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1. 发明授权

US07600310B2 Method of head stack assembly flexible circuit assembly attached to an actuator arm 失效
标题翻译：安装在执行机构臂上的头部组件柔性电路组件的方法
公开(公告)号：US07600310B2
公开(公告)日：2009-10-13
申请号：US11454599
申请日：2006-06-16
申请人： Yiu Sing Ho , Hiroshi Fukaya , Kam Fung Yip , Satoshi Yamaguchi , Jeffery L. Wang , Can Hua Chen
发明人： Yiu Sing Ho , Hiroshi Fukaya , Kam Fung Yip , Satoshi Yamaguchi , Jeffery L. Wang , Can Hua Chen
IPC分类号： H05K1/00 , G11B21/00
CPC分类号： G11B5/4853 , G11B5/4846 , G11B5/486 , H05K1/189 , H05K3/0061 , H05K3/328 , H05K3/3447 , H05K2201/10303 , Y10T29/49025
摘要： A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.
摘要翻译：公开了一种用于安装磁头堆叠组件（HSA）电路组件的方法。柔性电路基板可以耦合到加强件。加强件可以是金属，例如铝，或一些其它刚性耐用的材料。柔性电路基板可以由有机材料制成，并且可以具有嵌入柔性电路基板中的一系列电子引线。柔性基底可以通过粘合剂耦合到加强件或层压到加强件上。加强件可以通过焊接或通过激光焊接安装在致动器臂上。

2. 发明授权

US07522384B2 Method of head stack assembly flexible circuit assembly attached to an actuator arm 有权
公开(公告)号：US07522384B2
公开(公告)日：2009-04-21
申请号：US10753911
申请日：2004-01-07
申请人： Yiu Sing Ho , Hiroshi Fukaya , Kam Fung Yip , Satoshi Yamaguchi , Jeffery L. Wang , Can Hua Chen
发明人： Yiu Sing Ho , Hiroshi Fukaya , Kam Fung Yip , Satoshi Yamaguchi , Jeffery L. Wang , Can Hua Chen
IPC分类号： G11B5/55
CPC分类号： G11B5/4853 , G11B5/4846 , G11B5/486 , H05K1/189 , H05K3/0061 , H05K3/328 , H05K3/3447 , H05K2201/10303 , Y10T29/49025
摘要： A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.

3. 发明申请

US20060232890A1 Method of head stack assembly flexible circuit assembly attached to an actuator arm 失效
公开(公告)号：US20060232890A1
公开(公告)日：2006-10-19
申请号：US11454599
申请日：2006-06-16
申请人： Yiu Sing Ho , Hiroshi Fukaya , Kam Fung Yip , Satoshi Yamaguchi , Jeffery Wang , Can Hua Chen
发明人： Yiu Sing Ho , Hiroshi Fukaya , Kam Fung Yip , Satoshi Yamaguchi , Jeffery Wang , Can Hua Chen
IPC分类号： H05K1/00
CPC分类号： G11B5/4853 , G11B5/4846 , G11B5/486 , H05K1/189 , H05K3/0061 , H05K3/328 , H05K3/3447 , H05K2201/10303 , Y10T29/49025
摘要： A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.

4. 发明申请

US20050013055A1 Method of head stack assembly flexible circuit assembly attached to an actuator arm 有权
标题翻译：安装在执行机构臂上的头部组件柔性电路组件的方法
公开(公告)号：US20050013055A1
公开(公告)日：2005-01-20
申请号：US10753911
申请日：2004-01-07
申请人： Yiu Sing Ho , Hiroshi Fukaya , Kam Fung Yip , Satoshi Yamaguchi , Jeffery Wang , Can Hua Chen
发明人： Yiu Sing Ho , Hiroshi Fukaya , Kam Fung Yip , Satoshi Yamaguchi , Jeffery Wang , Can Hua Chen
IPC分类号： G11B5/48 , G11B5/55 , G11B21/00 , H05K1/18 , H05K3/00 , H05K3/32 , H05K3/34
CPC分类号： G11B5/4853 , G11B5/4846 , G11B5/486 , H05K1/189 , H05K3/0061 , H05K3/328 , H05K3/3447 , H05K2201/10303 , Y10T29/49025
摘要： A method for mounting a head stack assembly (HSA) circuit assembly is disclosed. A flexible circuit substrate may be coupled to a stiffener. The stiffener may be a metal, such as aluminum, or some other stiff and durable material. The flexible circuit substrate may be made of an organic material and may have a series of electronic leads embedded in the flexible circuit substrate. The flexible substrate may be coupled to the stiffener by an adhesive or laminated onto the stiffener. The stiffener may be mounted onto the actuator arm by soldering or by laser welding.
摘要翻译：公开了一种用于安装磁头堆叠组件（HSA）电路组件的方法。柔性电路基板可以耦合到加强件。加强件可以是金属，例如铝，或一些其它刚性耐用的材料。柔性电路基板可以由有机材料制成，并且可以具有嵌入柔性电路基板中的一系列电子引线。柔性基底可以通过粘合剂耦合到加强件或层压到加强件上。加强件可以通过焊接或通过激光焊接安装在致动器臂上。

5. 发明申请

US20070102485A1 SOLDERING METHOD AND APPARATUS 审中-公开
标题翻译：焊接方法和装置
公开(公告)号：US20070102485A1
公开(公告)日：2007-05-10
申请号：US11538172
申请日：2006-10-03
申请人： Hiroshi Fukaya , Satoshi Yamaguchi
发明人： Hiroshi Fukaya , Satoshi Yamaguchi
IPC分类号： A47J36/02
CPC分类号： B23K1/0056 , B23K3/0623 , H01L2224/05573 , H01L2224/11003 , H01L2224/742 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2201/10727 , H05K2203/041 , H05K2203/107 , Y02P70/613
摘要： It is a soldering method for bonding, by solder, each bonding pad formed on respective bonding targets to be bonded to each other. The method comprises the steps of: a pad heating step for irradiating heating beams while the solder is placed on irradiation paths of the heating beams in such a manner that each bonding pad is heated before the solder is melted; and a solder melting step for melting the solder by the heating beams to be attached on each bonding pad, wherein the heating beams are irradiated almost simultaneously in the pad heating step and the solder melting step, and a molten solder heating step is provided thereafter for further heating the molten solder on the bonding pads by the heating beams.
摘要翻译：这是通过焊料将形成在各个接合靶上的每个接合焊盘彼此接合的焊接方法。该方法包括以下步骤：焊盘加热步骤，用于在焊料放置在加热光束的照射路径上时照射加热光束，使得每个焊盘在焊料熔化之前被加热; 以及焊料熔化步骤，用于通过要粘附在每个接合焊盘上的加热束熔化焊料，其中在焊盘加热步骤和焊料熔化步骤中几乎同时照射加热束，然后提供熔融焊料加热步骤，通过加热束进一步加热接合焊盘上的熔融焊料。

6. 发明申请

US20060037188A1 Method and apparatus for removing magnetic head slider 失效
标题翻译：去除磁头滑块的方法和装置
公开(公告)号：US20060037188A1
公开(公告)日：2006-02-23
申请号：US11199146
申请日：2005-08-09
申请人： Hiroshi Fukaya , Satoshi Yamaguchi
发明人： Hiroshi Fukaya , Satoshi Yamaguchi
IPC分类号： G11B5/187
CPC分类号： G11B5/4826 , B23K1/0016 , B23K1/018 , B23K2101/42 , Y10T29/49023 , Y10T29/49025 , Y10T29/4903 , Y10T29/49041 , Y10T29/49144 , Y10T29/49149
摘要： Provided are a method and an apparatus which enable to easily remove a magnetic head slider soldered to a suspension and easily reutilize the removed parts. In the method for removing the magnetic head slider, heat is applied to a suspension to which at least a part of the magnetic head slider is joined by solder so as to remove the magnetic head slider from the suspension. The heating is locally applied to the junction area of the magnetic head slider and the suspension, which is joined by the solder.
摘要翻译：提供了一种方法和装置，其能够容易地去除焊接到悬架上的磁头滑块，并且容易地再利用去除的部件。在去除磁头滑块的方法中，将热量施加到通过焊料将至少一部分磁头滑动器接合到的悬架上，以便从悬架中移除磁头滑块。加热局部施加到磁头滑块的接合区域和由焊料接合的悬架。

7. 发明授权

US07640649B2 Method for removing a magnetic head slider 失效
标题翻译：去除磁头滑块的方法
公开(公告)号：US07640649B2
公开(公告)日：2010-01-05
申请号：US11199146
申请日：2005-08-09
申请人： Hiroshi Fukaya , Satoshi Yamaguchi
发明人： Hiroshi Fukaya , Satoshi Yamaguchi
IPC分类号： G11B5/48 , B23K1/018
CPC分类号： G11B5/4826 , B23K1/0016 , B23K1/018 , B23K2101/42 , Y10T29/49023 , Y10T29/49025 , Y10T29/4903 , Y10T29/49041 , Y10T29/49144 , Y10T29/49149
摘要： A method which enables easy removal of a magnetic head slider soldered to a suspension and easy reuse of the removed parts. In the method for removing the magnetic head slider, heat is applied to a suspension to which at least a part of the magnetic head slider is joined by solder so as to remove the magnetic head slider from the suspension. The heating is locally applied to the junction area of the magnetic head slider and the suspension, which is joined by the solder.
摘要翻译：一种能够容易地去除焊接到悬架上的磁头滑动器并且容易地重新使用被去除的部件的方法。在去除磁头滑块的方法中，将热量施加到通过焊料将至少一部分磁头滑动器接合到的悬架上，以便从悬架中移除磁头滑块。加热局部施加到磁头滑块的接合区域和由焊料接合的悬架。

8. 发明授权

US08013271B2 Soldering method and apparatus 有权
标题翻译：焊接方法和装置
公开(公告)号：US08013271B2
公开(公告)日：2011-09-06
申请号：US12021586
申请日：2008-01-29
申请人： Hiroshi Fukaya , Satoshi Yamaguchi
发明人： Hiroshi Fukaya , Satoshi Yamaguchi
IPC分类号： B23K26/20 , G11B5/127
CPC分类号： B23K1/0056 , B23K2101/40 , H01L2224/11003 , H01L2224/742 , H05K3/3442 , H05K3/3494 , H05K2201/10727 , H05K2203/041 , H05K2203/107 , Y02P70/613 , Y10T29/4903
摘要： To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step.
摘要翻译：为了提高通过焊接制造的产品的质量，通过实现高可靠性焊接，同时抑制由于焊接而导致的接合目标的损坏。提供了一种焊接方法，用于将形成在各个接合靶中的每个接合焊盘与焊料接合。该方法包括：将接合目标各自放置在接合位置的接合目标放置步骤; 焊接步骤，用于在形成在每个接合靶中的每个接合焊盘之间放置焊料，并且通过向焊料照射加热束来进行焊接; 以及用于加热在焊接步骤之前执行的和/或与焊接步骤同时进行的至少一个接合目标的接合目标加热步骤。

9. 发明申请

US20060108400A1 Soldering method and apparatus 审中-公开
标题翻译：焊接方法和装置
公开(公告)号：US20060108400A1
公开(公告)日：2006-05-25
申请号：US11274420
申请日：2005-11-16
申请人： Hiroshi Fukaya , Satoshi Yamaguchi
发明人： Hiroshi Fukaya , Satoshi Yamaguchi
IPC分类号： B23K31/02 , B23K35/24
CPC分类号： B23K1/0056 , B23K35/3013 , B23K2101/40 , H05K3/3442 , H05K3/3494 , H05K2201/10727 , H05K2203/107 , H05K2203/1476 , Y02P70/613
摘要： It is to provide a soldering method and apparatus, which can achieve highly reliable soldering while suppressing damages to a component to be soldered. There is provided a method for soldering an electronic component to a substrate, which comprises a first heating step for heating the entire solder junction area, and a second heating step for heating a part of the solder junction area, which is distant from the electronic component.
摘要翻译：提供焊接方法和装置，其可以实现高可靠性焊接，同时抑制对要焊接的部件的损坏。提供了一种将电子部件焊接到基板上的方法，其包括用于加热整个焊接区域的第一加热步骤和用于加热远离电子部件的焊接区域的一部分的第二加热步骤。

10. 发明授权

US08605985B2 Pattern measurement apparatus and pattern measurement method 有权
标题翻译：图案测量装置和图案测量方法
公开(公告)号：US08605985B2
公开(公告)日：2013-12-10
申请号：US13066939
申请日：2011-04-28
申请人： Hiroshi Fukaya , Jun Matsumoto
发明人： Hiroshi Fukaya , Jun Matsumoto
IPC分类号： G06K9/00
CPC分类号： H01J37/28 , H01J37/222 , H01J2237/221 , H01J2237/24578 , H01J2237/28 , H01J2237/2817
摘要： A pattern measurement apparatus includes: an irradiation unit for irradiating a sample with an electron beam; an electron detection unit for detecting the amount of electrons generated from the sample on which a pattern is formed; an image processor for generating an SEM image of the pattern based on the amount of electrons; and a controller for acquiring a rectangular measurement specification region of the SEM image and calculating a loss ratio of a corner portion of the pattern from areas of the measurement specification region and the corner portion of the pattern. The controller detects edge positions in a predetermined range including a position where a corner of the measurement specification region intersects with a side of the SEM image, and adjusts the measurement specification region in accordance with the edge positions.
摘要翻译：图案测量装置包括：用电子束照射样品的照射单元; 电子检测单元，用于检测从其上形成图案的样品产生的电子的量; 图像处理器，用于基于所述电子量产生所述图案的SEM图像; 以及控制器，用于获取SEM图像的矩形测量指定区域，并且从测量指定区域和图案的拐角部分的面积计算图案的角部的损耗率。控制器检测包括测量指定区域的角部与SEM图像的一侧相交的位置的预定范围内的边缘位置，并且根据边缘位置来调整测量指定区域。

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