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1. 发明申请

US20050124151A1 Novel method to deposit carbon doped SiO2 films with improved film quality 审中-公开
标题翻译：用于提高膜质量的新型沉积碳掺杂SiO 2膜的方法
公开(公告)号：US20050124151A1
公开(公告)日：2005-06-09
申请号：US10728215
申请日：2003-12-04
申请人： Yi-Lung Cheng , Ren-Haur Liu , Cheng-Hsiung Liu , Ying-Lang Wang , Hway-Chi Lin , Chien-Ming Chiu
发明人： Yi-Lung Cheng , Ren-Haur Liu , Cheng-Hsiung Liu , Ying-Lang Wang , Hway-Chi Lin , Chien-Ming Chiu
IPC分类号： C23C16/40 , H01L21/316 , H01L21/768 , H01L21/4763 , H01L21/31 , H01L21/469
CPC分类号： H01L21/02126 , C23C16/401 , H01L21/02211 , H01L21/02274 , H01L21/02304 , H01L21/02362 , H01L21/31633 , H01L21/76801 , H01L21/76807 , H01L21/76819
摘要： A method is disclosed for depositing a Black Diamond layer in a CVD chamber. Trimethylsilane, O2, and Ar are flowed into the chamber at 300° C. to 400° C. with an O2:Ar:trimethylsilane flow rate ratio that is preferably 1:1.5:6. The resulting low k dielectric layer is formed with a higher deposition rate than when Ar is omitted and has a k value of about 3 that increases only slightly in O2 plasma. A higher density, hardness, and tensile strength are achieved in the Black Diamond layer when Ar is included in the deposition process. The addition of Ar in the deposition maintains film thickness uniformity below 2% for a longer period so that PM cleaning operations are less frequent and affords a lower fluorocarbon plasma etch rate to enable improved trench depth control in a damascene scheme. A lower leakage current and higher breakdown voltage in achieved in the resulting metal interconnect.
摘要翻译：公开了一种用于在CVD室中沉积黑金刚石层的方法。三甲基硅烷O 2和Ar在300℃至400℃下以0:2:Ar:三甲基硅烷流速比流入室中，优选 1：1.5：6。形成的低k电介质层的沉积速率高于省略Ar时的沉积速率，并且具有约3的K值仅在O 2等离子体中略微增加。当在沉积过程中包含Ar时，在黑色金刚石层中获得较高的密度，硬度和拉伸强度。沉积中Ar的添加将膜厚度均匀性维持在2％以下更长的时间，以便PM清洁操作较不频繁，并提供较低的氟碳等离子体蚀刻速率，从而能够改进镶嵌方案中的沟槽深度控制。在所得到的金属互连中实现较低的漏电流和更高的击穿电压。

2. 发明授权

US06752953B2 Method for manufacturing hard non-gelatin pharmaceutical capsules 失效
标题翻译：硬质非明胶药胶囊的制造方法
公开(公告)号：US06752953B2
公开(公告)日：2004-06-22
申请号：US09998317
申请日：2001-12-03
申请人： Gan-Lin Chen , Chien-Yuan Lee , Cheng-Hsiung Liu
发明人： Gan-Lin Chen , Chien-Yuan Lee , Cheng-Hsiung Liu
IPC分类号： C08J500
CPC分类号： A61K9/4816 , B29C43/021 , B29C43/16 , B29C43/361 , B29C43/42
摘要： The present invention provides a method for manufacturing a non-gelatin hard capsule shell. The hard capsule shell is made by a heat-melting method which involves heating a capsule forming composition (preferably in powdery form) in a mold, followed by inserting a pestle into the mold to coat the melted capsule forming composition onto the pestle. The hard capsule shell thus formed, after hardened and dried, is removed from the pestle. This method has the advantages over the conventional “dip molding method” for not requiring the capsule forming composition to be pre-dissolved in solution so that no solvent is used in preparing the capsule forming composition. Also, by inserting a pestle into a mold, a pressure is imposed so as to ensure uniform coating of the capsule forming composition to the pestle. The present invention also provides a capsule forming composition which comprises a polymer and optionally a plasticizer and an apparatus for making the non-gelatin hard capsule shell.
摘要翻译：本发明提供一种制造非明胶硬胶囊壳的方法。硬胶囊壳是通过加热熔融法制成的，其包括在模具中加热胶囊形成组合物（优选粉末形式），随后将杵插入模具中以将熔融的胶囊形成组合物涂覆到杵上。这样形成的硬胶囊壳在硬化和干燥之后从研杵上取出。该方法相对于常规的“浸渍成型方法”具有优于不需要胶囊形成组合物预溶解在溶液中的优点，使得在制备胶囊形成组合物中不使用溶剂。此外，通过将杵插入模具中，施加压力以确保将胶囊形成组合物均匀地涂覆到研杵上。本发明还提供了包含聚合物和任选的增塑剂的胶囊形成组合物和用于制备非明胶硬胶囊壳的装置。

3. 发明授权

US11123828B1 Extraction tool 有权
公开(公告)号：US11123828B1
公开(公告)日：2021-09-21
申请号：US16935956
申请日：2020-07-22
申请人： Cheng-Hsiung Liu
发明人： Cheng-Hsiung Liu
IPC分类号： B23P19/04 , B25B27/02 , B23P19/02
摘要： An extraction tool includes a coupling disc, an operating rod and two pads, wherein the coupling disc is penetrated by an assembly hole, the operating rod is provided in the assembly hole, and the pads can be movably arranged on the coupling disc. The coupling disc is penetrated by four first through grooves, two second through grooves, two third through grooves and two fourth through grooves. Each of the pads respectively covers one of the fourth through grooves, and the pads are each penetrated by one fifth through groove, each fifth through groove communicates with one of the fourth through grooves, and one side of each fifth through groove forms an alignment relationship with one of two sides of each of the fourth through grooves.

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