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1. 发明授权

US07927514B2 Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good 有权
标题翻译：环氧树脂用微胶囊型固化剂，环氧树脂用母料型固化剂组合物，单组分环氧树脂组合物，加工品
公开(公告)号：US07927514B2
公开(公告)日：2011-04-19
申请号：US12223523
申请日：2007-01-31
申请人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
发明人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
IPC分类号： H01B1/12 , C08F283/00 , C08K5/55
CPC分类号： C08G59/184 , C08G59/188 , Y10T428/2989
摘要： Provided is a microcapsule-based hardener for an epoxy resin, which have a core (C) formed using a hardener (H) for the epoxy resin as a starting material and a shell (S) for covering the core (C) therewith. Since it is characterized in that the hardener (H) for the epoxy resin has an average particle size exceeding 0.3 μm and not greater than 12 μm; a content of a small-particle-size hardener for epoxy resin defined to have a particle size 0.5 time or less of the average particle size of the hardener (H) for the epoxy resin is from 0.1 to 15%; and the shell (S) has, on the surface thereof, a binding group (x) capable of absorbing infrared rays having a wave number of from 1630 to 1680 cm−1, a binding group (y) capable of absorbing infrared rays having a wave number of from 1680 to 1725 cm−1, and a binding group (z) capable of absorbing infrared rays having a wave number of from 1730 to 1755 cm−1, it is excellent in storage stability and at the same time, in reaction rapidity.
摘要翻译：本发明提供一种环氧树脂微胶囊型固化剂，其具有使用环氧树脂作为原料的固化剂（H）形成的芯（C）和用于覆盖芯（C）的壳（S）。由于其特征在于环氧树脂的硬化剂（H）的平均粒径超过0.3μm且不大于12μm; 用于环氧树脂的小粒径固化剂的含量为环氧树脂的固化剂（H）的平均粒径的0.5倍以下的粒径为0.1〜15％壳体（S）的表面上具有能够吸收波数为1630〜1680cm -1的红外线的结合组（x），能够吸收红外线的结合基（y）具有 1680〜1725cm -1的波数和能够吸收1730〜1755cm -1的波数的红外线的结合基（z），其保存稳定性优异，同时在反应中速度快

2. 发明授权

US07854860B2 High-stability microencapsulated hardened for epoxy resin and epoxy resin composition 有权
标题翻译：高稳定性微胶囊硬化环氧树脂和环氧树脂组合物
公开(公告)号：US07854860B2
公开(公告)日：2010-12-21
申请号：US11991785
申请日：2006-09-29
申请人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
发明人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
IPC分类号： H01B1/12 , H01M2/16
CPC分类号： C08G59/188 , C08J3/241 , C08J2363/00 , H01L2924/0002 , Y10T428/149 , Y10T428/2989 , H01L2924/00
摘要： A microencapsulated latent hardener for epoxy resins which comprises cores (C) and shells (S) with which the cores are covered, characterized in that the cores (C) are ones formed from, as a starking material, particles of an epoxy resin hardener (H) comprising an amine adduct (A) and a low-molecular amine compound (B) as major ingredients and that the shells (S) have on the surface thereof connecting groups (x), (y), and (z) which absorb infrared. Also provided is an epoxy resin composition containing the hardener.
摘要翻译：一种用于环氧树脂的微胶囊化潜在硬化剂，其包括芯（C）和壳（S），芯被覆盖，其特征在于，芯（C）是由环氧树脂固化剂颗粒 H），其包含胺加合物（A）和低分子胺化合物（B）作为主要成分，并且所述壳（S）在其表面上具有吸收的连接基团（x），（y）和（z）红外线。还提供含有硬化剂的环氧树脂组合物。

3. 发明申请

US20090261298A1 High-Stability Microencapsulated Hardened for Epoxy Resin and Epoxy Resin Composition 有权
标题翻译：用于环氧树脂和环氧树脂组合物的高稳定性微胶囊化硬化
公开(公告)号：US20090261298A1
公开(公告)日：2009-10-22
申请号：US11991785
申请日：2006-09-29
申请人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
发明人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
IPC分类号： H01B1/12 , C08L63/00 , C08K5/55 , C09J163/00 , C09D163/00 , B32B1/00
CPC分类号： C08G59/188 , C08J3/241 , C08J2363/00 , H01L2924/0002 , Y10T428/149 , Y10T428/2989 , H01L2924/00
摘要： A microencapsulated latent hardener for epoxy resins which comprises cores (C) and shells (S) with which the cores are covered, characterized in that the cores (C) are ones formed from, as a starking material, particles of an epoxy resin hardener (H) comprising an amine adduct (A) and a low-molecular amine compound (B) as major ingredients and that the shells (S) have on the surface thereof connecting groups (x), (y), and (z) which absorb infrared. Also provided is an epoxy resin composition containing the hardener.
摘要翻译：一种用于环氧树脂的微胶囊化潜在硬化剂，其包括芯（C）和壳（S），芯被覆盖，其特征在于，芯（C）是由环氧树脂固化剂颗粒 H），其包含胺加合物（A）和低分子胺化合物（B）作为主要成分，并且所述壳（S）在其表面上具有吸收的连接基团（x），（y）和（z）红外线。还提供含有硬化剂的环氧树脂组合物。

4. 发明申请

US20090186962A1 Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good 有权
标题翻译：用于环氧树脂的微胶囊基固化剂，环氧树脂的母料基固化剂组合物，单组分环氧树脂组合物和加工良好
公开(公告)号：US20090186962A1
公开(公告)日：2009-07-23
申请号：US12223523
申请日：2007-01-31
申请人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
发明人： Yoshikimi Kondo , Hiroshi Uchida , Kazuhiro Daikai
IPC分类号： C08L63/00 , C08J3/22
CPC分类号： C08G59/184 , C08G59/188 , Y10T428/2989
摘要： Provided is a microcapsule-based hardener for an epoxy resin, which have a core (C) formed using a hardener (H) for the epoxy resin as a starting material and a shell (S) for covering the core (C) therewith. Since it is characterized in that the hardener (H) for the epoxy resin has an average particle size exceeding 0.3 μm and not greater than 12 μm; a content of a small-particle-size hardener for epoxy resin defined to have a particle size 0.5 time or less of the average particle size of the hardener (H) for the epoxy resin is from 0.1 to 15%; and the shell (S) has, on the surface thereof, a binding group (x) capable of absorbing infrared rays having a wave number of from 1630 to 1680 cm−1, a binding group (y) capable of absorbing infrared rays having a wave number of from 1680 to 1725 cm−1, and a binding group (z) capable of absorbing infrared rays having a wave number of from 1730 to 1755 cm−1, it is excellent in storage stability and at the same time, in reaction rapidity.
摘要翻译：本发明提供一种环氧树脂微胶囊型固化剂，其具有使用环氧树脂作为原料的固化剂（H）形成的芯（C）和用于覆盖芯（C）的壳（S）。由于其特征在于环氧树脂的硬化剂（H）的平均粒径超过0.3μm且不大于12μm; 用于环氧树脂的小粒径固化剂的含量为环氧树脂的固化剂（H）的平均粒径的0.5倍以下的粒径为0.1〜15％壳体（S）的表面上具有能够吸收波数为1630〜1680cm -1的红外线的结合组（x），能够吸收红外线的结合基（y）具有 1680〜1725cm -1的波数和能够吸收1730〜1755cm -1的波数的红外线的结合基（z），其保存稳定性优异，同时在反应中速度快

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