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1. 发明授权

US10005975B2 Fuel separation method 有权
公开(公告)号：US10005975B2
公开(公告)日：2018-06-26
申请号：US14762122
申请日：2013-01-18
申请人： Yoshihiro Iwashita , Takanori Ueda , Randall D. Partridge , Robert Lucchesi , Paul O. Johnson , George L. Kellogg
发明人： Yoshihiro Iwashita , Takanori Ueda , Randall D. Partridge , Robert Lucchesi , Paul O. Johnson , George L. Kellogg
IPC分类号： C10L1/18 , B01D61/00 , B01D61/36 , F02D19/06 , C10L1/182
CPC分类号： C10L1/18 , B01D61/00 , B01D61/362 , B01D2311/08 , B01D2311/25 , C10L1/1824 , C10L2270/023 , C10L2290/548 , F02D19/0655 , F02D19/0671 , Y02T10/36 , B01D2311/04
摘要： A fuel separation method by which auxiliary fuel is separated from blended gasoline fuel for a flexible fuel vehicle capable of using ethanol-blended gasoline fuel, the method including the following steps (a) and (b): (a) a step in which, when the ethanol concentration is low, the blended gasoline fuel is separated by a polar separating membrane member at a relatively high separation temperature to obtain, at the permeation side of the membrane, a first auxiliary fuel enriched with the aromatic gasoline components and ethanol component, and (b) a step in which, when the ethanol concentration is high, the blended gasoline fuel is separated by a polar separating membrane member at a relatively low second separation temperature to obtain, at the permeation side of the membrane, a second auxiliary fuel enriched with the non-aromatic high-volatile gasoline components.

2. 发明授权

US06996322B2 Dispersion compensation module 失效
标题翻译：色散补偿模块
公开(公告)号：US06996322B2
公开(公告)日：2006-02-07
申请号：US10719390
申请日：2003-11-20
申请人： Kevin W. Bennett , Paul O. Johnson , Paul C. Trifoso , Todd M. Wetherill
发明人： Kevin W. Bennett , Paul O. Johnson , Paul C. Trifoso , Todd M. Wetherill
IPC分类号： G02B6/00
CPC分类号： G02B6/4457 , G02B6/02214
摘要： The invention is directed to a dispersion compensation module of extremely simple design that does not rely on a spool-and-hub or similar device for holding the optical fiber used in the module, such module being here termed a “Free-Fiber dispersion compensation module”. In the inventive dispersion compensation module the optical fiber therein is in a relaxed coiled configuration having minimal tension. It has also been discovered that while coil tension is relieved by removing it from the winding spool prior to placing it in the dispersion compensation module, the tension can be further relieved by coating the coiled fiber with a finely powdered substance which will not react with or otherwise harm or damage wither the fiber or the module containing it, for example, talcum powder.
摘要翻译：本发明涉及一种非常简单设计的色散补偿模块，其不依赖于用于保持模块中使用的光纤的线轴和集线器或类似装置，这种模块在这里被称为“自由光纤色散补偿模块 “。在本发明的色散补偿模块中，其中的光纤处于具有最小张力的松弛线圈构造。还已经发现，当将线圈张力放置在分散补偿模块中之前，通过将其从卷绕卷轴上取下来可以减轻线圈张力，通过用不会与否则会损害或损坏纤维或含有它的模块，例如滑石粉。

3. 发明授权

US06270688B1 Chemical polishing of barium strontium titanate 失效
标题翻译：钛酸钡锶的化学抛光
公开(公告)号：US06270688B1
公开(公告)日：2001-08-07
申请号：US08224211
申请日：1994-04-07
申请人： James F. Belcher , Howard R. Beratan , Paul O. Johnson
发明人： James F. Belcher , Howard R. Beratan , Paul O. Johnson
IPC分类号： B44C122
CPC分类号： B24B37/04 , C04B41/5353 , Y10S505/728
摘要： A method of polishing ferroelectric materials and specifically perovskite materials and still more specifically barium strontium titanate (1) wherein the surface (5) to be polished is initially partially smoothened or planarized by mechanical abrading with final smoothening or planarization provided by a chemical polishing with a polishing wheel using an acidic solution containing essentially the acid, hydrogen peroxide and water. Preferred acids are perchloric acid, acetic acid, nitric acid and combinations thereof.
摘要翻译：抛光铁电材料和特别是钙钛矿材料的方法，更具体地说是钛酸钡锶（1），其中待抛光的表面（5）通过机械研磨初步部分平滑化或平面化，最终的平滑化或平面化通过化学抛光提供，抛光轮使用基本上含有酸，过氧化氢和水的酸性溶液。优选的酸是高氯酸，乙酸，硝酸及其组合。

4. 发明授权

US5604977A Method of fabricating focal plane array 失效
标题翻译：焦平面阵列的制作方法
公开(公告)号：US5604977A
公开(公告)日：1997-02-25
申请号：US478570
申请日：1995-06-07
申请人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
发明人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
IPC分类号： G01J1/02 , G01J5/34 , G01J5/48 , H01L37/02 , H04N5/33 , H01R43/00
CPC分类号： G01J5/34 , H01L37/02 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144
摘要： A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).
摘要翻译：热检测系统（10）包括焦平面阵列（12），热隔离结构（14）和集成电路基板（16）。焦平面阵列（12）包括热传感器（28），每个具有相关联的热敏元件（30）。热敏元件（30）与一侧耦合到红外线吸收器和公共电极组件（36），并且与设置在集成电路衬底（16）上的相关接触焊盘（20）的相对侧耦合。相邻的热敏元件（30a，30b，30c）与单个热敏元件（30a，30b，30c）的平均宽度（44,46）的至少一半的距离分开。可以在热敏元件（30a，30b，30c）上设置连续的非网状光学涂层（38），以最大程度地吸收入射到焦平面阵列（12）的热辐射。

5. 发明授权

US06352195B1 Method of forming an electronic package with a solder seal 失效
标题翻译：用焊接密封形成电子封装的方法
公开(公告)号：US06352195B1
公开(公告)日：2002-03-05
申请号：US09664198
申请日：2000-09-18
申请人： Frank E. Guthrie , Paul O. Johnson
发明人： Frank E. Guthrie , Paul O. Johnson
IPC分类号： B23K3102
CPC分类号： H01L23/10 , B23K1/008 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/00
摘要： A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.
摘要翻译：一种将其上至少具有金属表面的盖子附接到基板上以使用具有不期望的氧化物表面并与盖子上的金属表面相关并且与盖子的叠加和邻接关系的无助焊剂预制件包围表面声波电子电路的方法围绕电子电路的金密封环，以形成在具有氢气气氛的炉中加热的单元，使得氢通过与其中的氧结合而从焊料预制件和盖上的金属表面除去任何不期望的氧化物表面，以形成从而从焊料预成型件和盖金属表面去除任何氧化物表面，并且使得无金属焊料预成型件与金密封环和盖金属表面完全结合，从而形成气密密封的封装。

6. 发明授权

US6119920A Method of forming an electronic package with a solder seal 失效
公开(公告)号：US6119920A
公开(公告)日：2000-09-19
申请号：US770268
申请日：1996-12-20
申请人： Frank E. Guthrie , Paul O. Johnson
发明人： Frank E. Guthrie , Paul O. Johnson
IPC分类号： B23K1/008 , H01L23/10 , B23K1/00
CPC分类号： H01L23/10 , B23K1/008 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701
摘要： A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.

7. 发明授权

US5457318A Thermal detector apparatus and method using reduced thermal capacity 失效
标题翻译：热检测装置和使用降低热容量的方法
公开(公告)号：US5457318A
公开(公告)日：1995-10-10
申请号：US235413
申请日：1994-04-29
申请人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
发明人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
IPC分类号： G01J1/02 , G01J5/34 , G01J5/48 , H01L37/02 , H04N5/33 , G01J5/06
CPC分类号： G01J5/34 , H01L37/02 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144
摘要： A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).
摘要翻译：热检测系统（10）包括焦平面阵列（12），热隔离结构（14）和集成电路基板（16）。焦平面阵列（12）包括热传感器（28），每个具有相关联的热敏元件（30）。热敏元件（30）与一侧耦合到红外线吸收器和公共电极组件（36），并且与设置在集成电路衬底（16）上的相关接触焊盘（20）的相对侧耦合。相邻的热敏元件（30a，30b，30c）与单个热敏元件（30a，30b，30c）的平均宽度（44,46）的至少一半的距离分开。可以在热敏元件（30a，30b，30c）上设置连续的非网状光学涂层（38），以最大程度地吸收入射到焦平面阵列（12）的热辐射。

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