Agrocybe cylindracea或jequirity植物豆种子的凝集素蛋白质的白血病细胞吸附材料
    • US06420171B1
    • 2002-07-16
    • US09549493
    • 2000-04-14
    • Osamu NakamuraHideki OhbaImre SallayFumio YagiSawako MoriwakiSeiji Yasuda
    • Osamu NakamuraHideki OhbaImre SallayFumio YagiSawako MoriwakiSeiji Yasuda
    • C12N506
    • C12N5/0093A61M1/3679A61M2202/0439C07K14/37C07K14/42C07K17/10Y10S530/812Y10S530/813
    • An efficient method for therapeutic treatment of leukemia is provided in which a patient's body fluid during external circulation is brought into direct contact with an adsorbent material capable of specifically and selectively adsorbing leukemic cells in the body fluid. The leukemic cell-adsorbing material is a composite of a lectin protein coupled with a physiologically inert carrier material such as a galactan polysaccharide in the form of beads. The lectin protein may be obtained from a mushroom fungus such as Agrocybe cylindracea or a leguminous seed such as from the jequirity bean plant. The lectin protein and carrier material can be bound by forming chemical linkages between amino groups in the lectin protein and functional groups in the carrier material, and unreacted functional groups of the carrier material may be blocked with an amino acid. A leukemic cell-adsorbing column may be formed by filling the leukemic cell-adsorbing material into a tubular body to form an adsorbent bed. The tubular body may have an inner diameter of from 10 to 20 mm and a height of from 50 to 200 mm.
    • 提供了一种治疗白血病的有效方法,其中外部循环期间的患者体液与能够特异性和选择性地吸收体液中的白血病细胞的吸附材料直接接触。 白血病细胞吸附材料是凝集素蛋白与生理惰性载体材料如珠粒形式的半乳聚糖多糖的复合物。 凝集素蛋白质可以从蘑菇真菌如花椰菜(Agrocybe cylindracea)或豆科植物种子(例如来自不育豆)得到。 凝集素蛋白质和载体材料可以通过在凝集素蛋白中的氨基和载体材料中的官能团之间形成化学键而结合,载体材料的未反应的官能团可以用氨基酸封闭。 可以通过将白血病细胞吸附材料填充到管状体中以形成吸附床来形成白血病细胞吸附柱。 管状体的内径可以为10〜20mm,高度为50〜200mm。