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    • 1. 发明授权
    • CMOS device using additional implant regions to enhance ESD performance and device manufactured thereby
    • CMOS器件使用额外的注入区域来增强ESD性能,并由此制造器件
    • US06703663B1
    • 2004-03-09
    • US09655086
    • 2000-09-05
    • Jian-Hsing LeeYi-Hsun WuJian-Ren Shih
    • Jian-Hsing LeeYi-Hsun WuJian-Ren Shih
    • H01L2976
    • H01L29/7833H01L21/823814H01L27/0266H01L29/1083
    • A method of forming a semiconductor memory device formed on a semiconductor substrate with an N-well and a P-well comprises the following steps. Form over a substrate the combination of a gate oxide layer and a gate layer patterned into gate stacks with sidewalls for an NMOS FET device over a P-well in the substrate and a PMOS FET device over an N-well. Form P− lightly doped S/D regions in the N-well and N− lightly doped S/D regions in the P-well. Form spacers on the sidewalls of the gate stacks. Thereafter form deep N− lightly doped S/D regions in the P-well, and form deep P− lightly doped S/D regions in the N-well. Form heavily doped P++ regions self-aligned with the gate below future P+ S/D sites to be formed self-aligned with the spacers in the N-well, and form heavily doped N++ regions self-aligned with the gate below future N+ S/D sites to be formed self-aligned with the spacers in the P-well.
    • 用N阱和P阱形成在半导体衬底上的半导体存储器件的形成方法包括以下步骤。 在衬底上形成栅极氧化物层和栅极层的组合,栅极层与衬底中的P阱上的NMOS FET器件的侧壁和N阱上的PMOS FET器件构图成栅极堆叠。 在P阱中的N阱和N-轻掺杂的S / D区中形成P-轻掺杂的S / D区。 在栅极堆叠的侧壁上形成间隔物。 然后在P阱中形成深N轻掺杂的S / D区,并在N阱中形成深P-轻掺杂的S / D区。 形成与未来P + S / D位置下方的栅极自对准的重掺杂P ++区域,以与N阱中的间隔物自对准,并形成与未来N + S / D的栅极自对准的重掺杂N ++区域, D点与P阱中的间隔物自对准。
    • 3. 发明授权
    • ESD protection circuit for different power supplies
    • ESD保护电路用于不同电源
    • US06400542B1
    • 2002-06-04
    • US09882680
    • 2001-06-18
    • Jian-Hsing LeeJian-Ren ShihYi-Hsun WuJing-Meng Liu
    • Jian-Hsing LeeJian-Ren ShihYi-Hsun WuJing-Meng Liu
    • H02H900
    • H01L27/0259
    • A voltage clamping circuit that protects integrated circuits having multiple separate power supply voltage terminals from damage when an ESD event causes excessive differential voltages between the multiple separate power supply voltage terminals. The voltage clamping circuit has two subgroups of Darlington connected clamping transistors. The first subgroup of Darlington connected clamping transistors is connected between the first power supply voltage terminal and the second power supply voltage terminal. If the differential voltage exceeds the first clamping voltage level, the first subgroup of Darlington connected clamping transistors turn on and restore the first differential voltage to a level less than the first clamping voltage level. The second subgroup of Darlington connected clamping transistors connected between the second power supply terminal and the first power supply terminal. If the differential voltage exceeds the second clamping voltage level, the second subgroup of Darlington connected transistors turn on and restore the differential voltage to a level less than the second clamping voltage level.
    • 一种电压钳位电路,当ESD事件在多个分离的电源电压端子之间引起过大的差分电压时,保护具有多个单独的电源电压端子的集成电路免受损坏。 电压钳位电路有两个Darlington连接钳位晶体管的子组。 达林顿连接的钳位晶体管的第一个子组连接在第一电源电压端子和第二电源电压端子之间。 如果差分电压超过第一钳位电压电平,则达林顿连接的钳位晶体管的第一个子组导通,并将第一个差分电压恢复到小于第一钳位电压电平的电平。 连接在第二电源端子和第一电源端子之间的达林顿的第二子组连接钳位晶体管。 如果差分电压超过第二钳位电压电平,则达林顿连接晶体管的第二个子组导通,并将差分电压恢复到小于第二钳位电压电平的电平。