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    • 3. 发明授权
    • Circuit for converting internal voltage of semiconductor device
    • 用于转换半导体器件内部电压的电路
    • US5929696A
    • 1999-07-27
    • US953052
    • 1997-10-17
    • Jong-Hyoung LimJae-hoon JooSang-seok KangJin-seok Lee
    • Jong-Hyoung LimJae-hoon JooSang-seok KangJin-seok Lee
    • G11C11/413G05F1/46G11C11/401G11C11/407G11C29/06H01L27/10G05F1/10
    • G05F1/465
    • An internal voltage conversion circuit for a DRAM wherein a voltage level of an internal power supply is regulated by an external signal applied to the DRAM pins after packaging to perform reliability tests. The internal voltage conversion circuit includes a test mode signal generator, for generating a test mode signal by combining first control signals applied externally of the semiconductor device, and a switching signal generator, for generating first and second switching signals according to second control signals applied externally of the DRAM when the test mode signal is active. First and second switching resistor portions connected in series between the internal power supply port and a ground potential are switched by the first and second switching signals, respectively, so that their resistance values are changed. The resistor portions are in a feedback path connected to one input of a comparator. The other input is connected to a reference cell. The internal voltage supply varies responsive to changes in resistance values.
    • 一种用于DRAM的内部电压转换电路,其中内部电源的电压电平通过在封装之后施加到DRAM引脚的外部信号进行调节以执行可靠性测试。 内部电压转换电路包括测试模式信号发生器,用于通过组合在半导体器件外部施加的第一控制信号和开关信号发生器产生测试模式信号,用于根据外部施加的第二控制信号产生第一和第二开关信号 当测试模式信号有效时。 串联连接在内部电源端口和接地电位之间的第一和第二开关电阻部分分别通过第一和第二开关信号切换,使得它们的电阻值被改变。 电阻器部分处于连接到比较器的一个输入端的反馈路径中。 另一个输入连接到参考单元。 内部电压供应根据电阻值的变化而变化。
    • 4. 发明授权
    • Semiconductor memory device and method of performing a memory operation
    • 半导体存储器件和执行存储器操作的方法
    • US08015459B2
    • 2011-09-06
    • US12654644
    • 2009-12-28
    • Jong-Hyoung LimSang-Seok Kang
    • Jong-Hyoung LimSang-Seok Kang
    • G11C29/00
    • G11C7/1078G11C7/1006G11C7/1096G11C11/4096
    • A semiconductor memory device and method directed to performing a memory operation in a semiconductor memory device are provided. The method includes receiving a write command signal from a memory controller; receiving data from the memory controller, the data including n pieces of data, wherein the k-th piece of data comprises masking data to be masked; and receiving a data masking signal from the memory controller, the data masking signal including enable information that enables data masking, and non-enable information for not enabling data masking, wherein the enable information is used to mask the k-th piece of data. A latency between receiving the write command signal and receiving the enable information is less than a latency between receiving the write command and receiving the k-th piece of data.
    • 提供一种半导体存储器件和方法,用于在半导体存储器件中执行存储器操作。 该方法包括从存储器控制器接收写命令信号; 从所述存储器控制器接收数据,所述数据包括n条数据,其中所述第k条数据包括要屏蔽的掩蔽数据; 以及从所述存储器控制器接收数据屏蔽信号,所述数据屏蔽信号包括启用数据屏蔽的使能信息,以及不启用数据屏蔽的非使能信息,其中所述使能信息用于掩蔽所述第k条数据。 接收写命令信号和接收使能信息之间的等待时间小于接收写命令和接收第k条数据之间的等待时间。
    • 6. 发明授权
    • Circuit and method of generating internal supply voltage in semiconductor memory device
    • 在半导体存储器件中产生内部电源电压的电路和方法
    • US07391254B2
    • 2008-06-24
    • US11521178
    • 2006-09-14
    • Jong-Hyoung LimSang-Seok KangSang-Man Byun
    • Jong-Hyoung LimSang-Seok KangSang-Man Byun
    • G05F1/10
    • G11C5/147G11C11/4074
    • An internal supply voltage generation circuit includes first and second driving circuits and a resistive device. The first driving circuit receives a feedback voltage from a first node and generates a first output voltage based on first and second reference voltages to provide the first output voltage to the first node. The first output voltage is maintained between the first and second reference voltages. The second driving circuit receives a feedback voltage from a second node voltage and generates a second output voltage based on third and fourth reference voltages to provide the second output voltage to the second node. The second output voltage is maintained between the third and fourth reference voltages, and the second output voltage of the second node is provided as an internal supply voltage. The resistive device is coupled between the first and second nodes.
    • 内部电源电压产生电路包括第一和第二驱动电路和电阻装置。 第一驱动电路从第一节点接收反馈电压,并且基于第一和第二参考电压产生第一输出电压,以向第一节点提供第一输出电压。 第一输出电压保持在第一和第二参考电压之间。 第二驱动电路从第二节点电压接收反馈电压,并且基于第三和第四参考电压产生第二输出电压,以向第二节点提供第二输出电压。 第二输出电压保持在第三和第四参考电压之间,第二节点的第二输出电压被提供为内部电源电压。 电阻设备耦合在第一和第二节点之间。
    • 8. 发明申请
    • Semiconductor memory device and method thereof
    • 半导体存储器件及其方法
    • US20080052567A1
    • 2008-02-28
    • US11730273
    • 2007-03-30
    • Jong-Hyoung LimSang-Seok Kang
    • Jong-Hyoung LimSang-Seok Kang
    • G11C29/00
    • G11C7/1078G11C7/1006G11C7/1096G11C11/4096
    • A semiconductor memory device and method thereof are provided. The example method may be directed to performing a memory operation in a semiconductor memory device, and may include receiving data and a data masking signal corresponding to at least a portion of the received data, the received data scheduled to be written into memory in response to a write command and the data masking signal configured to block the at least a portion of the received data from being written into the memory and configuring timing parameters differently for each of the received data and the data masking signal so as to execute the write command without writing the at least a portion of the received data into the memory.
    • 提供一种半导体存储器件及其方法。 示例性方法可以涉及在半导体存储器件中执行存储器操作,并且可以包括接收对应于所接收的数据的至少一部分的数据和数据屏蔽信号,响应于 写入命令和数据屏蔽信号,被配置为阻止所接收的数据的至少一部分被写入到存储器中,并且针对每个接收的数据和数据屏蔽信号配置不同的定时参数,从而执行写入命令而没有 将所接收的数据的至少一部分写入存储器。
    • 9. 发明申请
    • Semiconductor memory device
    • 半导体存储器件
    • US20070086252A1
    • 2007-04-19
    • US11450318
    • 2006-06-09
    • Jong-Hyoung LimSang-Man Byun
    • Jong-Hyoung LimSang-Man Byun
    • G11C29/00
    • G11C29/24G11C29/78
    • Provided is a semiconductor memory device. The semiconductor memory device includes: a memory cell array including regular cells; a redundancy memory cell array including redundancy cells for substituting for defective regular cells; a command decoder for generating an operation mode selection signal in response to command signals; a redundancy cell test controller for generating a test operation control signal and transmitting address signals in response to the operation mode selection signal; and a redundancy decoder for decoding the address signals to select the redundancy cells in response to the test operation control signal. All redundancy cells can be selected and tested based on the external command signal and the address signal, and thus it is possible to check all redundancy cells for defects in advance even after the semiconductor memory device is packaged, and to enable only non-defective redundancy cells to be substituted for defective regular cells. This increases the reliability of a repair operation.
    • 提供了一种半导体存储器件。 半导体存储器件包括:包括常规单元的存储单元阵列; 冗余存储单元阵列,包括用于代替有缺陷的规则单元的冗余单元; 命令解码器,用于响应于命令信号产生操作模式选择信号; 冗余单元测试控制器,用于响应于所述操作模式选择信号产生测试操作控制信号和发送地址信号; 以及用于对地址信号进行解码以便响应于测试操作控制信号选择冗余单元的冗余解码器。 可以根据外部命令信号和地址信号来选择和测试所有冗余单元,因此即使在半导体存储器件被封装之后也可以预先检查所有冗余单元的缺陷,并且仅使无缺陷冗余 细胞被代替缺陷的正常细胞。 这增加了维修操作的可靠性。