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1. 发明申请

US20050236265A1 Switch integrated casing and electronic equipment having the casing 有权
标题翻译：开关具有外壳的集成外壳和电子设备
公开(公告)号：US20050236265A1
公开(公告)日：2005-10-27
申请号：US10520424
申请日：2003-07-07
申请人： Yoshiaki Kobayashi , Takaki Yoshihiro , Nobuhiro Mikami
发明人： Yoshiaki Kobayashi , Takaki Yoshihiro , Nobuhiro Mikami
IPC分类号： H05K5/02 , H01H13/04 , H01H13/48 , H01H13/70 , H01H13/702 , H01H1/02
CPC分类号： H01H13/7006 , H01H13/702 , H01H2203/03 , H01H2203/038 , H01H2205/024 , H01H2205/026 , H01H2215/02 , H01H2221/002 , H01H2223/003
摘要： A switch integrated type housing includes a housing body, a switch button sheet, a conductor and a cover sheet. The housing body is provided with a plurality of concave sections on an outer surface of the housing body. The switch button sheet is provided on the outer surface to cover the plurality of concave sections. The conductor has a dome shape downwardly projecting and is provided in each of the plurality of concave sections to contact the switch button sheet. The cover sheet is provided between the switch button sheet and the outer surface of the housing body in a portion of the outer surface of the housing body other than the plurality of concave sections and to cover a lower surface of the conductor in each of the plurality of concave sections.
摘要翻译：开关一体型壳体包括壳体，开关按钮片，导体和盖片。壳体在壳体的外表面上设置有多个凹部。开关按钮片设置在外表面上以覆盖多个凹部。导体具有向下突出的圆顶形状，并且设置在多个凹部中的每一个中以接触开关按钮片。覆盖片设置在开关按钮片和外壳主体的外表面之间的除了多个凹部之外的壳体的外表面的一部分中，并且在多个凹部中的每一个中覆盖导体的下表面的凹部。

2. 再颁专利

USRE44405E1 Switch integrated casing and electronic equipment having the casing 有权
标题翻译：开关具有外壳的集成外壳和电子设备
公开(公告)号：USRE44405E1
公开(公告)日：2013-08-06
申请号：US12181702
申请日：2003-07-07
申请人： Yoshiaki Kobayashi , Takaaki Yoshihiro , Nobuhiro Mikami
发明人： Yoshiaki Kobayashi , Takaaki Yoshihiro , Nobuhiro Mikami
IPC分类号： H01H13/715
CPC分类号： H01H13/7006 , H01H13/702 , H01H2203/03 , H01H2203/038 , H01H2205/024 , H01H2205/026 , H01H2215/02 , H01H2221/002 , H01H2223/003
摘要： A switch integrated type housing includes a housing body, a switch button sheet, a conductor and a cover sheet. The housing body is provided with a plurality of concave sections on an outer surface of the housing body. The switch button sheet is provided on the outer surface to cover the plurality of concave sections. The conductor has a dome shape downwardly projecting and is provided in each of the plurality of concave sections to contact the switch button sheet. The cover sheet is provided between the switch button sheet and the outer surface of the housing body in a portion of the outer surface of the housing body other than the plurality of concave sections and to cover a lower surface of the conductor in each of the plurality of concave sections.
摘要翻译：开关一体型壳体包括壳体，开关按钮片，导体和盖片。壳体在壳体的外表面上设有多个凹部。开关按钮片设置在外表面上以覆盖多个凹部。导体具有向下突出的圆顶形状，并且设置在多个凹部中的每一个中以接触开关按钮片。覆盖片设置在开关按钮片和外壳主体的外表面之间的除了多个凹部之外的壳体的外表面的一部分中，并且在多个凹部中的每一个中覆盖导体的下表面的凹部。

3. 发明授权

US07094985B2 Switch integrated casing and electronic equipment having the casing 有权
公开(公告)号：US07094985B2
公开(公告)日：2006-08-22
申请号：US10520424
申请日：2003-07-07
申请人： Yoshiaki Kobayashi , Takaaki Yoshihiro , Nobuhiro Mikami
发明人： Yoshiaki Kobayashi , Takaaki Yoshihiro , Nobuhiro Mikami
IPC分类号： H01H13/715
CPC分类号： H01H13/7006 , H01H13/702 , H01H2203/03 , H01H2203/038 , H01H2205/024 , H01H2205/026 , H01H2215/02 , H01H2221/002 , H01H2223/003
摘要： A switch integrated type housing includes a housing body, a switch button sheet, a conductor and a cover sheet. The housing body is provided with a plurality of concave sections on an outer surface of the housing body. The switch button sheet is provided on the outer surface to cover the plurality of concave sections. The conductor has a dome shape downwardly projecting and is provided in each of the plurality of concave sections to contact the switch button sheet. The cover sheet is provided between the switch button sheet and the outer surface of the housing body in a portion of the outer surface of the housing body other than the plurality of concave sections and to cover a lower surface of the conductor in each of the plurality of concave sections.

4. 发明授权

US08861110B2 Failure prediction method and failure prediction system 有权
标题翻译：故障预测方法和故障预测系统
公开(公告)号：US08861110B2
公开(公告)日：2014-10-14
申请号：US14240016
申请日：2012-08-15
申请人： Soichiro Takata , Shigeki Shinoda , Shigeru Kasai , Nobuhiro Mikami , Yasuhiro Sasaki
发明人： Soichiro Takata , Shigeki Shinoda , Shigeru Kasai , Nobuhiro Mikami , Yasuhiro Sasaki
IPC分类号： G11B27/36 , G11B7/00 , G11B20/18
CPC分类号： G11B20/18 , G11B19/048 , G11B27/36
摘要： A failure prediction system for performing failure prediction to a monitoring target device by detecting a state, comprising: a state detection unit for detecting state signals of no smaller than two different kinds, and outputting a detection signal corresponding to each of the state signals; a phase processing part for synchronizing a plurality of the detection signals; a signal analysis part for calculating a feature value indicating a feature of the state for each of the detection signals from the phase processing part; and a failure prediction part for performing failure prediction of the monitoring target device for each of the feature values by comparing the feature value in question and a reference value set in advance.
摘要翻译：一种故障预测系统，用于通过检测状态对监视目标设备执行故障预测，包括：状态检测单元，用于检测不少于两种不同类型的状态信号，并输出与每个状态信号对应的检测信号; 相位处理部，其使多个所述检测信号同步; 信号分析部分，用于从相位处理部分计算指示每个检测信号的状态特征的特征值; 以及故障预测部，用于通过比较所述特征值和预先设定的参考值来对每个特征值执行所述监视对象装置的故障预测。

5. 发明申请

US20090266586A1 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE 失效
标题翻译：印刷电路板和半导体封装
公开(公告)号：US20090266586A1
公开(公告)日：2009-10-29
申请号：US12066474
申请日：2006-09-01
申请人： Junya Sato , Shinji Watanabe , Nobuhiro Mikami , Atsumasa Sawada
发明人： Junya Sato , Shinji Watanabe , Nobuhiro Mikami , Atsumasa Sawada
IPC分类号： H05K1/16 , H05K1/11 , H05K1/00
CPC分类号： H01L23/49827 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H05K1/0271 , H05K1/115 , H05K3/108 , H05K3/403 , H05K3/421 , H05K2201/0355 , H05K2201/0394 , H05K2201/09509 , H05K2201/09563 , H05K2201/09645 , H05K2201/09745 , H05K2201/09909 , H01L2924/00014 , H01L2924/00
摘要： An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer 11, an electrical insulating base material 12 formed on the first wiring layer 11 and including a via base hole 12a that leads to the first wiring layer 11, and a second wiring layer 16 that is formed on the electrical insulating base material 12 and is electrically connected to the first wiring layer 11 through the via base hole 12a. In a region of the second wiring layer 16 disposed at least in the vicinity of the via base hole 12a, a stress relieving portion 17 is formed which relieves bending stress, tensile stress, compressive stress, and shear stress that may arise when the electrical insulating base material 12 is curved.
摘要翻译：本发明的目的在于防止电路故障的发生，例如由于印刷电路板是由印刷电路板所产生的各种应力引起的通孔和印刷电路板之间的剥离引起的信号断开等。弯曲。印刷电路板包括第一布线层11，形成在第一布线层11上的电绝缘基材12，并且包括通向第一布线层11的通孔基底孔12a和形成在第一布线层11上的第二布线层16 电绝缘基材12，并且通过通孔基底孔12a与第一布线层11电连接。在至少布置在通孔基底孔12a附近的第二布线层16的区域中形成有减轻应力消除部分17，该部分减轻了当电绝缘材料可能产生的弯曲应力，拉伸应力，压缩应力和剪切应力基材12弯曲。

6. 发明授权

US5483167A Computer controlled ground detecting method for inverter unit and apparatus therefor 失效
标题翻译：用于逆变器单元及其设备的计算机控制地面检测方法
公开(公告)号：US5483167A
公开(公告)日：1996-01-09
申请号：US941801
申请日：1992-09-08
申请人： Nobuhiro Mikami
发明人： Nobuhiro Mikami
IPC分类号： H02H3/34 , H02H7/122 , G01R31/02
CPC分类号： H02H7/1227 , H02H3/34
摘要： A ground detecting method for an inverter unit and an apparatus for carrying the method into practice and which zero-phase current is detected on the basis of the output current from the inverter unit. A first value is added whenever the zero-phase current exceeds the ground level. When the added value reaches a predetermined value, it is judged as being the ground level. Further, when the zero-phase current is smaller than the ground level, a second value smaller than the first value, which is added whenever the zero-phase current exceeds the ground level, is subtracted from the added value.
摘要翻译：用于逆变器单元的接地检测方法和用于实施该方法的装置，并且基于来自逆变器单元的输出电流检测零相电流。每当零相电流超过地电平时，都会添加第一个值。当附加值达到预定值时，判断为地平面。此外，当零相电流小于接地电平时，从相加值中减去小于零相电流超过接地电平时相加的第一值的第二值。

7. 发明授权

US09148971B2 Component built-in module, electronic device including same, and method for manufacturing component built-in module 有权
标题翻译：组件内置模块，包括其的电子设备以及组件内置模块的制造方法
公开(公告)号：US09148971B2
公开(公告)日：2015-09-29
申请号：US13824479
申请日：2011-07-08
申请人： Nozomu Nishimura , Nobuhiro Mikami
发明人： Nozomu Nishimura , Nobuhiro Mikami
IPC分类号： H05K7/02 , H05K3/28 , H01L23/31 , H01L21/56 , H05K3/30
CPC分类号： H05K7/02 , H01L21/561 , H01L21/565 , H01L23/3121 , H01L2224/16225 , H05K3/284 , H05K3/305 , H05K2201/2009 , H05K2201/2018 , H05K2203/1316 , Y10T29/4913
摘要： A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other.
摘要翻译：本发明的组件内置模块包括：基板，其包括顶表面和底表面; 多个电子部件，其安装在所述基板的上表面上; 密封基板顶表面的树脂; 以及与基板的底面接合的加强板。加强板和树脂彼此粘合。

8. 发明授权

US09036359B2 Component built-in module, electronic device including same, and method for manufacturing component built-in module 有权
标题翻译：组件内置模块，包括其的电子设备以及组件内置模块的制造方法
公开(公告)号：US09036359B2
公开(公告)日：2015-05-19
申请号：US13824805
申请日：2011-07-19
申请人： Nozomu Nishimura , Nobuhiro Mikami
发明人： Nozomu Nishimura , Nobuhiro Mikami
IPC分类号： H05K1/00 , H05K1/18 , H05K3/28 , F21V21/00 , H05K3/44
CPC分类号： H05K1/186 , F21V21/00 , H05K1/189 , H05K3/284 , H05K3/44 , H05K2201/2009 , H05K2203/1316 , H05K2203/1327 , Y10T29/49146
摘要： A component built-in module of the present invention includes: a flexible substrate that includes a first surface and a second surface on an opposite side of the first surface, the first surface including a concave part recessed in a direction from the first surface toward the second surface; a plurality of electronic components that are mounted on the first surface, mounting heights of the electronic components from the first surface to respective upper surfaces of the electronic components differing from each other; and a resin that seals the first surface. Among the plurality of electronic components, at least an electronic component having a highest mounting height is mounted in the concave part.
摘要翻译：本发明的组件内置模块包括：柔性基板，包括第一表面和与第一表面相对的第二表面，第一表面包括从第一表面朝向第一表面的方向凹陷的凹部第二面安装在第一表面上的多个电子部件，将电子部件的高度从第一表面安装到电子部件的相应上表面彼此不同; 以及密封第一表面的树脂。在多个电子部件中，至少具有最高安装高度的电子部件安装在凹部中。

9. 发明授权

US08913398B2 Mount board and electronic device 有权
标题翻译：安装板和电子设备
公开(公告)号：US08913398B2
公开(公告)日：2014-12-16
申请号：US14016707
申请日：2013-09-03
申请人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
发明人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
IPC分类号： H05K7/00 , H05K3/00 , H01L23/00 , H05K1/02 , H05K1/18 , H05K3/46 , H05K3/32
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

10. 发明授权

US08130511B2 Circuit board device, wiring board connecting method, and circuit board module device 有权
标题翻译：电路板装置，接线板连接方法和电路板模块装置
公开(公告)号：US08130511B2
公开(公告)日：2012-03-06
申请号：US12227059
申请日：2007-05-14
申请人： Junya Sato , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
发明人： Junya Sato , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
IPC分类号： H05K1/11
CPC分类号： H05K3/368 , H01L2224/16225 , H01R12/61 , H01R12/714 , H05K1/144 , H05K3/365 , H05K2201/0314 , H05K2201/042 , H05K2201/09409 , H05K2201/10378 , H05K2201/10409 , H05K2203/167
摘要： A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards 101-104, anisotropically conductive members 105 placed between the individual wiring boards, functional blocks 106 separate from anisotropically conductive members 105 and are placed on the same plane as anisotropically conductive members 105 so as to enclose anisotropically conductive members 105, and a pair of holding blocks 107, 108 placed to sandwich wiring boards 101-104. These wiring boards 101-104 are kept compressed while they are clamped between pair of holding blocks 107, 108, so that they are electrically connected with each other by anisotropically conductive members 105.
摘要翻译：提供电路板装置，布线板连接方法和电路板模块装置，用于控制各向异性导电构件在最佳范围内的压缩比，以便限制各向异性导电构件的冲击弹力的变化，即使增加为了抑制布线基板的变形以及各向异性导电部件的冲击弹力的波动，即使施加静电外力等，也能够抑制各向异性导电部件的线膨胀，甚至如果环境温度变化，则增加电连接的稳定性，并且用于减小各向异性导电构件的冲击弹性力以允许减小厚度。电路板装置包括配线板101-104，放置在各个布线板之间的各向异性导电构件105，与各向异性导电构件105分离的功能块106，并且与各向异性导电构件105放置在同一平面上，以包围各向异性导电构件 105，以及一对夹持布线板101-104的保持块107,108。这些布线板101-104被夹持在一对保持块107,108之间时被保持压缩，使得它们通过各向异性导电构件105彼此电连接。

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