专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110204498A1 LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH 审中-公开
标题翻译：引导框架和制造的半导体封装
公开(公告)号：US20110204498A1
公开(公告)日：2011-08-25
申请号：US12712159
申请日：2010-02-24
申请人： Yin Kheng Au , Mohd Rusli Ibrahim , Meng Kong Lye , Zi Song Poh , Seng Kiong Teng , Kesyakumar V.C. Muniandy
发明人： Yin Kheng Au , Mohd Rusli Ibrahim , Meng Kong Lye , Zi Song Poh , Seng Kiong Teng , Kesyakumar V.C. Muniandy
IPC分类号： H01L23/495
CPC分类号： H01L23/49541 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A lead frame for a semiconductor package has a flag to which a semiconductor die is mounted. Tie bars are coupled to the flag. There is a first set of leads and each first set lead in the first set of leads has a first set lead parallel length and a first set lead tapered length. The first set lead parallel length of each first set lead has a constant width and edges that are parallel to edges of all other first set lead parallel lengths. A free end region of the first set lead tapered length of each first set lead provides a first set lead bond target region. There is a second set of leads disposed between a first one of the tie bars and the first set of leads. Each second set lead, in the second set of leads, has a second set lead parallel length and a second set lead tapered length. The second set lead parallel length of each second set lead has a constant width and edges that are parallel to edges of all other second set lead parallel lengths in the second set of leads and also parallel to the edges of first set lead parallel lengths. At least one second set lead has an extension length extending inwardly from the second set lead tapered length, the extension length has a constant width and provides a second set lead bond target region. Wire bond leads electrically couple both the first set lead bond target region and second set lead bond target region to respective die external electrical connection pads on a surface of the die and a package body encloses the die.
摘要翻译：半导体封装的引线框架具有安装有半导体管芯的标志。领带条与标志相连。存在第一组引线，并且第一组引线中的每个第一组引线具有第一组引线平行长度和第一组引线锥形长度。每个第一组引线的第一组引线平行长度具有恒定的宽度，并且与所有其它第一组引线平行长度的边缘平行的边缘。每个第一集合引线的第一组引线锥形长度的自由端区域提供第一组引线键合目标区域。存在设置在第一组连杆和第一组引线之间的第二组引线。在第二组引线中的每个第二设定引线具有第二设定引线平行长度和第二设定引线锥形长度。每个第二组引线的第二组引线平行长度具有恒定的宽度，并且边缘平行于第二组引线中的所有其它第二设定引线平行长度的边缘，并且平行于第一组引线平行长度的边缘。至少一个第二固定引线具有从第二组引线锥形长度向内延伸的延伸长度，延伸长度具有恒定的宽度并且提供第二组引线键合目标区域。引线接合引线将第一组引线接合目标区域和第二组引线接合目标区域电耦合到管芯表面上的相应管芯外部电连接焊盘，并且封装主体封装管芯。

IPRDB

热门服务

关于我们

友情链接

联系方式