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    • 1. 发明授权
    • Polishing apparatus and polishing method
    • 抛光设备和抛光方法
    • US06511362B1
    • 2003-01-28
    • US09717103
    • 2000-11-22
    • Yoshifumi AkaikeTakashi SuzukiHiroyuki Nagai
    • Yoshifumi AkaikeTakashi SuzukiHiroyuki Nagai
    • B24B4900
    • B24B37/042B24B27/0084B24B41/04
    • A polishing apparatus and a polishing method capable of suppressing an excessive polishing of an outer circumferential edge surface of a surface to be polished of a polished object to be polished due to elastic deformation of a polishing tool and capable of stabilizing a polishing rate, wherein polishing is carried out by inclining a shaft of a polishing tool with an angle &agr; toward a direction of advance of the movement of the polishing tool to a direction perpendicular to a holding surface of a rotation table, then inclining the shaft of the polishing tool in a direction reducing elastic deformation of a polishing surface in a region where the polishing surface rides up on an outer circumferential edge of a surface to be polished of a wafer to the direction perpendicular to the holding face.
    • 一种抛光装置和抛光方法,其能够抑制由于抛光工具的弹性变形而导致的待抛光被抛光物体的待抛光表面的外周边缘表面的过度抛光,并且能够稳定抛光速率,其中抛光 是通过将抛光工具的轴倾斜成与研磨工具的移动方向前进的角度α朝向与旋转台的保持表面垂直的方向,然后将抛光工具的轴倾斜在 使抛光面在抛光面抛光的外周缘到与保持面垂直的方向的区域内的研磨面的弹性变形。