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    • 1. 发明授权
    • Electroplating apparatus
    • 电镀设备
    • US5441619A
    • 1995-08-15
    • US163069
    • 1993-12-06
    • Norio KawachiMidori ItoToshiharu NakaHidenori Tsuji
    • Norio KawachiMidori ItoToshiharu NakaHidenori Tsuji
    • C25D5/08C25D7/00C25D7/06C25D17/00C25D21/00C25D21/12C25D21/14H05K3/24
    • H05K3/241C25D17/00C25D17/005C25D17/10C25D21/12C25D7/0614
    • An electroplating apparatus capable of forming a film of a uniform thickness on a substrate for printed wiring irrespective of a size of the substrate. Insoluble anode plates are arranged in a plurality of pairs in an electroplating tank in a manner to be juxtaposed to each other along a transfer passage along which the substrate is horizontally transferred and electrically independent from each other for every pair. The insoluble anode plates in each pair are arranged so as to be vertically spaced from each other with the transfer passage being interposed therebetween and are independently connected to an anode terminal of each of rectifiers. Cathode terminals of the rectifiers are electrically connected together to clips for holding the substrate. Electroplating on the substrate is carried out by feeding only the insoluble anode plates contained in a plane of projection of the substrate defined in a vertical direction of the substrate with electricity.
    • 一种能够在基板上形成均匀厚度的印刷电路的电镀设备,而与基板的尺寸无关。 不溶性阳极板以电镀槽中的多对形式配置,沿着沿基板被水平传送的传送通道相互并列并且彼此彼此电独立的方式彼此并列。 每对中的不溶性阳极板被布置成彼此垂直间隔开,传输通道插入其间,并且独立地连接到每个整流器的阳极端子。 整流器的阴极端子一起电连接到用于保持基板的夹子。 基板上的电镀仅通过仅供给包含在基板的垂直方向上限定的基板的投影平面中的不溶性阳极板进行。