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1. 发明授权

US08144482B2 Circuit board device, wiring board interconnection method, and circuit board module device 有权
标题翻译：电路板装置，接线板互连方式及电路板模块装置
公开(公告)号：US08144482B2
公开(公告)日：2012-03-27
申请号：US12227803
申请日：2007-05-14
申请人： Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
发明人： Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K1/144 , H01R12/52 , H05K1/0218 , H05K3/325 , H05K2201/10378 , H05K2201/2018 , Y10T29/49126
摘要： A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically connected.
摘要翻译：电路板装置包括：多个在前表面和后表面上设置有端子的布线板（101和102），并且设有用于将端子连接在一起的通孔;布置在布线板（101和102）之间的各向异性导电构件 102），用于将一个布线板的电极连接到另一个布线板的电极;功能块（104），由金属材料构成并布置在布线板（101和102）之间以封闭各向异性导电构件（103）;以及一对夹持多个布线板（101和102）的金属材料构成的保持块（105和106），其中所述多个布线板（101和102）处于夹在所述多个布线板一对保持块（105和106）通过各向异性导电构件（103）和设置在每个布线板（101和102）上的端子，功能块（104）和保持块（105）连接在一起和 106）电连接。

2. 发明申请

US20090135573A1 Circuit board device, wiring board interconnection method, and circuit board module device 有权
标题翻译：电路板装置，接线板互连方式及电路板模块装置
公开(公告)号：US20090135573A1
公开(公告)日：2009-05-28
申请号：US12227803
申请日：2007-05-14
申请人： Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
发明人： Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H05K1/144 , H01R12/52 , H05K1/0218 , H05K3/325 , H05K2201/10378 , H05K2201/2018 , Y10T29/49126
摘要： A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically connected.
摘要翻译：电路板装置包括：多个在前表面和后表面上设置有端子的布线板（101和102），并且设有用于将端子连接在一起的通孔;布置在布线板（101和102）之间的各向异性导电构件 102），用于将一个布线板的电极连接到另一个布线板的电极;功能块（104），由金属材料构成并布置在布线板（101和102）之间以封闭各向异性导电构件（103）;以及一对夹持多个布线板（101和102）的金属材料构成的保持块（105和106），其中所述多个布线板（101和102）处于夹在所述多个布线板一对保持块（105和106）通过各向异性导电构件（103）和设置在每个布线板（101和102）上的端子，功能块（104）和保持块（105）连接在一起和 106）电连接。

3. 发明授权

US08130511B2 Circuit board device, wiring board connecting method, and circuit board module device 有权
标题翻译：电路板装置，接线板连接方法和电路板模块装置
公开(公告)号：US08130511B2
公开(公告)日：2012-03-06
申请号：US12227059
申请日：2007-05-14
申请人： Junya Sato , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
发明人： Junya Sato , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
IPC分类号： H05K1/11
CPC分类号： H05K3/368 , H01L2224/16225 , H01R12/61 , H01R12/714 , H05K1/144 , H05K3/365 , H05K2201/0314 , H05K2201/042 , H05K2201/09409 , H05K2201/10378 , H05K2201/10409 , H05K2203/167
摘要： A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards 101-104, anisotropically conductive members 105 placed between the individual wiring boards, functional blocks 106 separate from anisotropically conductive members 105 and are placed on the same plane as anisotropically conductive members 105 so as to enclose anisotropically conductive members 105, and a pair of holding blocks 107, 108 placed to sandwich wiring boards 101-104. These wiring boards 101-104 are kept compressed while they are clamped between pair of holding blocks 107, 108, so that they are electrically connected with each other by anisotropically conductive members 105.
摘要翻译：提供电路板装置，布线板连接方法和电路板模块装置，用于控制各向异性导电构件在最佳范围内的压缩比，以便限制各向异性导电构件的冲击弹力的变化，即使增加为了抑制布线基板的变形以及各向异性导电部件的冲击弹力的波动，即使施加静电外力等，也能够抑制各向异性导电部件的线膨胀，甚至如果环境温度变化，则增加电连接的稳定性，并且用于减小各向异性导电构件的冲击弹性力以允许减小厚度。电路板装置包括配线板101-104，放置在各个布线板之间的各向异性导电构件105，与各向异性导电构件105分离的功能块106，并且与各向异性导电构件105放置在同一平面上，以包围各向异性导电构件 105，以及一对夹持布线板101-104的保持块107,108。这些布线板101-104被夹持在一对保持块107,108之间时被保持压缩，使得它们通过各向异性导电构件105彼此电连接。

4. 发明申请

US20090161331A1 Circuit Board Device, Wiring Board Connecting Method, and Circuit Board Module Device 有权
标题翻译：电路板装置，接线板连接方法和电路板模块装置
公开(公告)号：US20090161331A1
公开(公告)日：2009-06-25
申请号：US12227059
申请日：2007-05-14
申请人： Junya Sato , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
发明人： Junya Sato , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
IPC分类号： H01R12/00
CPC分类号： H05K3/368 , H01L2224/16225 , H01R12/61 , H01R12/714 , H05K1/144 , H05K3/365 , H05K2201/0314 , H05K2201/042 , H05K2201/09409 , H05K2201/10378 , H05K2201/10409 , H05K2203/167
摘要： A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards 101-104, anisotropically conductive members 105 placed between the individual wiring boards, functional blocks 106 separate from anisotropically conductive members 105 and are placed on the same plane as anisotropically conductive members 105 so as to enclose anisotropically conductive members 105, and a pair of holding blocks 107, 108 placed to sandwich wiring boards 101-104. These wiring boards 101-104 are kept compressed while they are clamped between pair of holding blocks 107, 108, so that they are electrically connected with each other by anisotropically conductive members 105.
摘要翻译：提供电路板装置，布线板连接方法和电路板模块装置，用于控制各向异性导电构件在最佳范围内的压缩比，以便限制各向异性导电构件的冲击弹力的变化，即使增加为了抑制布线基板的变形以及各向异性导电部件的冲击弹力的波动，即使施加静电外力等，也能够抑制各向异性导电部件的线膨胀，甚至如果环境温度变化，则增加电连接的稳定性，并且用于减小各向异性导电构件的冲击弹性力以允许减小厚度。电路板装置包括配线板101-104，放置在各个布线板之间的各向异性导电构件105，与各向异性导电构件105分离的功能块106，并且与各向异性导电构件105放置在同一平面上，以包围各向异性导电构件 105，以及一对夹持布线板101-104的保持块107,108。这些布线板101-104被夹持在一对保持块107,108之间时被保持压缩，使得它们通过各向异性导电构件105彼此电连接。

5. 发明授权

US08913398B2 Mount board and electronic device 有权
标题翻译：安装板和电子设备
公开(公告)号：US08913398B2
公开(公告)日：2014-12-16
申请号：US14016707
申请日：2013-09-03
申请人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
发明人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
IPC分类号： H05K7/00 , H05K3/00 , H01L23/00 , H05K1/02 , H05K1/18 , H05K3/46 , H05K3/32
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

6. 发明授权

US08119918B2 Printed circuit board and semiconductor package 失效
标题翻译：印刷电路板和半导体封装
公开(公告)号：US08119918B2
公开(公告)日：2012-02-21
申请号：US12066474
申请日：2006-09-01
申请人： Junya Sato , Shinji Watanabe , Nobuhiro Mikami , Atsumasa Sawada
发明人： Junya Sato , Shinji Watanabe , Nobuhiro Mikami , Atsumasa Sawada
IPC分类号： H05K1/11
CPC分类号： H01L23/49827 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H05K1/0271 , H05K1/115 , H05K3/108 , H05K3/403 , H05K3/421 , H05K2201/0355 , H05K2201/0394 , H05K2201/09509 , H05K2201/09563 , H05K2201/09645 , H05K2201/09745 , H05K2201/09909 , H01L2924/00014 , H01L2924/00
摘要： An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer 11, an electrical insulating base material 12 formed on the first wiring layer 11 and including a via base hole 12a that leads to the first wiring layer 11, and a second wiring layer 16 that is formed on the electrical insulating base material 12 and is electrically connected to the first wiring layer 11 through the via base hole 12a. In a region of the second wiring layer 16 disposed at least in the vicinity of the via base hole 12a, a stress relieving portion 17 is formed which relieves bending stress, tensile stress, compressive stress, and shear stress that may arise when the electrical insulating base material 12 is curved.
摘要翻译：本发明的目的在于防止电路故障的发生，例如由于印刷电路板是由印刷电路板所产生的各种应力引起的通孔和印刷电路板之间的剥离引起的信号断开等。弯曲。印刷电路板包括第一布线层11，形成在第一布线层11上的电绝缘基材12，并且包括通向第一布线层11的通孔基底孔12a和形成在第一布线层11上的第二布线层16 电绝缘基材12，并且通过通孔基底孔12a与第一布线层11电连接。在至少设置在通孔基底孔12a附近的第二布线层16的区域中，形成有减轻应力消除部分17，该部分减轻了当电绝缘材料时可能产生的弯曲应力，拉伸应力，压缩应力和剪切应力基材12弯曲。

7. 发明授权

US07847389B2 Semiconductor package, electronic part and electronic device 有权
标题翻译：半导体封装，电子元器件及电子器件
公开(公告)号：US07847389B2
公开(公告)日：2010-12-07
申请号：US12093896
申请日：2006-11-13
申请人： Nobuhiro Mikami , Shinji Watanabe , Junya Sato , Atsumasa Sawada
发明人： Nobuhiro Mikami , Shinji Watanabe , Junya Sato , Atsumasa Sawada
IPC分类号： H01L23/48
CPC分类号： H01L23/4985 , H01L23/49816 , H01L24/50 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3511
摘要： Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip.
摘要翻译：即使当安装了半导体封装的衬底弯曲时，电气连接上的应力减轻，从而消除了连接错误并提高了连接的可靠性。半导体芯片在其第二面具有电极。能够弯曲和弯曲的支撑块被放置在半导体芯片的第一面的外围边缘上的两个位置处。放置插入件以跨越支撑块，其中插入其自身和半导体芯片之间的支撑块，并且在柔性树脂膜中具有布线图案。插入器的两端部被折回到半导体芯片的第二面的一侧，并且其布线图案电连接到半导体芯片的电极。

8. 发明申请

US20090096080A1 SEMICONDUCTOR PACKAGE, ELECTRONIC PART AND ELECTRONIC DEVICE 有权
标题翻译：半导体封装，电子部件和电子器件
公开(公告)号：US20090096080A1
公开(公告)日：2009-04-16
申请号：US12093896
申请日：2006-11-13
申请人： Nobuhiro Mikami , Shinji Watanabe , Junya Sato , Atsumasa Sawada
发明人： Nobuhiro Mikami , Shinji Watanabe , Junya Sato , Atsumasa Sawada
IPC分类号： H01L23/48
CPC分类号： H01L23/4985 , H01L23/49816 , H01L24/50 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3511
摘要： Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip.
摘要翻译：即使当安装了半导体封装的衬底弯曲时，电气连接上的应力减轻，从而消除了连接错误并提高了连接的可靠性。半导体芯片在其第二面具有电极。能够弯曲和弯曲的支撑块被放置在半导体芯片的第一面的外围边缘上的两个位置处。放置插入件以跨越支撑块，其中插入其自身和半导体芯片之间的支撑块，并且在柔性树脂膜中具有布线图案。插入器的两端部被折回到半导体芯片的第二面的一侧，并且其布线图案电连接到半导体芯片的电极。

9. 发明申请

US20090002973A1 Mount Board and Electronic Device 审中-公开
标题翻译：安装板和电子设备
公开(公告)号：US20090002973A1
公开(公告)日：2009-01-01
申请号：US12093496
申请日：2006-11-08
申请人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
发明人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
IPC分类号： H05K7/00
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

10. 发明申请

US20090266586A1 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE 失效
标题翻译：印刷电路板和半导体封装
公开(公告)号：US20090266586A1
公开(公告)日：2009-10-29
申请号：US12066474
申请日：2006-09-01
申请人： Junya Sato , Shinji Watanabe , Nobuhiro Mikami , Atsumasa Sawada
发明人： Junya Sato , Shinji Watanabe , Nobuhiro Mikami , Atsumasa Sawada
IPC分类号： H05K1/16 , H05K1/11 , H05K1/00
CPC分类号： H01L23/49827 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H05K1/0271 , H05K1/115 , H05K3/108 , H05K3/403 , H05K3/421 , H05K2201/0355 , H05K2201/0394 , H05K2201/09509 , H05K2201/09563 , H05K2201/09645 , H05K2201/09745 , H05K2201/09909 , H01L2924/00014 , H01L2924/00
摘要： An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer 11, an electrical insulating base material 12 formed on the first wiring layer 11 and including a via base hole 12a that leads to the first wiring layer 11, and a second wiring layer 16 that is formed on the electrical insulating base material 12 and is electrically connected to the first wiring layer 11 through the via base hole 12a. In a region of the second wiring layer 16 disposed at least in the vicinity of the via base hole 12a, a stress relieving portion 17 is formed which relieves bending stress, tensile stress, compressive stress, and shear stress that may arise when the electrical insulating base material 12 is curved.
摘要翻译：本发明的目的在于防止电路故障的发生，例如由于印刷电路板是由印刷电路板所产生的各种应力引起的通孔和印刷电路板之间的剥离引起的信号断开等。弯曲。印刷电路板包括第一布线层11，形成在第一布线层11上的电绝缘基材12，并且包括通向第一布线层11的通孔基底孔12a和形成在第一布线层11上的第二布线层16 电绝缘基材12，并且通过通孔基底孔12a与第一布线层11电连接。在至少布置在通孔基底孔12a附近的第二布线层16的区域中形成有减轻应力消除部分17，该部分减轻了当电绝缘材料可能产生的弯曲应力，拉伸应力，压缩应力和剪切应力基材12弯曲。

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