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1. 发明申请

US20100177953A1 DISC WAFER INSPECTING DEVICE AND INSPECTING METHOD 有权
标题翻译：光盘检测设备和检查方法
公开(公告)号：US20100177953A1
公开(公告)日：2010-07-15
申请号：US12376469
申请日：2007-08-09
申请人： Yoshinori Hayashi , Takeki Kogawa , Hideki Mori , Akimasa Hori
发明人： Yoshinori Hayashi , Takeki Kogawa , Hideki Mori , Akimasa Hori
IPC分类号： G06K9/00
CPC分类号： G01B11/08 , G01B11/24 , G01N21/9503 , G01R31/311
摘要： [Problem] An inspecting device and an inspecting method enabling better precision inspection for a processing region formed on a surface of a semiconductor wafer or other disc wafer are provided.[Means for Solution] The inspecting device is configured having image capturing means 130a, 130b for capturing an image of an outer edge and its neighboring region of a rotating wafer 10, wafer outer edge position measuring means 200 for measuring the radial direction position of the outer edge at each of the plurality of rotational angle positions θn of the wafer 10 based on the images obtained by the image capturing means 130a, 130b, an edge-to-edge distance measuring means 200 for measuring the edge-to-edge distance Bθn, between the outer edge of the wafer 10 and the edge of an insulating film 11 at each of the plurality of rotational angle positions θn based on the images obtained by the image capturing means 130a, and an inspection information generating means 200 for generating predetermined inspection information based on the radial direction position Aθn of the outer edge of the wafer 10 and the edge-to-edge distance Bθn.
摘要翻译： [问题]提供一种检查装置和对形成在半导体晶片或其他盘晶片的表面上的处理区域进行更好的精密检查的检查方法。 [解决方案]检查装置配置有用于捕获旋转晶片10的外边缘及其相邻区域的图像的图像捕获装置130a，130b，用于测量旋转晶片10的径向位置的晶片外边缘位置测量装置200 基于由图像捕获装置130a，130b获得的图像的晶片10的多个旋转角度位置＆amp; t的每一个的外边缘; n边缘到边缘距离测量装置200，用于测量边缘到边缘距离B＆amp; N; n，基于由图像捕获装置130a获得的图像，在多个旋转角度位置＆amp; tt中的每一个的晶片10的外边缘和绝缘膜11的边缘之间; n， n是根据晶片10的外边缘的径向位置A和距离n以及边缘到边缘距离B的关系产生预定检查信息的装置; n。

2. 发明申请

US20100074514A1 WAFER CONTAINING CASSETTE INSPECTION DEVICE AND METHOD 有权
标题翻译：包含CASSETTE检测装置的方法和方法
公开(公告)号：US20100074514A1
公开(公告)日：2010-03-25
申请号：US12517145
申请日：2007-12-04
申请人： Yoshinori Hayashi , Hideki Mori , Takeki Kogawa
发明人： Yoshinori Hayashi , Hideki Mori , Takeki Kogawa
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30108
摘要： To provide a wafer containing cassette inspection device capable of expressing external view attributes such as shapes of respective inspection object portions of water containing cassettes of different types under the same condition without changing imaging conditions for each of the types. A wafer containing cassette inspection device includes an imaging device (61) and a processing unit (50) which processes an image signal from the imaging device (61). The processing unit (50) includes: reference image generation means (S1, S2) which generates reference image information according to the image signal corresponding to a reference body (20) from the imaging device (61); image-to-be-inspected information generation means (S11) which generates image-to-be-inspected information according to the image signal corresponding to the inspection object portions in the wafer containing cassette (10) from the imaging device (61); image correction means (S12) which performs a process for obtaining a predetermined image from the reference image information on the image-to-be inspected information so as to generate corrected image information; and means (S14) which generates external view attribute information expressing external view attributes of the inspection object portions according to the corrected image information.
摘要翻译：提供能够在不改变每种类型的成像条件的情况下，在相同条件下，能够表现出含有不同类型的盒的水的各个检查对象部分的形状的外部视图属性的外观视图属性的晶片容纳盒检查装置。含晶片的盒检查装置包括处理来自成像装置（61）的图像信号的成像装置（61）和处理单元（50）。处理单元（50）包括：根据与成像装置（61）对应于参考体（20）的图像信号产生参考图像信息的参考图像生成装置（S1，S2）。图像检查信息生成装置（S11），根据与来自成像装置（61）的晶片容纳盒（10）中的检查对象部分对应的图像信号，生成被检查图像信息; 图像校正装置（S12），其从所述参考图像信息执行用于获得预定图像的处理，用于生成校正图像信息; 以及根据校正图像信息生成表示检查对象部分的外部视图属性的外部视图属性信息的装置（S14）。

3. 发明授权

US08094923B2 Wafer containing cassette inspection device and method 有权
标题翻译：晶圆盒检测装置及方法
公开(公告)号：US08094923B2
公开(公告)日：2012-01-10
申请号：US12517145
申请日：2007-12-04
申请人： Yoshinori Hayashi , Hideki Mori , Takeki Kogawa
发明人： Yoshinori Hayashi , Hideki Mori , Takeki Kogawa
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30108
摘要： A wafer containing cassette inspection device that expresses external view attributes such as shapes of respective inspection object portions of water containing cassettes of different types under the same condition without changing imaging conditions for each of the types. A wafer containing cassette inspection device includes an imaging device and a processing unit which processes an image signal from the imaging device. The processing unit includes: reference image generation means; image-to-be-inspected information generation means which generates image-to-be-inspected information; image correction means which performs a process for obtaining a predetermined image from the reference image information on the image-to-be inspected information; and means which generates external view attribute information expressing external view attributes of the inspection object portions according to the corrected image information.
摘要翻译：一种晶片容纳盒检查装置，其在相同条件下表示外部视图属性，例如不同类型的盒的水的各个检查对象部分的形状，而不改变每种类型的成像条件。含晶片盒检查装置包括成像装置和处理单元，其处理来自成像装置的图像信号。处理单元包括：参考图像生成装置; 图像被检查信息生成装置，其生成图像被检查信息; 图像校正装置，用于从参考图像信息执行用于获得预定图像的处理以获得被检查图像信息; 以及根据校正图像信息生成表示检查对象部分的外部视图属性的外部视图属性信息的装置。

4. 发明授权

US08107064B2 Disc wafer inspecting device and inspecting method 有权
标题翻译：圆盘检查装置及检查方法
公开(公告)号：US08107064B2
公开(公告)日：2012-01-31
申请号：US12376469
申请日：2007-08-09
申请人： Yoshinori Hayashi , Takeki Kogawa , Hideki Mori , Akimasa Hori
发明人： Yoshinori Hayashi , Takeki Kogawa , Hideki Mori , Akimasa Hori
IPC分类号： G01N21/00
CPC分类号： G01B11/08 , G01B11/24 , G01N21/9503 , G01R31/311
摘要： An inspecting device and an inspecting method enabling better precision inspection for a processing region formed on a surface of a semiconductor wafer or other disc wafer are provided. The inspecting device is configured having image capturing means 130a, 130b for capturing an image of an outer edge and its neighboring region of a rotating wafer 10, wafer outer edge position measuring means 200 for measuring the radial direction position of the outer edge at each of the plurality of rotational angle positions θn of the wafer 10 based on the images obtained by the image capturing means 130a, 130b, an edge-to-edge distance measuring means 200 for measuring the edge-to-edge distance Bθn between the outer edge of the wafer 10 and the edge of an insulating film 11 at each of the plurality of rotational angle positions θn based on the images obtained by the image capturing means 130a, and an inspection information generating means 200 for generating predetermined inspection information based on the radial direction position Aθn of the outer edge of the wafer 10 and the edge-to-edge distance Bθn.
摘要翻译：提供一种检查装置和对形成在半导体晶片或其他盘晶片的表面上的处理区域进行更好的精密检查的检查方法。检查装置被配置为具有用于捕获旋转晶片10的外边缘及其相邻区域的图像的图像捕获装置130a，130b，用于测量每一个的外边缘的径向位置的晶片外边缘位置测量装置200 基于由图像捕获装置130a，130b获得的图像的晶片10的多个旋转角度位置＆amp; n;用于测量边缘到边缘距离B＆amp; 以及基于由图像捕获装置130a获得的图像的晶片10的外边缘和绝缘膜11的边缘在多个旋转角度位置＆lt; t中的每一个;以及用于产生预定检查的检查信息产生装置200 基于晶片10的外边缘的径向位置A和距离n的信息和边缘到边缘距离B＆amp; t的信息; n。

5. 发明申请

US20100246934A1 INSPECTION DEVICE FOR DISK-SHAPED SUBSTRATE 失效
标题翻译：用于盘形基板的检查装置
公开(公告)号：US20100246934A1
公开(公告)日：2010-09-30
申请号：US12738760
申请日：2008-10-22
申请人： Yoshinori Hayashi , Hiroshi Wakaba , Yoko Ono , Koichi Miyazono , Hideki Mori
发明人： Yoshinori Hayashi , Hiroshi Wakaba , Yoko Ono , Koichi Miyazono , Hideki Mori
IPC分类号： G06K9/00
CPC分类号： H01L22/20 , G01N21/9503 , H01L22/12
摘要： An inspection apparatus of a disk-shaped substrate able to precisely quantitatively inspect positions of formation of film layers formed on the surface of a disk-shaped substrate is provided, that is, an inspection apparatus of a disk-shaped substrate on which film layers are formed designed to generate captured image data expressing a captured image corresponding to a field of view based on image signals successively output from an image capturing unit capturing an image of a predetermined surface at an outer circumference part of the disk-shaped substrate and to generate film layer edge position information Y4E24 (θ) expressing longitudinal direction positions at corresponding positions (θ) along the circumferential direction of an edge line E24 of a film layer image part ISa (24) corresponding to the film layer 24 on the surface image ISa with reference to, from the captured image data, longitudinal direction positions YE15aL (θ) at the different positions (θ) along the circumferential direction of a boundary line E15a between a surface image part ISa corresponding to the predetermined surface on the captured image and its outer image part IBKL.
摘要翻译：提供了能够精确地定量检查形成在盘状基板的表面上的膜层的形成位置的盘状基板的检查装置，即，其中膜层为被形成为基于从在盘状基板的外周部分捕获预定表面的图像的图像捕获单元连续输出的图像信号生成表示与视场相对应的拍摄图像的拍摄图像数据，并且生成胶片沿着与表面图像ISa上的薄膜层24相对应的薄膜层图像部分ISa（24）的边缘线E24的圆周方向的相应位置（＆amp;θ）表示纵向位置的层边缘位置信息Y4E24（＆参考来自拍摄图像数据的不同位置处的纵向位置YE15aL（＆amp; tas）沿着与捕获图像上的预定表面相对应的表面图像部分ISa与其外部图像部分IBKL之间的边界线E15a的圆周方向。

6. 发明申请

US20100066998A1 SURFACE INSPECTION APPARATUS 有权
标题翻译：表面检查装置
公开(公告)号：US20100066998A1
公开(公告)日：2010-03-18
申请号：US12595699
申请日：2008-04-25
申请人： Yoshinori Hayashi , Masao Kawamura , Hideki Mori
发明人： Yoshinori Hayashi , Masao Kawamura , Hideki Mori
IPC分类号： G01N21/00
CPC分类号： G01N21/9503
摘要： [Problem] To provide a surface inspection apparatus able to suitably inspect the outer circumference edge part of a semiconductor wafer or other plate-shaped member.[Technical Solution] A semiconductor wafer inspection apparatus 10 has a camera lens 22 arranged facing an outer circumference edge part 101 of a semiconductor wafer 100, an imaging surface 24 arranged facing an outer circumference end face of a semiconductor wafer 100 via the camera lens 22, a mirror 12 forming an image of a first outer circumference bevel surface 101b of the semiconductor wafer 100 on the imaging surface 24 via the camera lens 22, a mirror 14 forming an image of a second outer circumference bevel surface 101c of the semiconductor wafer 100 on the imaging surface 24 via the camera lens 22, a correction lens 26 forming an image of an outer circumference end face 101a of the semiconductor wafer 100 on the imaging surface 24 via the center part of the camera lens 22, and an illumination light guide lamp part 18 illuminating surfaces so that, compared with the outer circumference end face 101a, the first outer circumference bevel surface 101b and second outer circumference bevel surface 101c become brighter.
摘要翻译： [问题]提供一种能够适当地检查半导体晶片或其他板状部件的外周缘部的表面检查装置。技术方案半导体晶片检查装置10具有面向半导体晶片100的外周缘部101配置的摄像透镜22，经由照相机镜头22配置成与半导体晶片100的外周端面相对配置的摄像面24 ，通过照相机镜头22在成像面24上形成半导体晶片100的第一外周斜面101b的图像的反射镜12，形成半导体晶片100的第二外周斜面101c的图像的反射镜通过照相机镜头22在成像表面24上，通过照相机镜头22的中心部分在成像表面24上形成半导体晶片100的外周端面101a的图像的校正透镜26和照明光导灯部18照射表面，使得与外周端面101a相比，第一外周斜面101b和第二外圆周面斜面101c变得更亮。

7. 发明申请

US20090177415A1 Surface Roughness Inspection System 有权
标题翻译：表面粗糙度检测系统
公开(公告)号：US20090177415A1
公开(公告)日：2009-07-09
申请号：US12086081
申请日：2006-12-05
申请人： Yoshinori Hayashi , Hideki Mori
发明人： Yoshinori Hayashi , Hideki Mori
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01N21/9501
摘要： [Problem] To provide a surface roughness inspection system enabling suitable inspection even when the surface of the object being inspected is curved.[Means for Solution] A system having an imaging unit 20 having a line sensor 22 and scanning the surface of an object being inspected 101 in a direction perpendicular to the direction of extension of the line sensor 22 and outputting a density signal for each pixel from the line sensor 22 and a processing unit 50 processing the density signal from the line sensor 22 of the imaging unit 20, the processing unit 50 having a means for acquiring a pixel density value based on a density signal from the line sensor 22 (S2) and a density state generating means for generating a density state information Pf showing the density state in the scan direction of the object surface based on all of the pixel density values acquired for the object surface 101 being inspected (S7).
摘要翻译： [问题]提供一种表面粗糙度检查系统，即使被检查物体的表面弯曲，也能够进行适当的检查。 [解决方案]具有成像单元20的系统具有线传感器22，并且在垂直于线传感器22的延伸方向的方向上扫描被检查物体101的表面，并输出每个像素的浓度信号线传感器22和处理单元50处理来自成像单元20的线传感器22的浓度信号，处理单元50具有用于基于来自线传感器22的密度信号获取像素密度值的装置（S2）密度状态产生装置，用于基于对被检测物体表面101获得的所有像素密度值，生成表示物体表面的扫描方向上的浓度状态的浓度状态信息Pf（S7）。

8. 发明授权

US08488867B2 Inspection device for disk-shaped substrate 失效
标题翻译：盘状基板检查装置
公开(公告)号：US08488867B2
公开(公告)日：2013-07-16
申请号：US12738760
申请日：2008-10-22
申请人： Yoshinori Hayashi , Hiroshi Wakaba , Yoko Ono , Koichi Miyazono , Hideki Mori
发明人： Yoshinori Hayashi , Hiroshi Wakaba , Yoko Ono , Koichi Miyazono , Hideki Mori
IPC分类号： G06K9/00
CPC分类号： H01L22/20 , G01N21/9503 , H01L22/12
摘要： An inspection apparatus to precisely quantitatively inspect positions of formation of film layers formed on the surface of a disk-shaped substrate. It generates captured image data expressing a captured image corresponding to a field of vie based on image signals successively output from an image capturing unit capturing an image of a predetermined surface at an outer circumference part of the disk-shaped substrate and generates film layer edge position information expressing longitudinal direction positions at corresponding positions along the circumferential direction of an edge line of a film layer image pan corresponding to the film layer on the surface image with reference to, from the captured image data, longitudinal direction positions at the different positions along the circumferential direction of a boundary line between a surface image part corresponding to the predetermined surface on the captured image and its outer image part.
摘要翻译：一种精确定量检查形成在盘状基板的表面上的膜层的形成位置的检查装置。基于在从圆盘状基板的外周部拍摄预定面的图像的图像拍摄单元连续地输出的图像信号，生成表示对应于视野的拍摄图像的拍摄图像数据，并且生成胶片层边缘位置参照来自拍摄图像数据的沿着沿着图像数据的不同位置的纵向位置的表面图像上对应于胶片层的胶片层图像的边缘线的圆周方向的相应位置处的纵向位置的信息，在与捕获图像上的预定表面相对应的表面图像部分与其外部图像部分之间的边界线的圆周方向。

9. 发明授权

US08433102B2 Surface roughness inspection system 有权
标题翻译：表面粗糙度检测系统
公开(公告)号：US08433102B2
公开(公告)日：2013-04-30
申请号：US12086081
申请日：2006-12-05
申请人： Yoshinori Hayashi , Hideki Mori
发明人： Yoshinori Hayashi , Hideki Mori
IPC分类号： G06K9/00
CPC分类号： G01B11/303 , G01N21/9501
摘要： [Problem] To provide a surface roughness inspection system enabling suitable inspection even when the surface of the object being inspected is curved.[Means for Solution] A system having an imaging unit 20 having a line sensor 22 and scanning the surface of an object being inspected 101 in a direction perpendicular to the direction of extension of the line sensor 22 and outputting a density signal for each pixel from the line sensor 22 and a processing unit 50 processing the density signal from the line sensor 22 of the imaging unit 20, the processing unit 50 having a means for acquiring a pixel density value based on a density signal from the line sensor 22 (S2) and a density state generating means for generating a density state information Pf showing the density state in the scan direction of the object surface based on all of the pixel density values acquired for the object surface 101 being inspected (S7).
摘要翻译： [问题]提供一种表面粗糙度检查系统，即使被检查物体的表面弯曲，也能够进行适当的检查。 [解决方案]具有成像单元20的系统具有线传感器22，并且在垂直于线传感器22的延伸方向的方向上扫描被检查物体101的表面，并输出每个像素的浓度信号线传感器22和处理单元50处理来自成像单元20的线传感器22的浓度信号，处理单元50具有用于基于来自线传感器22的密度信号获取像素密度值的装置（S2）密度状态产生装置，用于基于对被检测物体表面101获得的所有像素密度值，生成表示物体表面的扫描方向上的浓度状态的浓度状态信息Pf（S7）。

10. 发明授权

US08023111B2 Surface inspection apparatus 有权
标题翻译：表面检查装置
公开(公告)号：US08023111B2
公开(公告)日：2011-09-20
申请号：US12595699
申请日：2008-04-25
申请人： Yoshinori Hayashi , Masao Kawamura , Hideki Mori
发明人： Yoshinori Hayashi , Masao Kawamura , Hideki Mori
IPC分类号： G01N21/88
CPC分类号： G01N21/9503
摘要： A semiconductor wafer inspection apparatus for inspecting an outer circumference edge part of a semiconductor wafer. The apparatus has a camera lens arranged facing an outer circumference edge part of a semiconductor wafer, an imaging surface arranged facing an outer circumference end face of a semiconductor wafer via the camera lens, a mirror forming an image of a first outer circumference bevel surface of the semiconductor wafer on the imaging surface via the camera lens, a mirror forming an image of a second outer circumference bevel surface of the semiconductor wafer on the imaging surface via the camera lens, a correction lens forming an image of an outer circumference end face of the semiconductor wafer on the imaging surface via the center part of the camera lens, and an illumination light guide lamp part illuminating the surfaces. With use of the apparatus the first outer circumference bevel surface and second outer circumference bevel surface become brighter compared with the outer circumference end face.
摘要翻译：一种用于检查半导体晶片的外周边缘部分的半导体晶片检查装置。该装置具有面向半导体晶片的外周缘部的相机透镜，经由照相机透镜与半导体晶片的外周端面相对配置的摄像面，形成第一外周斜面的图像的反射镜通过照相机镜头在成像表面上的半导体晶片，通过照相机镜头在成像表面上形成半导体晶片的第二外圆周斜面的图像的镜;校正透镜，其形成外周端面的图像通过照相机镜头的中心部分的成像表面上的半导体晶片和照亮该表面的照明光导灯部分。通过使用该装置，与外周端面相比，第一外周斜面和第二外圆周斜面变得更亮。

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