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1. 发明申请

US20130088251A1 PROBE CARD AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：探针卡及其制造方法
公开(公告)号：US20130088251A1
公开(公告)日：2013-04-11
申请号：US13614395
申请日：2012-09-13
申请人： Yong Seok CHOI , Dae Hyeong Lee , Won Chul Ma , Ki Pyo Hong
发明人： Yong Seok CHOI , Dae Hyeong Lee , Won Chul Ma , Ki Pyo Hong
IPC分类号： G01R1/04 , B29C65/72
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06755
摘要： There are provided a probe substrate and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from the probe substrate. The probe card includes: a ceramic substrate having at least one electrode pad on one surface thereof; and a probe pin bonded to the electrode pad, and the electrode pad has a larger dimension than a bonding surface of the probe pin.
摘要翻译：提供了一种探针衬底及其制造方法，其可以防止与探针接合的电极垫从探针衬底释放。探针卡包括：在其一个表面上具有至少一个电极焊盘的陶瓷基板; 以及与电极焊盘接合的探针，电极焊盘的尺寸比探针的接合面大。

2. 发明申请

US20130162278A1 PROBE PIN, PROBE CARD USING THE PROBE PIN, AND METHOD OF MANUFACTURING THE PROBE CARD 审中-公开
标题翻译：探针，使用探针的探针卡和制造探针卡的方法
公开(公告)号：US20130162278A1
公开(公告)日：2013-06-27
申请号：US13532475
申请日：2012-06-25
申请人： Doo Yun CHUNG , Dae Hyeong Lee , Ki Pyo Hong , Won Chul Ma , Yong Seok Choi
发明人： Doo Yun CHUNG , Dae Hyeong Lee , Ki Pyo Hong , Won Chul Ma , Yong Seok Choi
IPC分类号： G01R1/067 , B23K31/02 , B23K1/20 , G01R1/073
CPC分类号： G01R3/00 , B23K1/0008 , B23K3/0638 , B23K26/382 , B23K26/40 , B23K35/0222 , B23K35/262 , B23K35/3006 , B23K2101/42 , B23K2103/16 , B23K2103/50 , G01R1/06727 , G01R1/07357
摘要： There is provided a probe card, including: a substrate having a plurality of grooves formed in one surface thereof; and at least one probe pin having a plurality of substrate combining protrusions formed on one surface thereof and corresponding to the plurality of grooves, the plurality of substrate combining protrusions having heights corresponding to the plurality of grooves.
摘要翻译：提供了一种探针卡，包括：具有形成在其一个表面中的多个凹槽的基底; 以及至少一个探针，其具有在其一个表面上形成并对应于所述多个凹槽的多个基板组合突起，所述多个基板组合突起具有与所述多个凹槽对应的高度。

3. 发明申请

US20130000958A1 MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：多层陶瓷基板及其制造方法
公开(公告)号：US20130000958A1
公开(公告)日：2013-01-03
申请号：US13473047
申请日：2012-05-16
申请人： Yong Seok CHOI , Dae Hyeong Lee , Won Chul Ma , Ki Pyo Hong
发明人： Yong Seok CHOI , Dae Hyeong Lee , Won Chul Ma , Ki Pyo Hong
IPC分类号： H05K1/03 , B05D5/12 , B82Y40/00 , B82Y30/00
CPC分类号： H01L23/15 , B32B18/00 , B82Y30/00 , C04B37/006 , C04B2235/408 , C04B2235/616 , C04B2237/125 , C04B2237/32 , C04B2237/562 , C04B2237/62 , H01L21/4857 , H01L2924/0002 , H05K1/113 , H05K3/4061 , H05K3/4629 , H05K2203/025 , H05K2203/072 , H01L2924/00
摘要： Disclosed herein are a multilayer ceramic substrate and a method for manufacturing the same. In a method for manufacturing the multilayer ceramic substrate, which has a ceramic laminate including multiple ceramic layers and allowing interconnection between layers through vias respectively formed in the multiple ceramic layers, the method includes: preparing a ceramic laminate in which a void is formed around a via in at least one ceramic layer of multiple ceramic layers; immersing the ceramic laminate in a precipitating bath in which an electrode solution is contained; putting the ceramic laminate out of the precipitating bath after a predetermined period of time, and then removing a nanoparticle film stacked on a surface of a multilayer ceramic substrate; and applying heat to the multilayer ceramic substrate to form nanoparticles filling an inside of the void, after the removing of the nanoparticle film.
摘要翻译：本文公开了多层陶瓷基板及其制造方法。在具有陶瓷层叠体的多层陶瓷基板的制造方法中，所述多层陶瓷基板具有包含多个陶瓷层的陶瓷层叠体，并且能够通过分别形成在多个陶瓷层中的通孔的层间的相互连接，所述方法包括：准备陶瓷层叠体，在多个陶瓷层的至少一个陶瓷层中通孔; 将陶瓷层压体浸渍在其中含有电极溶液的沉淀浴中; 在预定时间后将陶瓷层压体放出沉淀池，然后除去堆叠在多层陶瓷基板的表面上的纳米颗粒膜; 并且在除去纳米颗粒膜之后，向多层陶瓷基板施加热量以形成填充空隙内部的纳米颗粒。

4. 发明申请

US20110168439A1 MULTILAYER CERAMIC CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：多层陶瓷电路板及其制造方法
公开(公告)号：US20110168439A1
公开(公告)日：2011-07-14
申请号：US12794118
申请日：2010-06-04
申请人： Myung Whun CHANG , Jin Waun Kim , Dae Hyeong Lee , Ki Pyo Hong
发明人： Myung Whun CHANG , Jin Waun Kim , Dae Hyeong Lee , Ki Pyo Hong
IPC分类号： H05K1/11 , B29C65/02
CPC分类号： H05K3/4629 , C04B37/001 , C04B2237/64 , H05K3/107
摘要： There is provided a method of manufacturing a multilayer ceramic circuit board. A multilayer ceramic circuit board according to an aspect of the invention may include: preparing a plurality of ceramic green sheets; forming a recess having a desired line shape and a via hole connected to the recess in at least one of the plurality of ceramic green sheets; forming a conductive via by filling the via hole with a conductive material; forming a circuit line connected to the conductive via by filling the recess with a conductive material; stacking the plurality of ceramic green sheets upon one another to thereby form a ceramic green sheet stack; and sintering the ceramic green sheet stack.
摘要翻译：提供一种制造多层陶瓷电路板的方法。根据本发明的一个方面的多层陶瓷电路板可以包括：制备多个陶瓷生片; 在所述多个陶瓷生片中的至少一个中形成具有所需线状的凹部和与所述凹部连接的通孔; 通过用导电材料填充所述通孔来形成导电通孔; 通过用导电材料填充凹槽来形成连接到导电通孔的电路线; 将多个陶瓷生片堆叠在一起形成陶瓷生片叠层; 并烧结陶瓷生片堆叠。

5. 发明授权

US08806731B2 Method of repairing a probe board 有权
标题翻译：修理探针板的方法
公开(公告)号：US08806731B2
公开(公告)日：2014-08-19
申请号：US12987697
申请日：2011-01-10
申请人： Myung Whun Chang , Dae Hyeong Lee , Ki Pyo Hong
发明人： Myung Whun Chang , Dae Hyeong Lee , Ki Pyo Hong
IPC分类号： B23P6/00
CPC分类号： H05K1/11 , G01R1/02 , H05K1/09 , H05K3/225 , H05K3/4015 , H05K3/4061 , Y10T29/49002 , Y10T29/49149 , Y10T29/49165 , Y10T29/49726 , Y10T29/49748
摘要： There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.
摘要翻译：提供了一种修复探针板的方法，所述方法包括：在形成为陶瓷烧结体的板体中制备多个填充有第一填充材料的第一通孔电极; 在所述多个第一通孔电极中形成用于开放通孔电极的通孔; 用具有比第一填充材料低的烧结温度的第二填充材料填充通孔; 以及通过烧结所述第二填充材料形成第二通孔电极。根据本发明的开放通孔修复提高了板的制造成品率并降低了其制造成本。

6. 发明申请

US20110061919A1 Low temperature co-fired ceramics assembling system and method thereof 审中-公开
标题翻译：低温共烧陶瓷装配系统及其方法
公开(公告)号：US20110061919A1
公开(公告)日：2011-03-17
申请号：US12654899
申请日：2010-01-07
申请人： Gyu Man Hwang , Dae Hyeong Lee
发明人： Gyu Man Hwang , Dae Hyeong Lee
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K3/0061 , H01L23/4006 , H01L2023/4062 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4629 , H05K2201/0969 , H05K2203/167 , Y10T29/4913 , Y10T29/53174 , H01L2924/00
摘要： A low temperature ceramics substrate, a low temperature ceramics assembling system, and a method thereof in which a fixing member is formed on the bottom of an LTCC substrate, an insertion hole is formed at a coupled portion on a fixing member of the LTCC substrate coupled onto the heat sink, the fixing member is inserted into the insertion hole when the LTCC substrate and the heat sink are coupled to each other to firmly achieve alignment and fixation by the fixing member and a ceramic laminate assembling system includes a ceramic laminate substrate including an electronic component mounted on the bottom thereof and a fixing member is formed at one side thereof; and a heat sink including a sensor holder onto which the electronic component is held and an insertion groove is provided at a portion corresponding to the fixing member.
摘要翻译：一种低温陶瓷基板，低温陶瓷组装系统及其方法，在LTCC基板的底部形成有固定部件，在LTCC基板的固定部件上的耦合部分上形成有插入孔，在散热器上，当LTCC基板和散热片彼此连接时，固定部件插入到插入孔中，以牢固地实现固定部件的对准和固定，并且陶瓷层叠体组装系统包括陶瓷层叠基板，其包括：安装在其底部的电子部件和在其一侧形成固定部件; 以及散热器，其包括保持有电子部件的传感器保持件，并且在与固定部件相对应的部分设置插入槽。

7. 发明申请

US20110061929A1 Optimized power package for electrical device 有权
标题翻译：电气设备优化电源包
公开(公告)号：US20110061929A1
公开(公告)日：2011-03-17
申请号：US12591408
申请日：2009-11-18
申请人： Gyu Man Hwang , Dae Hyeong Lee , Bong Gyun Kim
发明人： Gyu Man Hwang , Dae Hyeong Lee , Bong Gyun Kim
IPC分类号： H05K5/00
CPC分类号： H05K5/0026 , H01L2224/48091 , H05K1/0306 , H05K1/141 , H05K3/0061 , H05K2201/105 , H05K2203/049 , H01L2924/00014
摘要： Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.
摘要翻译：公开了一种用于电动转向（EPS）系统中的电子控制单元（ECU）的电气设备的电力包，该电力包装包括：壳体，其形成有上部和下部，并形成为在两个阶段的结构中，其中衬底层设置在每个上部和下部上; 印刷电路板（PCB）层，其设置在壳体的下部并且具有形成在其上的路线以流动电流; 并且设置在壳体的上部的LTCC层通过引线接合连接到PCB层，并且由低温共烧陶瓷形成。用于电气设备的功率封装可以扩展PCB和LTCC层的面积，从而提高PCB和LTCC层的自由度设计，并减小整个外壳的尺寸。

8. 发明申请

US20100252305A1 CIRCUIT BOARD MODULE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电路板模块及其制造方法
公开(公告)号：US20100252305A1
公开(公告)日：2010-10-07
申请号：US12550812
申请日：2009-08-31
申请人： Yoon Hyuck CHOI , Dae Hyeong Lee , Jin Waun Kim , Kwang Jae Oh
发明人： Yoon Hyuck CHOI , Dae Hyeong Lee , Jin Waun Kim , Kwang Jae Oh
IPC分类号： H05K1/00 , B32B37/00 , B32B38/00
CPC分类号： H05K1/0201 , H01C1/148 , H01C7/003 , H05K1/0306 , H05K1/167 , H05K2201/066 , H05K2201/09909 , Y10T156/10
摘要： There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions.The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased.Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.
摘要翻译：提供了一种电路板模块及其制造方法。电路板模块可以包括：电路板; 布置在电路板上的电阻器; 覆盖电阻器两端的焊盘; 粘合剂部分至少设置在焊盘上并由电绝缘材料形成; 以及散热构件，其设置在所述电阻器上并且使用所述粘合部分结合到所述焊盘。选择性地形成粘合剂部分，从而防止在安装到电路板上的电阻器和散热构件之间发生短路。因此，可以提高部件的可靠性。此外，用于连接板和散热构件的粘合材料由导热材料形成，从而提高散热效率。

9. 发明授权

US08183473B2 Optimized power package for electrical device 有权
标题翻译：电气设备优化电源包
公开(公告)号：US08183473B2
公开(公告)日：2012-05-22
申请号：US12591408
申请日：2009-11-18
申请人： Gyu Man Hwang , Dae Hyeong Lee , Bong Gyun Kim
发明人： Gyu Man Hwang , Dae Hyeong Lee , Bong Gyun Kim
IPC分类号： H05K7/02
CPC分类号： H05K5/0026 , H01L2224/48091 , H05K1/0306 , H05K1/141 , H05K3/0061 , H05K2201/105 , H05K2203/049 , H01L2924/00014
摘要： Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.
摘要翻译：公开了一种用于电动转向（EPS）系统中的电子控制单元（ECU）的电气设备的电力包，该电力包装包括：壳体，其形成有上部和下部，并形成为在两个阶段的结构中，其中衬底层设置在每个上部和下部上; 印刷电路板（PCB）层，其设置在壳体的下部并且具有形成在其上的路线以流动电流; 并且设置在壳体的上部的LTCC层通过引线接合连接到PCB层，并且由低温共烧陶瓷形成。用于电气设备的功率封装可以扩展PCB和LTCC层的面积，从而提高PCB和LTCC层的自由度设计，并减小整个外壳的尺寸。

10. 发明申请

US20110000701A1 Ceramic elements module and manufacturing method thereof 有权
标题翻译：陶瓷元件模块及其制造方法
公开(公告)号：US20110000701A1
公开(公告)日：2011-01-06
申请号：US12461922
申请日：2009-08-27
申请人： Gyu Man Hwang , Dae Hyeong Lee
发明人： Gyu Man Hwang , Dae Hyeong Lee
IPC分类号： H05K7/20 , H05K3/30
CPC分类号： H05K1/0203 , H05K1/0306 , H05K3/0061 , H05K3/4629 , H05K7/205 , H05K2201/0969 , H05K2201/10598 , H05K2203/063 , Y10T29/49126 , Y10T29/4913
摘要： The present invention relates to a ceramic elements module and a manufacturing method thereof. There is provided a ceramic elements module, including: a ceramic elements that has a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted, and a manufacturing method thereof.
摘要翻译：陶瓷元件模块及其制造方法技术领域本发明涉及陶瓷元件模块及其制造方法。提供了一种陶瓷元件模块，包括：具有多个下插入槽的陶瓷元件; 电子部件，安装在陶瓷元件的下表面上; 以及与安装有电子部件的陶瓷元件的下部耦合的散热器，具有与下部插入槽对应的第一贯通孔和插入电子部件的第二贯通孔，其制造方法。

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