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    • 1. 发明授权
    • ESD protection circuit with low parasitic capacitance
    • 具有低寄生电容的ESD保护电路
    • US07518843B2
    • 2009-04-14
    • US11134539
    • 2005-05-19
    • Yi-Hsun WuJian-Hsing Lee
    • Yi-Hsun WuJian-Hsing Lee
    • H02H9/00H02H3/22
    • H01L27/0262
    • An ESD protection circuit includes a silicon controlled rectifier coupled between a circuit pad and ground for bypassing an ESD current from the circuit pad during an ESD event. An MOS transistor, having a source shared with the silicon controlled rectifier, is coupled between the pad and ground for reducing a trigger voltage of the silicon controlled rectifier during the ESD event. The silicon controlled rectifier has a first diode serially connected to a second diode in an opposite direction, between the pad and the shared source of the MOS transistor, for functioning as a bipolar transistor. In a layout view, a first area for placement of the first and second diodes is interposed between at least two separate sets of second areas for placement of the MOS transistor.
    • ESD保护电路包括耦合在电路焊盘和地之间的可控硅整流器,用于在ESD事件期间旁路来自电路板的ESD电流。 具有与可控硅整流器共享的源极的MOS晶体管耦合在焊盘和地之间,以在ESD事件期间降低可控硅整流器的触发电压。 可控硅整流器具有在与MOS晶体管的焊盘和共享源之间的相反方向上串联连接到第二二极管的第一二极管,用作双极晶体管。 在布局图中,用于放置第一和第二二极管的第一区域介于至少两个分开的第二区域组之间,用于放置MOS晶体管。
    • 2. 发明授权
    • Input/output devices with robustness of ESD protection
    • 具有ESD保护鲁棒性的输入/输出设备
    • US07508639B2
    • 2009-03-24
    • US11305983
    • 2005-12-19
    • Yi-Hsun WuJian-Hsing LeeShui-Hung Chen
    • Yi-Hsun WuJian-Hsing LeeShui-Hung Chen
    • H02H9/00H02H3/22H02H1/00H02H1/04H02H9/06H01C7/12
    • H01L27/0266H01L2924/0002H01L2924/00
    • Input/output devices with robustness of ESD protection are provided. An input/output device comprises an input/output pad, a first NMOS transistor, a second NMOS transistor and an ESD detector. The first NMOS transistor comprises a first drain, a first source and a first gate, wherein the first source and the first gate are coupled to a first ground power rail, and the first drain to the input/output pad. The second NMOS transistor comprises a second drain, a second source and a second gate, wherein the second source is coupled to the first ground power rail, the second drain to the input/output pad, and the second gate to a first pre-driver. When an ESD event is detected, the ESD detector makes the first pre-driver couple the second gate to the first ground power rail, thereby the first and second transistors evenly discharge ESD current.
    • 提供具有ESD保护鲁棒性的输入/输出设备。 输入/输出装置包括输入/​​输出焊盘,第一NMOS晶体管,第二NMOS晶体管和ESD检测器。 第一NMOS晶体管包括第一漏极,第一源极和第一栅极,其中第一源极和第一栅极耦合到第一接地电源轨,第一漏极耦合到输入/输出焊盘。 第二NMOS晶体管包括第二漏极,第二源极和第二栅极,其中第二源极耦合到第一接地电源轨,第二漏极耦合到输入/输出焊盘,第二栅极耦合到第一预驱动器 。 当检测到ESD事件时,ESD检测器使第一预驱动器将第二栅极耦合到第一接地电源轨,由此第一和第二晶体管均匀地放电ESD电流。
    • 6. 发明申请
    • ESD protection circuit with low parasitic capacitance
    • 具有低寄生电容的ESD保护电路
    • US20050254189A1
    • 2005-11-17
    • US11091131
    • 2005-03-28
    • Yi-Hsun WuJian-Hsing Lee
    • Yi-Hsun WuJian-Hsing Lee
    • G01R27/02G11C17/16G11C17/18H01L27/02H01L29/00H01L29/74H02H9/00
    • H01L27/0262G11C17/16G11C17/18H01L29/7436
    • An ESD protection circuit includes a silicon controlled rectifier coupled between a circuit pad and ground for bypassing an ESD current from the circuit pad during an ESD event. An MOS transistor, having a source shared with the silicon controlled rectifier, is coupled between the pad and ground for reducing a trigger voltage of the silicon controlled rectifier during the ESD event. The silicon controlled rectifier has a first diode serially connected to a second diode in an opposite direction, between the pad and the shared source of the MOS transistor, for functioning as a bipolar transistor. In a layout view, a first area for placement of the first and second diodes is interposed between at least two separate sets of second areas for placement of the MOS transistor.
    • ESD保护电路包括耦合在电路焊盘和地之间的可控硅整流器,用于在ESD事件期间旁路来自电路板的ESD电流。 具有与可控硅整流器共享的源极的MOS晶体管耦合在焊盘和地之间,以在ESD事件期间降低可控硅整流器的触发电压。 可控硅整流器具有在与MOS晶体管的焊盘和共享源之间的相反方向上串联连接到第二二极管的第一二极管,用作双极晶体管。 在布局图中,用于放置第一和第二二极管的第一区域介于至少两个分开的第二区域组之间,用于放置MOS晶体管。
    • 9. 发明授权
    • CMOS device using additional implant regions to enhance ESD performance and device manufactured thereby
    • CMOS器件使用额外的注入区域来增强ESD性能,并由此制造器件
    • US06703663B1
    • 2004-03-09
    • US09655086
    • 2000-09-05
    • Jian-Hsing LeeYi-Hsun WuJian-Ren Shih
    • Jian-Hsing LeeYi-Hsun WuJian-Ren Shih
    • H01L2976
    • H01L29/7833H01L21/823814H01L27/0266H01L29/1083
    • A method of forming a semiconductor memory device formed on a semiconductor substrate with an N-well and a P-well comprises the following steps. Form over a substrate the combination of a gate oxide layer and a gate layer patterned into gate stacks with sidewalls for an NMOS FET device over a P-well in the substrate and a PMOS FET device over an N-well. Form P− lightly doped S/D regions in the N-well and N− lightly doped S/D regions in the P-well. Form spacers on the sidewalls of the gate stacks. Thereafter form deep N− lightly doped S/D regions in the P-well, and form deep P− lightly doped S/D regions in the N-well. Form heavily doped P++ regions self-aligned with the gate below future P+ S/D sites to be formed self-aligned with the spacers in the N-well, and form heavily doped N++ regions self-aligned with the gate below future N+ S/D sites to be formed self-aligned with the spacers in the P-well.
    • 用N阱和P阱形成在半导体衬底上的半导体存储器件的形成方法包括以下步骤。 在衬底上形成栅极氧化物层和栅极层的组合,栅极层与衬底中的P阱上的NMOS FET器件的侧壁和N阱上的PMOS FET器件构图成栅极堆叠。 在P阱中的N阱和N-轻掺杂的S / D区中形成P-轻掺杂的S / D区。 在栅极堆叠的侧壁上形成间隔物。 然后在P阱中形成深N轻掺杂的S / D区,并在N阱中形成深P-轻掺杂的S / D区。 形成与未来P + S / D位置下方的栅极自对准的重掺杂P ++区域,以与N阱中的间隔物自对准,并形成与未来N + S / D的栅极自对准的重掺杂N ++区域, D点与P阱中的间隔物自对准。
    • 10. 发明授权
    • Effective Vcc to Vss power ESD protection device
    • 有效Vcc至Vss电源ESD保护装置
    • US06682993B1
    • 2004-01-27
    • US10161007
    • 2002-05-31
    • Yi-Hsun WuJian-Hsing Lee
    • Yi-Hsun WuJian-Hsing Lee
    • H01L2104
    • H01L27/0266
    • The invention consists of an ESD protection discharging NMOS with a special drain dopant region that enables a lower voltage trigger point for Vcc to Vss ESD power protection. To enable this ESD protection, the NMOS source connected to a first voltage bus line, or Vcc, and the drain is connected to a second voltage bus line, or ground. The NMOS device gate is connected to ground through a difflused resistor assuring the device remains in an off state during normal operation. The unique invention special dopant region is located under and around the NMOS drain which lowers the drain to substrate breakdown voltage enabling the ESD protection current discharge to start at a lower voltage than otherwise. This feature reduces voltage stress on the gates of active devices being protected, and enables higher ESD current discharges at the same power level as for devices without the special drain dopant region.
    • 本发明包括具有特殊漏极掺杂剂区域的ESD保护放电NMOS,其能够实现用于Vcc至Vss ESD功率保护的较低电压触发点。 为了实现该ESD保护,连接到第一电压总线或Vcc的NMOS源和漏极连接到第二电压总线或地。 NMOS器件栅极通过差分电阻器连接到地,确保器件在正常工作期间保持关断状态。 独特的发明特殊掺杂剂区域位于NMOS漏极的下面和周围,这降低了漏极到衬底的击穿电压,使得ESD保护电流放电能够以比其他电压更低的电压开始。 该特性降低了受保护的有源器件的栅极上的电压应力,并且能够实现与没有特殊漏极掺杂剂区域的器件相同功率电平的更高的ESD电流放电。