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    • 7. 发明授权
    • Nitride semiconductor laser device and fabricating method thereof
    • 氮化物半导体激光器件及其制造方法
    • US07056756B2
    • 2006-06-06
    • US10611851
    • 2003-07-03
    • Gaku SugaharaYoshiaki HasegawaAkihiko IshibashiToshiya Yokogawa
    • Gaku SugaharaYoshiaki HasegawaAkihiko IshibashiToshiya Yokogawa
    • H01L21/00
    • H01S5/32341H01S5/0213H01S5/0224H01S5/02272H01S5/0425
    • A method for fabricating a nitride semiconductor laser device including a step to expose surfaces of an n-type nitride semiconductor layer (102) and a p-type nitride semiconductor layer (108); a step to cover the surface of the multi-layered semiconductor; with an insulating film (109) that has a thickness greater than the difference in levels between the exposed surface of the n-type nitride semiconductor layer (102) and the outermost surface of the p-type nitride semiconductor layer (108); a step to flatten the surface of the insulating film (109); and a step to form an n-type electrode (111) and a p-type electrode (110) electrically connected to the n-type nitride semiconductor layer (102) and the p-type nitride semiconductor layer (108), respectively. This method makes it possible to obtain a nitride semiconductor laser device that is highly reliable and exhibits an excellent heat diffusing property.
    • 一种用于制造氮化物半导体激光器件的方法,包括:暴露n型氮化物半导体层(102)和p型氮化物半导体层(108)的表面的步骤; 覆盖多层半导体表面的步骤; 具有大于n型氮化物半导体层(102)的露出表面与p型氮化物半导体层(108)的最外表面之间的电平差的绝缘膜(109); 平坦化绝缘膜(109)的表面的步骤; 以及分别形成与n型氮化物半导体层(102)和p型氮化物半导体层(108)电连接的n型电极(111)和p型电极(110)的步骤。 该方法可以获得高可靠性并且具有优异的散热性能的氮化物半导体激光器件。