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    • 4. 发明授权
    • Method of bonding a metal by solder
    • 通过焊料接合金属的方法
    • US5305948A
    • 1994-04-26
    • US67599
    • 1993-05-27
    • Yoshio YoshikawaYoshiaki InoueTeruo TakeuchiKazuo Fujinami
    • Yoshio YoshikawaYoshiaki InoueTeruo TakeuchiKazuo Fujinami
    • B23K1/20B23K35/36H05K3/34B23K35/363B23K35/38H01L21/50H01L21/54
    • B23K1/203B23K35/3612B23K35/3616H05K3/3489Y10T29/49146
    • The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.
    • 通过在包含金属的部件的金属表面(作为焊料粘合的部分)上施加包含卤素化合物的比例为0.2%以下的卤素的后通量进行焊接, 一个不透气的容器与防锈剂包一起以密封的方式。 本发明的方法以非常简单的方式以低成本,通过将包含金属的构件保持在其中不存在氧,水分或腐蚀性物质的还原气氛中,并以 该还原气体与包括金属构件的材料共存,并且使用含有少量卤素的助熔剂容易实现焊料的良好的接合性能。 因此,在焊接后不需要通过有机卤素系溶剂去除焊剂,可以简化清洗工序,降低成本。
    • 8. 发明授权
    • Inhibitor parcel and method for preserving electronic devices or
electronic parts
    • 用于保护电子设备或电子部件的抑制剂包裹和方法
    • US5510166A
    • 1996-04-23
    • US381403
    • 1995-01-31
    • Yoshiaki InoueShigeru MurabayashiYoshio YoshikawaTakeshi NagasakaYoshihiko HarimaIsamu Yoshino
    • Yoshiaki InoueShigeru MurabayashiYoshio YoshikawaTakeshi NagasakaYoshihiko HarimaIsamu Yoshino
    • B32B5/26B65D81/26B32B9/00
    • B32B5/26Y10S428/913Y10T428/1307Y10T428/1334Y10T428/1366Y10T428/23Y10T428/234Y10T428/239Y10T428/24562
    • Disclosed are an inhibitor parcel comprising (a) a composition comprising an unsaturated fatty acid compound as its main ingredient and (b) a permeable diffusing-parcelling material prepared by laminating and bonding an oxygen-permeable resin layer onto one side of a base sheet made of a fibrous material and an adhesive or onto one adhesive-coating side of a base sheet made of a fibrous material, then laminating and bonding thereonto an oxygen-permeable resin layer and laminating and bonding a porous film of low softening point resin or a low softening point unwoven fabric onto the other side of the base sheet, said permeable diffusing-parcelling material (b) having an oxygen permeability of 10.sup.4 to 10.sup.6 ml/m.sup.2.Atm.Day and a (water vapor permeability/oxygen permeability) ratio of 0.02 H.sub.2 O mg.Atm/O.sub.2 ml! or above at 25.degree. C. at a relative humidity of 50% and said composition (a) being parcelled by said permeable diffusing-parcelling material (b) and an inhibitor parcel for use in electronic devices and electronic parts which comprises said inhibitor parcel and a method for preserving electronic devices and electronic parts using said inhibitor parcel.
    • 公开了一种抑制剂包,其包含(a)包含不饱和脂肪酸化合物作为其主要成分的组合物和(b)通过将透氧性树脂层层压并粘合到制成的基片的一侧而制备的可渗透扩散分解材料 纤维材料和粘合剂或由纤维材料制成的基片的一个粘合剂涂布面上,然后层压并粘合到透氧树脂层上并层压和粘合低软化点树脂的多孔膜或低 软质点无纺织物在基片的另一侧上,透氧扩散分解材料(b)具有104至106ml / m 2的透氧性.Atm.Day和(水蒸汽透过率/氧透过率)比为0.02 [H2O mg.Atm / O 2 ml]或以上,相对湿度为50%的25℃,所述组合物(a)由所述可渗透扩散分解材料(b)和用于电子的抑制剂包裹 IC器件和包括所述抑制剂包裹的电子部件以及使用所述抑制剂包裹保存电子器件和电子部件的方法。