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    • 5. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110133178A1
    • 2011-06-09
    • US12957434
    • 2010-12-01
    • Shunpei YAMAZAKIDaisuke KAWAEHiromichi GODO
    • Shunpei YAMAZAKIDaisuke KAWAEHiromichi GODO
    • H01L27/092H01L29/12
    • H01L29/45H01L27/1225H01L29/7869
    • One object is to provide a p-channel transistor including an oxide semiconductor. Another object is to provide a complementary metal oxide semiconductor (CMOS) structure of an n-channel transistor including an oxide semiconductor and a p-channel transistor including an oxide semiconductor. A p-channel transistor including an oxide semiconductor includes a gate electrode layer, a gate insulating layer, an oxide semiconductor layer, and a source and drain electrode layers in contact with the oxide semiconductor layer. When the electron affinity and the band gap of an oxide semiconductor used for the oxide semiconductor layer in the semiconductor device, respectively, are χ (eV) and Eg (eV), the work function (φm) of the conductor used for the source electrode layer and the drain electrode layer satisfies φm>χ+Eg/2 and the barrier for holes (φBp) represented by (χ+Eg−φm) is less than 0.25 eV.
    • 一个目的是提供一种包括氧化物半导体的p沟道晶体管。 另一个目的是提供包括氧化物半导体的n沟道晶体管和包括氧化物半导体的p沟道晶体管的互补金属氧化物半导体(CMOS)结构。 包括氧化物半导体的p沟道晶体管包括与氧化物半导体层接触的栅极电极层,栅极绝缘层,氧化物半导体层以及源极和漏极电极层。 当半导体器件中用于氧化物半导体层的氧化物半导体的电子亲和力和带隙分别为χ(eV)和Eg(eV)时,用于该半导体器件的导体的功函数(&phgr; m) 源电极层和漏电极层满足< m +χ+ Eg / 2,并且由(χ+ Eg-&phgr; m)表示的空穴屏障(&phgr; Bp)小于0.25eV。