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1. 发明授权

US07015127B2 Semiconductor device and a method of manufacturing the same 失效
公开(公告)号：US07015127B2
公开(公告)日：2006-03-21
申请号：US10408119
申请日：2003-04-08
申请人： Yasuyuki Nakajima , Toshiaki Morita , Tomoo Matsuzawa , Seiichi Tomoi , Naoki Kawanabe
发明人： Yasuyuki Nakajima , Toshiaki Morita , Tomoo Matsuzawa , Seiichi Tomoi , Naoki Kawanabe
IPC分类号： H01L21/44
CPC分类号： H01L24/05 , H01L23/53223 , H01L24/03 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/05073 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/45015 , H01L2224/45144 , H01L2224/4807 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48453 , H01L2224/48465 , H01L2224/48507 , H01L2224/48624 , H01L2224/49175 , H01L2224/78301 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/0496 , H01L2924/05042 , H01L2924/1306 , H01L2924/14 , H01L2924/181 , H01L2924/20106 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/20308 , H01L2924/20752 , H01L2924/3011 , H01L2924/00014 , H01L2924/04953 , H01L2924/00 , H01L2924/20751 , H01L2924/00012
摘要： Provided is a semiconductor device comprising a first metal film formed above a semiconductor chip, a ball portion formed over said first metal film and made of a second metal, and an alloy layer of said first metal and said second metal which alloy layer is formed between said first metal film and said ball portion, wherein said alloy layer reaches the bottom of said first metal film, and said ball portion is covered with a resin; and a manufacturing method thereof. The present invention makes it possible to improve adhesion between the bonding pad portion and ball portion of a bonding wire over an interconnect, thereby improving the reliability of the semiconductor device.

2. 发明申请

US20050121805A1 Semiconductor device and a method of manufacturing the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050121805A1
公开(公告)日：2005-06-09
申请号：US11035999
申请日：2005-01-18
申请人： Tomoo Matsuzawa , Takafumi Nishita , Yasuyuki Nakajima , Toshiaki Morita
发明人： Tomoo Matsuzawa , Takafumi Nishita , Yasuyuki Nakajima , Toshiaki Morita
IPC分类号： H01L23/48 , H01L21/60 , H01L23/498 , H01L25/065 , H01L21/48
CPC分类号： H01L24/85 , H01L23/49838 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/48647 , H01L2224/49052 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/85 , H01L2224/85203 , H01L2224/85205 , H01L2224/97 , H01L2225/0651 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01079 , H01L2924/014 , H01L2924/05042 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/01039 , H01L2224/78 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device comprising a plurality of wires for electrically connecting a plurality of electrode pads arranged on a main surface of a semiconductor chip along one side of the semiconductor chip to a plurality of connecting portions arranged on the main surface of a wiring substrate along one side of the semiconductor chip, respectively, wherein second wires out of the plural wires consisting of first and second wires adjacent to each other have a larger loop height than the first wires, one end portions of the second wires are connected to the electrode pads at positions farther from one side of the semiconductor chip than the one end portions of the first wires, and the other end portions of the second wires are connected to the connecting portions at positions farther from one side of the semiconductor chip than the other end portions of the first wires.
摘要翻译：一种半导体器件，包括多个引线，用于将布置在半导体芯片的主表面上的多个电极焊盘沿着半导体芯片的一侧电连接到布置在布线基板的主表面上的多个连接部分其中，由彼此相邻的第一和第二布线组成的多根导线中的第二布线具有比第一布线更大的环形高度，第二布线的一个端部在电极焊盘的位置处连接比半导体芯片的一侧比第一布线的一个端部更远，而第二布线的另一个端部在与半导体芯片的另一个端部相比更靠近半导体芯片的一侧的位置处连接到连接部分第一根电线

3. 发明授权

US06900551B2 Semiconductor device with alternate bonding wire arrangement 有权
标题翻译：具有交替接合线布置的半导体器件
公开(公告)号：US06900551B2
公开(公告)日：2005-05-31
申请号：US10430279
申请日：2003-05-07
申请人： Tomoo Matsuzawa , Takafumi Nishita , Yasuyuki Nakajima , Toshiaki Morita
发明人： Tomoo Matsuzawa , Takafumi Nishita , Yasuyuki Nakajima , Toshiaki Morita
IPC分类号： H01L23/48 , H01L21/60 , H01L23/498 , H01L25/065
CPC分类号： H01L24/85 , H01L23/49838 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/48624 , H01L2224/48647 , H01L2224/49052 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/85 , H01L2224/85203 , H01L2224/85205 , H01L2224/97 , H01L2225/0651 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01079 , H01L2924/014 , H01L2924/05042 , H01L2924/1306 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/01039 , H01L2224/78 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device comprising a plurality of wires for electrically connecting a plurality of electrode pads arranged on a main surface of a semiconductor chip along one side of the semiconductor chip to a plurality of connecting portions arranged on the main surface of a wiring substrate along one side of the semiconductor chip, respectively, wherein second wires out of the plural wires consisting of first and second wires adjacent to each other have a larger loop height than the first wires, one end portions of the second wires are connected to the electrode pads at positions farther from one side of the semiconductor chip than the one end portions of the first wires, and the other end portions of the second wires are connected to the connecting portions at positions farther from one side of the semiconductor chip than the other end portions of the first wires.
摘要翻译：一种半导体器件，包括多个引线，用于将布置在半导体芯片的主表面上的多个电极焊盘沿着半导体芯片的一侧电连接到布置在布线基板的主表面上的多个连接部分其中，由彼此相邻的第一和第二布线组成的多根导线中的第二布线具有比第一布线更大的环形高度，第二布线的一个端部在电极焊盘的位置处连接比半导体芯片的一侧比第一布线的一个端部更远，而第二布线的另一个端部连接到比半导体芯片的另一个端部更远离半导体芯片的一侧的连接部分第一根电线

4. 发明授权

US06897570B2 Semiconductor device and method of manufacturing same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06897570B2
公开(公告)日：2005-05-24
申请号：US10340307
申请日：2003-01-09
申请人： Takashi Nakajima , Naotaka Tanaka , Yasuyuki Nakajima , Ryo Haruta , Tomoo Matsuzawa , Masashi Sahara , Ken Okutani
发明人： Takashi Nakajima , Naotaka Tanaka , Yasuyuki Nakajima , Ryo Haruta , Tomoo Matsuzawa , Masashi Sahara , Ken Okutani
IPC分类号： H01L21/60 , H01L23/485 , H01L23/522 , H01L29/40
CPC分类号： H01L24/05 , H01L23/485 , H01L23/5226 , H01L24/03 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05082 , H01L2224/05093 , H01L2224/05096 , H01L2224/05166 , H01L2224/05187 , H01L2224/05556 , H01L2224/05557 , H01L2224/05558 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4807 , H01L2224/48453 , H01L2224/48463 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/48824 , H01L2224/85205 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01044 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/20106 , H01L2924/20303 , H01L2924/20752 , H01L2924/30105 , H01L2924/00014 , H01L2924/04953 , H01L2924/00 , H01L2924/00011
摘要： A highly reliable semiconductor device provided herein can prevent a junction between a pad and a wire from coming off, and pads from peeling off an underlying insulating layer on the interface thereof. The semiconductor device has plugs formed in a region in which an electrode pad is formed over a substrate. The plugs protrude into the electrode pad.
摘要翻译：这里提供的高度可靠的半导体器件可以防止焊盘和电线之间的接合脱落，并且焊盘从其界面上的下面的绝缘层剥离。半导体器件具有形成在电极焊盘形成在衬底上的区域中的插塞。插头突出到电极垫中。

5. 发明申请

US20050001314A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20050001314A1
公开(公告)日：2005-01-06
申请号：US10873251
申请日：2004-06-23
申请人： Naotaka Tanaka , Tomio Iwasaki , Hideo Miura , Yasuyuki Nakajima , Tomoo Matsuzawa
发明人： Naotaka Tanaka , Tomio Iwasaki , Hideo Miura , Yasuyuki Nakajima , Tomoo Matsuzawa
IPC分类号： H01L23/52 , H01L21/3205 , H01L21/44 , H01L21/56 , H01L21/60 , H01L21/768 , H01L23/31 , H01L23/48 , H01L23/485 , H01L23/532 , H01L25/065
CPC分类号： H01L23/53238 , H01L21/563 , H01L23/3128 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/85 , H01L25/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/4807 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/4851 , H01L2224/48624 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/78301 , H01L2224/85045 , H01L2224/85205 , H01L2225/06558 , H01L2225/06568 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20751 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2924/00011 , H01L2924/00015
摘要： An object of the present invention is to establish, for an LSI having a stacked interconnection structure of Cu interconnect/Low-k material, a narrow pitch wire bonding technique enabling a reduction in damage to a bonding pad and application similar to the conventional LSI of an aluminum interconnection. In a semiconductor device having a multilayer interconnection made of a Cu interconnect/Low-k dielectric material, the above-described object can be attained by a bonding pad structure in which all the wiring layers up to the uppermost cap interconnect are formed of a Cu wiring layer and a bonding pad portion formed of a Cu layer is equipped with a refractory intermediate metal layer such as Ti (titanium) filmor (tungsten) film on the Cu layer and an aluminum alloy layer on the intermediate metal layer.
摘要翻译：本发明的目的在于，对于具有Cu互连/ Low-k材料的堆叠互连结构的LSI，可以实现能够减少对焊盘的损伤的窄间距引线接合技术和类似于常规LSI的铝互连。在具有由Cu互连/ Low-k电介质材料制成的多层互连的半导体器件中，上述目的可以通过一种焊盘结构来实现，其中所有的布线层直到最上盖互连件都是由Cu 布线层和由Cu层形成的接合焊盘部分在Cu层上装有诸如Ti（钛）膜（钨）的耐火材料中间金属层和中间金属层上的铝合金层。

6. 发明申请

US20070187823A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20070187823A1
公开(公告)日：2007-08-16
申请号：US11783983
申请日：2007-04-13
申请人： Naotaka Tanaka , Tomio Iwasaki , Hideo Miura , Yasuyuki Nakajima , Tomoo Matsuzawa
发明人： Naotaka Tanaka , Tomio Iwasaki , Hideo Miura , Yasuyuki Nakajima , Tomoo Matsuzawa
IPC分类号： H01L23/48
CPC分类号： H01L23/53238 , H01L21/563 , H01L23/3128 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/85 , H01L25/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/4807 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/4851 , H01L2224/48624 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/78301 , H01L2224/85045 , H01L2224/85205 , H01L2225/06558 , H01L2225/06568 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20751 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2924/00011 , H01L2924/00015
摘要： An object of the present invention is to establish, for an LSI having a stacked interconnection structure of Cu interconnect/Low-k material, a narrow pitch wire bonding technique enabling a reduction in damage to a bonding pad and application similar to the conventional LSI of an aluminum interconnection. In a semiconductor device having a multilayer interconnection made of a Cu interconnect/Low-k dielectric material, the above-described object can be attained by a bonding pad structure in which all the wiring layers up to the uppermost cap interconnect are formed of a Cu wiring layer and a bonding pad portion formed of a Cu layer is equipped with a refractory intermediate metal layer such as Ti (titanium) filmor (tungsten) film on the Cu layer and an aluminum alloy layer on the intermediate metal layer.
摘要翻译：本发明的目的在于，对于具有Cu互连/ Low-k材料的堆叠互连结构的LSI，可以实现能够减少对焊盘的损伤的窄间距引线接合技术和类似于传统LSI的铝互连。在具有由Cu互连/ Low-k电介质材料制成的多层互连的半导体器件中，上述目的可以通过一种焊盘结构来实现，其中所有的布线层直到最上盖互连件都是由Cu 布线层和由Cu层形成的接合焊盘部分在Cu层上装有诸如Ti（钛）膜（钨）的耐火材料中间金属层和中间金属层上的铝合金层。

7. 发明授权

US08774264B2 Image insertion device for compressed video data 有权
标题翻译：用于压缩视频数据的图像插入装置
公开(公告)号：US08774264B2
公开(公告)日：2014-07-08
申请号：US10805328
申请日：2004-03-22
申请人： Yasuyuki Nakajima
发明人： Yasuyuki Nakajima
IPC分类号： H04N7/12
CPC分类号： H04N19/159 , H04N19/467 , H04N19/48
摘要： Input MPEG compressed data is input into a partial decoder and a logo insertion controller. A block DCT coefficients (a) output from the partial decoder is divided into a logo insertion region (c) and a non-logo insertion region (d) in a logo insertion region separator. Logo data (e) supplied from a logo information supply section is combined into the logo insertion region (c) with an arbitrary mixing ratio in a logo information insert section. In a logo region partial re-encoder, intra-frame coding of an image insertion region is executed when a starting frame for inserting an image is an intra-coded frame or a predictive coded frame, and, when the starting frame is a bidirectionally predictive-coded frame, inter-frame coding of the image insertion region is executed, and intra encoding of the image insertion region is executed in a frame to which the starting frame for inserting the image can refer.
摘要翻译：输入MPEG压缩数据被输入到部分解码器和徽标插入控制器中。从部分解码器输出的块DCT系数（a）在徽标插入区域分离器中分为标志插入区域（c）和非标识插入区域（d）。从徽标信息提供部提供的标识数据（e）在徽标信息插入部分中以任意的混合比组合到徽标插入区域（c）中。在标识区域部分重新编码器中，当用于插入图像的起始帧是帧内编码帧或预测编码帧时，执行图像插入区域的帧内编码，并且当起始帧是双向预测时编码帧，执行图像插入区域的帧间编码，并且在用于插入图像的开始帧可以参考的帧中执行图像插入区域的帧内编码。

8. 发明申请

US20110142292A1 PICTURE SEARCHING APPARATUS 失效
标题翻译：图片搜索设备
公开(公告)号：US20110142292A1
公开(公告)日：2011-06-16
申请号：US13033757
申请日：2011-02-24
申请人： Yasuyuki Nakajima , Masaru Sugano , Hiromasa Yanagihara
发明人： Yasuyuki Nakajima , Masaru Sugano , Hiromasa Yanagihara
IPC分类号： G06K9/00
CPC分类号： H04N5/147
摘要： The picture input section 12 fetches image data from the storage device 11, and then, inputs image data on sequential n images into the section 13 for measuring correlation between sequential images and the section 14 for measuring correlation between sampled images. The section 13 for measuring correlation between sequential images measures the correlation between sequential images based on video data. The section 14 for measuring correlation between sampled images measures the correlation between sub-sampled images. The short shot determining section 15 determines short cut points by using the correlation between the sequential images and the correlation between the sub-sampled images. Otherwise, short cut points may be determined in consideration of motion amount between the sequential images or the sub-sampled images.
摘要翻译：图像输入部分12从存储装置11获取图像数据，然后将顺序n图像上的图像数据输入到用于测量顺序图像之间的相关性的部分13和用于测量采样图像之间的相关性的部分14。用于测量连续图像之间的相关性的部分13测量基于视频数据的连续图像之间的相关性。用于测量采样图像之间的相关性的部分14测量子采样图像之间的相关性。短拍判定部15通过使用顺序图像之间的相关性和子采样图像之间的相关性来确定快捷点。否则，可以考虑顺序图像或次采样图像之间的运动量来确定快捷点。

9. 发明授权

US07801969B2 Apparatus and method for compression-transmitting and decoding picture information and storage medium stored its control programs 有权
标题翻译：用于压缩 - 传输和解码图像信息和存储介质的装置和方法存储其控制程序
公开(公告)号：US07801969B2
公开(公告)日：2010-09-21
申请号：US11244033
申请日：2005-10-06
申请人： Yasuyuki Nakajima , Hiromasa Yanagihara , Akio Yoneyama , Masaru Sugano
发明人： Yasuyuki Nakajima , Hiromasa Yanagihara , Akio Yoneyama , Masaru Sugano
IPC分类号： G06F15/16
CPC分类号： H04J3/22 , H04N21/2187 , H04N21/23406 , H04N21/44004 , H04N21/64322 , H04N21/64776
摘要： The present invention provides a real-time live picture information compression-transmission apparatus and method using a connection-less type protocol for a computer network. The compression-transmission apparatus is constituted to divide frame data output from a real-time encoder compressing live picture information into packets, and to transmit the live picture information in a real time manner according to the connection-less type protocol while suppressing burst transmission by conducting transmission control. The present invention also provides a compressed video data decoding apparatus capable of reducing compressed video decoding processing load without deteriorating picture quality and decreasing the number of played back picture planes when playing back a picture.
摘要翻译：本发明提供一种使用计算机网络的无连接型协议的实时实况图像信息压缩传输装置和方法。压缩传输装置被构成为将从实时编码器输出的帧数据分割成分组，并根据无连接类型协议以实时方式发送实况图像信息，同时抑制突发传输进行传输控制。本发明还提供了一种压缩视频数据解码装置，能够在不影响图像质量的同时降低压缩视频解码处理负荷，并且在播放图像时减少播放的图像平面的数量。

10. 发明授权

US07398320B1 Information distribution/reproduction control apparatus, information distribution/reproduction control method, and computer-readable recording medium recorded with information distribution/reproduction control program 有权
标题翻译：信息分配/再现控制装置，信息分配/再现控制方法以及记录有信息分配/再现控制程序的计算机可读记录介质
公开(公告)号：US07398320B1
公开(公告)日：2008-07-08
申请号：US09534403
申请日：2000-03-22
申请人： Yu Minakuchi , Mitsuru Osawa , Yasuyuki Nakajima , Hiromasa Yanagihara
发明人： Yu Minakuchi , Mitsuru Osawa , Yasuyuki Nakajima , Hiromasa Yanagihara
IPC分类号： G06F15/16
CPC分类号： H04N5/765 , H04H20/42 , H04H20/76 , H04H60/09 , H04H60/82 , H04N5/77 , H04N9/7921 , H04N21/234363 , H04N21/2402 , H04N21/25808 , H04N21/2662
摘要： In an information distribution/reproduction control apparatus, a plurality of stream servers distribute real-time reproducible stream information to a plurality of clients through a network like the Internet. A transit control server controls the stream servers for the distribution of the stream information, and also controls the clients for real-time reproduction of the stream information.
摘要翻译：在信息分发/再现控制装置中，多个流服务器通过诸如因特网的网络向多个客户端分发实时再现流信息。过境控制服务器控制流服务器以分发流信息，并且还控制客户端以便流信息的实时再现。

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