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1. 发明授权

US06352195B1 Method of forming an electronic package with a solder seal 失效
标题翻译：用焊接密封形成电子封装的方法
公开(公告)号：US06352195B1
公开(公告)日：2002-03-05
申请号：US09664198
申请日：2000-09-18
申请人： Frank E. Guthrie , Paul O. Johnson
发明人： Frank E. Guthrie , Paul O. Johnson
IPC分类号： B23K3102
CPC分类号： H01L23/10 , B23K1/008 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/00
摘要： A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.
摘要翻译：一种将其上至少具有金属表面的盖子附接到基板上以使用具有不期望的氧化物表面并与盖子上的金属表面相关并且与盖子的叠加和邻接关系的无助焊剂预制件包围表面声波电子电路的方法围绕电子电路的金密封环，以形成在具有氢气气氛的炉中加热的单元，使得氢通过与其中的氧结合而从焊料预制件和盖上的金属表面除去任何不期望的氧化物表面，以形成从而从焊料预成型件和盖金属表面去除任何氧化物表面，并且使得无金属焊料预成型件与金密封环和盖金属表面完全结合，从而形成气密密封的封装。

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