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    • 2. 发明授权
    • Heterojunction FET with doubly-doped channel
    • 具有双掺杂沟道的异质结FET
    • US4673959A
    • 1987-06-16
    • US686661
    • 1984-12-27
    • Yasuhiro ShirakiYoshifumi KatayamaYoshimasa MurayamaMakoto MoriokaYasushi SawadaTomoyoshi MishimaTakao KurodaEiichi Maruyama
    • Yasuhiro ShirakiYoshifumi KatayamaYoshimasa MurayamaMakoto MoriokaYasushi SawadaTomoyoshi MishimaTakao KurodaEiichi Maruyama
    • H01L29/812H01L21/338H01L29/205H01L29/423H01L29/778H01L29/80
    • H01L29/42316H01L29/7781H01L29/7786
    • There is disclosed a semiconductor device comprising at least first and second semiconductor layers positioned to form a hetero-junction therebetween, such a hetero-junction being adapted to form a channel, means for controlling carriers, and source and drain areas on opposite edges of the channel, wherein the first and second semiconductor layers formed between the source and drain regions have an area containing only 10.sup.16 cm.sup.-3 or less of an impurity; the first semiconductor layer has a wider forbidden band than that of the second semiconductor layer; and further including at least one semiconductor layer having a higher activation efficiency of impurities than that of the first semiconductor layer, with such at least one semiconductor layer being located on the side of the first semiconductor layer not in contact with the second semiconductor layer. A multi-quantum well structure may be used as the higher impurity activation efficiency semiconductor layer. The electrical resistance in the semiconductor area constituting the source and drain regions can be lowered by utilizing such a higher impurity activation efficiency semiconductor layer.
    • 公开了一种半导体器件,其至少包括第一和第二半导体层,该第一和第二半导体层被定位以在它们之间形成异质结,这样的异质结适于形成沟道,用于控制载流子的装置,以及在其的相对边缘上的源极和漏极区域 沟道,其中形成在源区和漏区之间的第一和第二半导体层具有仅含有1016cm-3或更小的杂质的面积; 第一半导体层具有比第二半导体层更宽的禁带; 并且还包括至少一个具有比第一半导体层高的杂质活化效率的半导体层,这样的至少一个半导体层位于不与第二半导体层接触的第一半导体层的一侧。 可以使用多量子阱结构作为较高的杂质活化效率半导体层。 通过利用这种较高的杂质活化效率的半导体层,可以降低构成源区和漏区的半导体区的电阻。
    • 7. 发明授权
    • Roll paper unit having paper path switching member and image forming apparatus employing the same
    • 具有纸张路径切换部件的卷纸单元和使用其的图像形成装置
    • US06519441B1
    • 2003-02-11
    • US09341455
    • 1999-09-09
    • Yasushi Sawada
    • Yasushi Sawada
    • G03G1500
    • G03G15/6517B41J11/48B41J11/70B41J13/009B41J15/04B41J15/042B65H16/00B65H23/04B65H2301/121B65H2301/34B65H2404/63B65H2701/1862G03G15/6523G03G2215/00447G03G2215/00455
    • When a roll paper unit 200 is incorporated into an image formation apparatus, a second outlet guide member 92 is turned around a pivot 92a in the direction of an arrow G, i.e., moved from a position of solid lines to a position of two-dot chain lines, a rear end portion 92b of this second outlet guide member 92 pressing down a front end portion 80c of a guide member 80 to cause the guide member 80 to be turned around a central shaft 80d in the direction of an arrow H, i.e., moved from a position of solid lines to a position of two-dot chain line. Consequently, a path extending in the direction of an arrow C is closed, while a path extending in the direction of an arrow F is opened, the roll paper 72 being transferred in the paper feed direction. When the roll paper unit 200 is drawn out, the second outlet guide member 92 and the guide member 80 are turned in the directions opposite to those mentioned above. Consequently, the path extending in the direction of the arrow F is closed, while the path extending in the direction of the arrow C is opened, the roll paper 72 being transferred in the paper discharge direction.
    • 当卷纸单元200被结合到图像形成装置中时,第二出口引导构件92围绕枢轴92a沿箭头G的方向转动,即从实线的位置移动到双点位置 该第二出口引导构件92的后端部分92b压下引导构件80的前端部分80c,以引导构件80绕箭头H的方向绕中心轴80d转动,即 从实线位置移动到双点划线的位置。 因此,沿着箭头C的方向延伸的路径被封闭,同时沿着箭头F的方向延伸的路径被打开,卷纸72沿供纸方向转印。 当卷纸单元200被拉出时,第二出口引导构件92和引导构件80沿与上述相反的方向转动。 因此,沿着箭头F的方向延伸的路径是闭合的,而沿着箭头C方向延伸的路径被打开,卷纸72沿排纸方向转印。
    • 8. 发明授权
    • Plasma processing apparatus and method
    • 等离子体处理装置及方法
    • US06429400B1
    • 2002-08-06
    • US09667437
    • 2000-09-22
    • Yasushi SawadaKeiichi YamazakiYoshitami InoueSachiko OkazakiMasuhiro Kogoma
    • Yasushi SawadaKeiichi YamazakiYoshitami InoueSachiko OkazakiMasuhiro Kogoma
    • B23K1000
    • H01J37/32366H05H1/2406H05H2001/2443
    • A plasma processing apparatus for performing plasma processing of an article, comprising: a central electrode; a tubular outer electrode which is provided so as to surround the central electrode; a tubular reaction pipe which is disposed between the central electrode and the outer electrode so as to electrically insulate the central electrode and the outer electrode from each other; a gas supply device for supplying a plasma producing gas to a discharge space defined between the central electrode and the outer electrode in the reaction pipe; an AC power source for applying an AC voltage between the central electrode and the outer electrode; wherein not only the plasma producing gas is supplied to the discharge space by the gas supply device but the AC voltage is applied between the central electrode and the outer electrode by the AC power source so as to generate a glow discharge in the discharge space under atmospheric pressure such that a plasma jet is blown to the article from a blow-off outlet of the reaction pipe; and a cooling device for cooling the central electrode and the outer electrode.
    • 一种用于执行制品的等离子体处理的等离子体处理装置,包括:中心电极; 设置成围绕中心电极的管状外电极; 管状反应管,其设置在所述中心电极和所述外部电极之间,以使所述中心电极和所述外部电极彼此电绝缘; 气体供给装置,用于将等离子体产生气体供给到在反应管中的中心电极和外部电极之间限定的放电空间; 用于在中心电极和外部电极之间施加AC电压的AC电源; 其中不仅通过气体供应装置将等离子体产生气体供应到放电空间,而且通过AC电源将AC电压施加在中心电极和外部电极之间,以便在大气中的放电空间中产生辉光放电 压力使得等离子体射流从反应管的吹出口吹送到制品; 以及用于冷却中心电极和外部电极的冷却装置。
    • 10. 发明授权
    • Process for a surface treatment of a glass fabric
    • 玻璃织物的表面处理方法
    • US5585147A
    • 1996-12-17
    • US446476
    • 1995-05-22
    • Satoru OgawaYasushi SawadaMasahiro MatsumuraYoshihiko Nakamura
    • Satoru OgawaYasushi SawadaMasahiro MatsumuraYoshihiko Nakamura
    • C03C25/62H05K1/03H05H1/00
    • C03C25/1095H05K1/0366
    • A surface treatment of a glass fabric used for a fiber reinforced composite such as multilayer circuit boards comprises the steps of exposing the glass fabric to an atmospheric pressure plasma of a mixture gas to obtain a plasma-treated surface of the glass fabric, and coating an organosilane compound on the plasma-treated surface. The mixture gas contains as a reaction gas at least one of an oxidative gas and a fluorine-containing gas, and a rare gas as a carrier of the reaction gas. The mixture gas is pre-heated prior to the plasma excitation thereof. When the glass fabric includes an organic compound as a sizing agent, the organic compound can be efficiently removed from the glass fabric by the exposing step. For example, the organosilane compound can be coated on the plasma-treated surface by exposing the plasma-treated surface to a second atmospheric pressure plasma of a second mixture gas containing an organosilane monomer. The surface treatment of the present invention is useful to efficiently produce a multilayer circuit board having excellent adhesion between the glass fabric and a resin, and resistance to CAF (Conductive Anodic Filaments).
    • 用于诸如多层电路板的纤维增强复合材料的玻璃织物的表面处理包括将玻璃织物暴露于混合气体的大气压等离子体以获得玻璃织物的等离子体处理表面的步骤, 在等离子体处理的表面上的有机硅烷化合物。 混合气体作为反应气体含有氧化性气体和含氟气体中的至少一种,作为反应气体的载体的稀有气体。 混合气在其等离子体激发之前被预热。 当玻璃织物包含作为施胶剂的有机化合物时,可以通过曝光步骤从玻璃织物中有效地除去有机化合物。 例如,通过将等离子体处理的表面暴露于含有有机硅烷单体的第二混合气体的第二大气压等离子体中,可以将有机硅烷化合物涂覆在等离子体处理的表面上。 本发明的表面处理可有效地制造玻璃织物和树脂之间具有优异粘合性和耐CAF(导电阳极丝)的多层电路板。