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1. 发明授权

US5637917A Lead frame assembly for a semiconductor device 失效
标题翻译：用于半导体器件的引线框组件
公开(公告)号：US5637917A
公开(公告)日：1997-06-10
申请号：US626956
申请日：1996-04-03
申请人： Yoshihiro Tomita , Michitaka Kimura , Yoshihiro Kashiba
发明人： Yoshihiro Tomita , Michitaka Kimura , Yoshihiro Kashiba
IPC分类号： H01L23/50 , H01L23/495
CPC分类号： H01L23/49541 , H01L23/49537 , H01L24/32 , H01L2224/32245 , H01L2924/12042 , H01L2924/12044 , H01L2924/3011
摘要： A lead frame assembly for a semiconductor device includes a lead frame having a lead frame main body and a first welding region, and a die pad frame having a die pad frame main body, a die pad frame, and a second welding region for welding to the first welding region of said lead frame main body. At least one of the first and second welding regions includes a welding pad for welding to the other welding region and a support bridge connected between the welding pad and a respective frame main body, supporting the welding pad from the respective frame main body, the support bridge including an element for suppressing transmission of at least one of mechanical force, heat, and electrical current.
摘要翻译：一种用于半导体器件的引线框架组件，包括具有引线框架主体和第一焊接区域的引线框架，以及具有管芯焊盘框架主体，管芯焊盘框架和第二焊接区域的管芯焊盘框架，所述引线框架主体的第一焊接区域。第一焊接区域和第二焊接区域中的至少一个包括用于焊接到另一个焊接区域的焊接焊盘和连接在焊接区域和相应的框架主体之间的支撑桥梁，其从相应的框架主体支撑焊接焊盘，支撑件桥，包括用于抑制机械力，热和电流中的至少一个的传递的元件。

2. 发明授权

US06867484B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06867484B2
公开(公告)日：2005-03-15
申请号：US10247289
申请日：2002-09-20
申请人： Dai Nakajima , Yoshihiro Kashiba , Hideaki Chuma
发明人： Dai Nakajima , Yoshihiro Kashiba , Hideaki Chuma
IPC分类号： H01L25/10 , H01L25/07 , H01L25/11 , H01L25/18 , H05K3/30 , H01L23/02
CPC分类号： H01L25/115 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/01057 , H01L2924/01068 , H01L2924/1305 , H01L2924/13055 , H01L2924/30107 , H05K3/301 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device with a package fixed to a case, comprising: a package where a semiconductor element and a lead terminal connected to the semiconductor element are sealed up; and a case formed by a frame member and an external terminal disposed to the frame member, characterized in that the package is located inside the frame of the case and the lead terminal is connected with the external terminal.
摘要翻译：一种具有固定到壳体的封装的半导体器件，包括：封装，半导体元件和连接到所述半导体元件的引线端子被封闭; 以及由框架构件和设置在框架构件上的外部端子形成的壳体，其特征在于，所述封装位于所述壳体的框架内部，并且所述引线端子与所述外部端子连接。

3. 发明授权

US06794890B1 Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested 失效
标题翻译：测试插座，测试插座的制造方法，使用测试插座的测试方法和要测试的部件
公开(公告)号：US06794890B1
公开(公告)日：2004-09-21
申请号：US09625047
申请日：2000-07-24
申请人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
发明人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
IPC分类号： G01R1073
CPC分类号： G01R1/0466 , G01R1/06716 , G01R1/06738
摘要： Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.
摘要翻译：两个弹性部分连接到要与属于电子装置或半导体封装的测试插座的触点的外部连接端子接触的尖端。弹性部分彼此相对设置并弯曲成相对于尖端水平延伸。向下施加在尖端上的力均等地分布在多个弹性部分之间。弹性部分最终向下偏转而不涉及水平滑动作用。与弯曲部分的向下偏转相对应地施加在尖端上的力使得尖端与外部连接端子压接，而不会引起尖端相对于外部连接端子的水平滑动。

4. 发明授权

US06741086B2 Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus 失效
标题翻译：用于除去附着于探针尖端的异物的部件和制造探针尖端的方法，清洁附着在探针尖端的异物的方法，探针和探测装置
公开(公告)号：US06741086B2
公开(公告)日：2004-05-25
申请号：US10126982
申请日：2002-04-22
申请人： Shigeki Maekawa , Megumi Takemoto , Yoshihiro Kashiba
发明人： Shigeki Maekawa , Megumi Takemoto , Yoshihiro Kashiba
IPC分类号： B08B100
CPC分类号： B08B1/00 , G01R1/06738 , G01R3/00
摘要： The present invention provides a member for removing foreign matter adhering to the spherical tip portion of a test probe which is put into contact with the bonding pads of a semiconductor chip to test the action of the semiconductor chip. The member includes four essential layers of a base plate, a first elastic member on the base plate and flexibly deformable upon contact of the probe, specifically, a predetermined Young's modulus, a second elastic member on the first elastic member and having a tensile strength and a thickness responding to contact stress produced by the contact of the probe, and an abrasive layer on the second elastic member and made of hard particles and a binding material in a volume ratio providing a smooth sliding action of the probe and producing a high abrasive efficiency to any adhering foreign matter. The removing member can smoothly slide the probe to effectively remove the foreign matter adhering to the probe tip.
摘要翻译：本发明提供了一种用于去除与半导体芯片的接合焊盘接触的测试探针的球形尖端部分的异物的元件，以测试半导体芯片的作用。所述构件包括基板的四个基本层，所述基板上的第一弹性构件，并且在所述探针接触时可挠曲，特别是预定的杨氏模量，所述第一弹性构件上的第二弹性构件，响应于由探针接触产生的接触应力的厚度和第二弹性构件上的研磨层，由硬颗粒和结合材料制成的体积比提供了探针的平滑滑动作用并产生高的研磨效率任何粘附的异物。移除构件可以平滑地滑动探针，以有效地去除粘附到探针尖端的异物。

5. 发明授权

US07112976B2 Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested 失效
标题翻译：测试插座，测试插座的制造方法，使用测试插座的测试方法和要测试的部件
公开(公告)号：US07112976B2
公开(公告)日：2006-09-26
申请号：US10842554
申请日：2004-05-11
申请人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
发明人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
IPC分类号： G01R1/067
CPC分类号： G01R1/0466 , G01R1/06716 , G01R1/06738
摘要： Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.
摘要翻译：两个弹性部分连接到要与属于电子装置或半导体封装的测试插座的触点的外部连接端子接触的尖端。弹性部分彼此相对设置并弯曲成相对于尖端水平延伸。向下施加在尖端上的力均等地分布在多个弹性部分之间。弹性部分最终向下偏转而不涉及水平滑动作用。与弯曲部分的向下偏转相对应地施加在尖端上的力使得尖端与外部连接端子压接，而不会引起尖端相对于外部连接端子的水平滑动。

6. 发明授权

US06646455B2 Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter 失效
标题翻译：用于半导体器件的测试探针，其制造方法和用于除去异物的部件
公开(公告)号：US06646455B2
公开(公告)日：2003-11-11
申请号：US09121870
申请日：1998-07-24
申请人： Shigeki Maekawa , Megumi Takemoto , Kazunobu Miki , Mutsumi Kano , Takahiro Nagata , Yoshihiro Kashiba
发明人： Shigeki Maekawa , Megumi Takemoto , Kazunobu Miki , Mutsumi Kano , Takahiro Nagata , Yoshihiro Kashiba
IPC分类号： B08B100
CPC分类号： G01R1/06738 , G01R1/06755 , G01R3/00
摘要： A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of: &thgr;=cos−1(1−t/R)≧15° where the radius of curvature of the spherical surface is R, the thickness of the pad is t, and the angle formed at the pad surface between the tangential line with respect to the probe tip face and the pad surface when the probe is pressed against the pad is &thgr;, the probe have a flat portion at an end of the tip portion. Accordingly, a contact surface can be established between the probe trip and the pad with a sufficient degree of electrical continuity, and when the the probe level is adjusted in the probing, a time required for positioning the probe prior to the start of measurement is cut down and variation in measurement are reduced.
摘要翻译：一种用于半导体器件的测试探针，所述测试探针具有被压靠在半导体器件的测试焊盘上的尖端部分，以建立所述尖端部分和所述焊盘之间的电接触，以测试所述半导体器件的操作，其中形成所述探针在探针被压靠在衬垫上时，具有相对于探针的尖端面的切线与衬垫表面之间形成有不小于15度的角度的尖端形状，所述探针具有满足以下关系的球面的球面：其中球面的曲率半径为R，垫的厚度为t，并且在相对于探针尖端的切线之间形成在垫表面处的角度当探针被压靠在垫上时，表面和垫表面是θ，探针在尖端部分的端部具有平坦部分。因此，可以在探针跳闸和焊盘之间建立足够的电连续性的接触表面，并且当在探测中调整探针电平时，切割在测量开始之前定位探针所需的时间被切断降低了测量的变化。

7. 发明授权

US06628127B2 Probe card for testing semiconductor integrated circuit and method of manufacturing the same 失效
标题翻译：用于测试半导体集成电路的探针卡及其制造方法
公开(公告)号：US06628127B2
公开(公告)日：2003-09-30
申请号：US09748279
申请日：2000-12-27
申请人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yoshinori Deguchi , Masahiro Tanaka
发明人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yoshinori Deguchi , Masahiro Tanaka
IPC分类号： G01R1073
CPC分类号： G01R1/06761 , G01R1/06738 , G01R1/07314 , G01R3/00
摘要： A probe card 8 for testing a semiconductor integrated circuit is provided with a plurality of probes for inputting/outputting an electric signal for verifying the operation of a semiconductor integrated circuit 6 to/from bonding pads 7 of the semiconductor integrated circuit. The probes 9 are formed by depositing a conductive film 11 on a surface of a plurality of convex portions formed on a surface of an insulating substrate 10.
摘要翻译：用于测试半导体集成电路的探针卡8设置有用于输入/输出用于验证半导体集成电路6到半导体集成电路的焊盘7的半导体集成电路6的操作的电信号的多个探针。探针9通过在形成在绝缘基板10的表面上的多个凸部的表面上沉积导电膜11而形成。

8. 发明授权

US07274195B2 Semiconductor device test probe 有权
标题翻译：半导体器件测试探头
公开(公告)号：US07274195B2
公开(公告)日：2007-09-25
申请号：US10645595
申请日：2003-08-22
申请人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yoshinori Deguchi , Kazunobu Miki
发明人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yoshinori Deguchi , Kazunobu Miki
IPC分类号： G01R31/00
CPC分类号： G01R1/06738 , G01R1/06711 , H01L2224/48463 , H01L2924/01037 , H01L2924/01057 , H01L2924/01079
摘要： A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 9t≦r≦35t, where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 μm to 30 μm and larger than that of the second curved surface. The test probe may be manufactured by a method comprising the steps of roughing the tip portion of the curved surface by abrasing by means of electrolyte abrasion or abrasing particles to form a symmetrical spherical curved surface, and finishing the tip portion by sliding it on an abrasive member comprising an elastically deformable thick film fixed to a substrate and having abrasive particles therein or thereon directly or through a metallic film.
摘要翻译：一种半导体器件测试探针，其具有尖端部分，用于抵抗集成半导体器件的电极焊盘，以建立与电极焊盘的电接触，以测试半导体器件的功能。球形尖端部分具有由9t <= r <= 35t表示的曲率半径r，其中r是球面的曲率半径，t是电极焊盘的厚度。尖端部分可以具有基本上位于探头滑动方向上的第一弯曲表面，当探头被推靠在电极垫上并相对于电极焊盘滑动时，第一弯曲表面与第一弯曲表面相对的第二弯曲表面。第一曲面的曲率半径为7μm〜30μm，大于第二曲面的曲率半径。测试探针可以通过以下方法制造，该方法包括以下步骤：通过利用电解质磨损或磨损颗粒进行磨损来粗糙化弯曲表面的尖端部分以形成对称的球形曲面，并且通过将其磨削在磨料上来完成尖端部分其包括固定到基底的可弹性变形的厚膜，其上直接或通过金属膜在其中或其上具有磨料颗粒。

9. 发明申请

US20060038575A1 Semiconductor device test probe 有权
标题翻译：半导体器件测试探头
公开(公告)号：US20060038575A1
公开(公告)日：2006-02-23
申请号：US11206167
申请日：2005-08-18
申请人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yoshinori Deguchi , Kazunobu Miri
发明人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yoshinori Deguchi , Kazunobu Miri
IPC分类号： G01R31/02
CPC分类号： G01R1/06738 , G01R1/06711 , H01L2224/48463 , H01L2924/01037 , H01L2924/01057 , H01L2924/01079
摘要： A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 9t≦r≦35t where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 μm to 30 μm and larger than that of the second curved surface. The test probe may be manufactured by a method comprising the steps of roughing the tip portion of the curved surface by abrasing by means of electrolyte abrasion or abrasing particles to form a symmetrical spherical curved surface, and finishing the tip portion by sliding it on an abrasive member comprising an elastically deformable thick film fixed to a substrate and having abrasive particles therein or thereon directly or through a metallic film.
摘要翻译：一种半导体器件测试探针，其具有尖端部分，用于抵抗集成半导体器件的电极焊盘，以建立与电极焊盘的电接触，以测试半导体器件的功能。球形尖端部分具有由9t <= r <= 35t表示的曲率半径r，其中r是球面的曲率半径，t是电极焊盘的厚度。尖端部分可以具有基本上位于探头滑动方向上的第一弯曲表面，当探头被推靠在电极垫上并相对于电极焊盘滑动时，第一弯曲表面与第一弯曲表面相对的第二弯曲表面。第一曲面的曲率半径为7μm〜30μm，大于第二曲面的曲率半径。测试探针可以通过以下方法制造，该方法包括以下步骤：通过利用电解质磨损或磨损颗粒进行磨损来粗糙化弯曲表面的尖端部分以形成对称的球形曲面，并且通过将其磨削在磨料上来完成尖端部分其包括固定到基底的可弹性变形的厚膜，其上直接或通过金属膜在其中或其上具有磨料颗粒。

10. 发明授权

US06885204B2 Probe card, and testing apparatus having the same 失效
标题翻译：探头卡和测试装置具有相同的功能
公开(公告)号：US06885204B2
公开(公告)日：2005-04-26
申请号：US10649930
申请日：2003-08-28
申请人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yuetsu Watanabe
发明人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yuetsu Watanabe
IPC分类号： G01R31/26 , G01R1/067 , G01R1/073 , H01L21/66 , G01R31/02
CPC分类号： G01R1/07342 , G01R1/0675 , G01R1/07385
摘要： Multiple probe needles are arranged to be brought into contact with one electrode pad with a probe card, the multiple probe needles are connected in parallel with the same potential, and configured so that the amount of current flowing through the probe needles is at least halved, thereby decreasing generation of heat from Joule heat, and preventing melting of aluminum of which the electrode pads are composed. Consequently, a probe card can be provided wherein adhesion of molten material to the probe needles is suppressed, and wherein increased contact resistance due to oxidization of the material which has melted and adhered is prevented.
摘要翻译：多个探针被布置成与一个具有探针卡的电极焊盘接触，多个探针针头以相同的电位并联连接，并配置成使得流过探针的电流量至少减半，从而减少焦耳热产生的热量，并防止组成电极焊盘的铝的熔化。因此，可以提供一种探针卡，其中熔融材料对探针的粘附被抑制，并且其中防止由于熔化和粘附的材料的氧化引起的增加的接触电阻。

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