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1. 发明授权

US06617240B2 Method of fabricating semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US06617240B2
公开(公告)日：2003-09-09
申请号：US09748230
申请日：2000-12-27
申请人： Yasunori Inoue , Naoteru Matsubara , Hidetaka Nishimura , Hideki Mizuhara
发明人： Yasunori Inoue , Naoteru Matsubara , Hidetaka Nishimura , Hideki Mizuhara
IPC分类号： H01L214763
CPC分类号： H01L21/76877 , H01L21/76802 , H01L21/76825 , H01L21/76828
摘要： A method of fabricating a semiconductor device capable of attaining an excellent embedding characteristic also when an opening has a small diameter is obtained. According to this method of fabricating a semiconductor device, an interlayer dielectric film having an opening is formed. A first conductive member is formed in the opening by sputtering. In advance of formation of the first conductive member, first heat treatment is performed at a temperature capable of reducing the quantity of moisture and hydroxyl groups in the interlayer dielectric film. Thus, the interlayer dielectric film has a small quantity of moisture and hydroxyl groups when the first conductive member is embedded in the opening, whereby the embedding characteristic of the first conductive member is improved. Consequently, electric characteristics of a contact part can be improved also when the opening has a small diameter.
摘要翻译：获得了当开口具有小直径时也能够获得优异的嵌入特性的半导体器件的制造方法。根据制造半导体器件的这种方法，形成具有开口的层间绝缘膜。通过溅射在开口中形成第一导电构件。在形成第一导电部件之前，首先在能够降低层间电介质膜的湿度和羟基量的温度下进行热处理。因此，当第一导电部件嵌入开口时，层间电介质膜具有少量的水分和羟基，从而提高了第一导电部件的嵌入特性。因此，当开口具有小直径时，也可以提高接触部的电特性。

2. 发明申请

US20110158273A1 SEMICONDUCTOR LASER DEVICE, OPTICAL PICKUP DEVICE AND SEMICONDUCTOR DEVICE 有权
标题翻译：半导体激光器件，光学拾取器件和半导体器件
公开(公告)号：US20110158273A1
公开(公告)日：2011-06-30
申请号：US12980023
申请日：2010-12-28
申请人： Yoshio OKAYAMA , Yasunori Inoue , Takenori Goto , Kazushi Mori , Yuuki Ota , Naoteru Matsubara
发明人： Yoshio OKAYAMA , Yasunori Inoue , Takenori Goto , Kazushi Mori , Yuuki Ota , Naoteru Matsubara
IPC分类号： H01S5/02
CPC分类号： H01S5/02208 , B82Y20/00 , H01L24/97 , H01L2224/45144 , H01L2224/48091 , H01L2224/49175 , H01L2224/73265 , H01L2924/12043 , H01L2924/1461 , H01L2924/15788 , H01L2924/16195 , H01S5/0222 , H01S5/0224 , H01S5/02248 , H01S5/02276 , H01S5/02292 , H01S5/0683 , H01S5/34333 , H01S5/4031 , H01S5/4087 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor laser device includes a Si(100) substrate in which a recess having an opening and a bottom face surrounded by inner wall surfaces is formed, a semiconductor laser element placed on the bottom face, and a translucent sealing glass, mounted on top of the Si(100) substrate, which seals the opening. The laser light emitted from the semiconductor laser element is reflected by a metallic reflective film formed on the inner wall surface and then transmits through the sealing glass so as to be emitted externally.
摘要翻译：一种半导体激光器件包括：Si（100）衬底，其中形成具有由内壁表面包围的开口和底面的凹部，放置在底面上的半导体激光元件和安装在底面上的半透明密封玻璃 Si（100）衬底，其密封开口。从半导体激光元件发出的激光由形成在内壁面上的金属反射膜反射，然后通过密封玻璃透射从外部发射。

3. 发明授权

US08471289B2 Semiconductor laser device, optical pickup device and semiconductor device 有权
标题翻译：半导体激光器件，光学拾取器件和半导体器件
公开(公告)号：US08471289B2
公开(公告)日：2013-06-25
申请号：US12980023
申请日：2010-12-28
申请人： Yoshio Okayama , Yasunori Inoue , Takenori Goto , Kazushi Mori , Yuuki Ota , Naoteru Matsubara
发明人： Yoshio Okayama , Yasunori Inoue , Takenori Goto , Kazushi Mori , Yuuki Ota , Naoteru Matsubara
IPC分类号： H01L33/00
CPC分类号： H01S5/02208 , B82Y20/00 , H01L24/97 , H01L2224/45144 , H01L2224/48091 , H01L2224/49175 , H01L2224/73265 , H01L2924/12043 , H01L2924/1461 , H01L2924/15788 , H01L2924/16195 , H01S5/0222 , H01S5/0224 , H01S5/02248 , H01S5/02276 , H01S5/02292 , H01S5/0683 , H01S5/34333 , H01S5/4031 , H01S5/4087 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor laser device includes a Si(100) substrate in which a recess having an opening and a bottom face surrounded by inner wall surfaces is formed, a semiconductor laser element placed on the bottom face, and a translucent sealing glass, mounted on top of the Si(100) substrate, which seals the opening. The laser light emitted from the semiconductor laser element is reflected by a metallic reflective film formed on the inner wall surface and then transmits through the sealing glass so as to be emitted externally.
摘要翻译：一种半导体激光器件包括：Si（100）衬底，其中形成具有由内壁表面包围的开口和底面的凹部，放置在底面上的半导体激光元件和安装在底面上的半透明密封玻璃 Si（100）衬底，其密封开口。从半导体激光元件发出的激光由形成在内壁面上的金属反射膜反射，然后通过密封玻璃透射从外部发射。

4. 发明申请

US20110074025A1 SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND MOBILE DEVICE 有权
标题翻译：半导体模块，制造半导体模块的方法和移动设备
公开(公告)号：US20110074025A1
公开(公告)日：2011-03-31
申请号：US12961171
申请日：2010-12-06
申请人： Yasuyuki Yanase , Yoshio Okayama , Kiyoshi Shibata , Yasunori Inoue , Hideki Mizuhara , Ryosuke Usui , Tetsuya Yamamoto , Masurao Yoshii
发明人： Yasuyuki Yanase , Yoshio Okayama , Kiyoshi Shibata , Yasunori Inoue , Hideki Mizuhara , Ryosuke Usui , Tetsuya Yamamoto , Masurao Yoshii
IPC分类号： H01L23/482 , H01L23/52
CPC分类号： H01L24/11 , H01L23/3114 , H01L23/525 , H01L24/94 , H01L2221/6834 , H01L2221/68359 , H01L2224/0231 , H01L2224/02319 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05647 , H01L2224/1132 , H01L2224/114 , H01L2224/116 , H01L2224/131 , H01L2224/13147 , H01L2224/274 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01059 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/351 , H01L2224/13099 , H01L2924/00 , H01L2924/00014
摘要： An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area. The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern.
摘要翻译：在半导体模块中的半导体衬底的安装表面（特别是其外周）上形成用于半导体器件的电极。为了确保电极之间的大间隙，在电极上形成绝缘层。还形成有穿过绝缘层并连接到电极的多个凸块，以及与凸块一体形成的重新布线图案。重新布线图案包括凸起区域和与凸起区域相邻延伸的布线区域。绝缘层形成为具有在凸起之间的间隔中的凹的上表面，并且重新布线图案的布线区域形成为适合该上表面。重布线图案的布线区域相对于重新布线图案的凸起区域形成为朝向半导体基板压下。

5. 发明申请

US20060191894A1 Electronic appliance using heat radiation plate 审中-公开
标题翻译：电子电器采用散热板
公开(公告)号：US20060191894A1
公开(公告)日：2006-08-31
申请号：US11362121
申请日：2006-02-27
申请人： Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue , Noriaki Kojima , Hiroyuki Watanabe , Shinya Nakano
发明人： Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue , Noriaki Kojima , Hiroyuki Watanabe , Shinya Nakano
IPC分类号： H05B3/68
CPC分类号： G06F1/203 , H05K7/20445
摘要： In a heat radiation structure for an electronic appliance in which heat generated in a heat generating member inside a flap of the electronic appliance is radiated to a space outside the flap, a heat radiation plate integrally formed with a circuit element is thermally coupled to the heat generating member and is exposed outside the flap. Heat generated in the heat generating member is conducted to the heat radiation plate via a contact portion and is radiated to a space outside the flap from an exposed surface along with heat generated in the circuit element.
摘要翻译：在用于电子设备的热辐射结构中，其中在电子设备的翼片内的发热元件中产生的热量辐射到翼片外部的空间，与电路元件整体形成的散热板热耦合到热并且暴露在皮瓣外部。在发热元件中产生的热量经由接触部分被传导到散热板，并且随着在电路元件中产生的热量从露出的表面辐射到翼片之外的空间。

6. 发明申请

US20060131746A1 Circuit device 有权
标题翻译：电路设备
公开(公告)号：US20060131746A1
公开(公告)日：2006-06-22
申请号：US11313743
申请日：2005-12-22
申请人： Yasuhiro Kohara , Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
发明人： Yasuhiro Kohara , Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/563 , H01L21/568 , H01L23/293 , H01L23/3114 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/0554 , H01L2224/05573 , H01L2224/05647 , H01L2224/12105 , H01L2224/73203 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/10157 , H01L2924/14 , H01L2924/181 , H01L2924/18162 , H01L2924/3511 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on another surface of the insulating resin film. A solder ball (electrode) for the connection to a circuit board is provided on the conductive layer. An insulating resin layer is further provided between the conductive layer and the circuit board to embed the electrode therein. In this manner, the circuit device is formed. A side face of the semiconductor chip is covered with the insulating resin film.
摘要翻译：提供了可以实现用树脂高度可靠的密封的电路装置。在绝缘树脂膜的一个表面上设置半导体芯片，并且在绝缘树脂膜的另一个表面上设置与半导体芯片电连接的导电层。用于连接电路板的焊球（电极）设置在导电层上。在导电层和电路板之间还设置有绝缘树脂层，以将电极嵌入其中。以这种方式形成电路装置。半导体芯片的侧面被绝缘树脂膜覆盖。

7. 发明授权

US08093699B2 Circuit device with circuit board and semiconductor chip mounted thereon 有权
标题翻译：具有安装在其上的电路板和半导体芯片的电路装置
公开(公告)号：US08093699B2
公开(公告)日：2012-01-10
申请号：US11313743
申请日：2005-12-22
申请人： Yasuhiro Kohara , Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
发明人： Yasuhiro Kohara , Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/563 , H01L21/568 , H01L23/293 , H01L23/3114 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/0554 , H01L2224/05573 , H01L2224/05647 , H01L2224/12105 , H01L2224/73203 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/10157 , H01L2924/14 , H01L2924/181 , H01L2924/18162 , H01L2924/3511 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on another surface of the insulating resin film. A solder ball (electrode) for the connection to a circuit board is provided on the conductive layer. An insulating resin layer is further provided between the conductive layer and the circuit board to embed the electrode therein. In this manner, the circuit device is formed. A side face of the semiconductor chip is covered with the insulating resin film.
摘要翻译：提供了可以实现用树脂高度可靠的密封的电路装置。在绝缘树脂膜的一个表面上设置半导体芯片，并且在绝缘树脂膜的另一个表面上设置与半导体芯片电连接的导电层。用于连接电路板的焊球（电极）设置在导电层上。在导电层和电路板之间还设置有绝缘树脂层，以将电极嵌入其中。以这种方式形成电路装置。半导体芯片的侧面被绝缘树脂膜覆盖。

8. 发明授权

US07855452B2 Semiconductor module, method of manufacturing semiconductor module, and mobile device 有权
标题翻译：半导体模块，制造半导体模块的方法和移动设备
公开(公告)号：US07855452B2
公开(公告)日：2010-12-21
申请号：US12022865
申请日：2008-01-30
申请人： Yasuyuki Yanase , Yoshio Okayama , Kiyoshi Shibata , Yasunori Inoue , Hideki Mizuhara , Ryosuke Usui , Tetsuya Yamamoto , Masurao Yoshii
发明人： Yasuyuki Yanase , Yoshio Okayama , Kiyoshi Shibata , Yasunori Inoue , Hideki Mizuhara , Ryosuke Usui , Tetsuya Yamamoto , Masurao Yoshii
IPC分类号： H01L23/48 , H01L29/40
CPC分类号： H01L24/11 , H01L23/3114 , H01L23/525 , H01L24/94 , H01L2221/6834 , H01L2221/68359 , H01L2224/0231 , H01L2224/02319 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05647 , H01L2224/1132 , H01L2224/114 , H01L2224/116 , H01L2224/131 , H01L2224/13147 , H01L2224/274 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01059 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/351 , H01L2224/13099 , H01L2924/00 , H01L2924/00014
摘要： An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area.The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern.
摘要翻译：在半导体模块中的半导体衬底的安装表面（特别是其外周）上形成用于半导体器件的电极。为了确保电极之间的大间隙，在电极上形成绝缘层。还形成有穿过绝缘层并连接到电极的多个凸块，以及与凸块一体形成的重新布线图案。重新布线图案包括凸起区域和与凸起区域相邻延伸的布线区域。绝缘层形成为具有在凸起之间的间隔中的凹的上表面，并且重新布线图案的布线区域形成为适合该上表面。重布线图案的布线区域相对于重新布线图案的凸起区域形成为朝向半导体基板压下。

9. 发明授权

US07553164B2 Circuit device and method of manufacturing the same 失效
标题翻译：电路装置及其制造方法
公开(公告)号：US07553164B2
公开(公告)日：2009-06-30
申请号：US11416083
申请日：2006-05-01
申请人： Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
发明人： Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue
IPC分类号： H05K1/14
CPC分类号： H01L21/6835 , G01C19/56 , G01P1/023 , G01P15/18 , H01L21/4832 , H01L21/4842 , H01L21/568 , H01L23/13 , H01L23/142 , H01L23/3107 , H01L23/49548 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A circuit device of the present invention includes a first element which is placed parallel to a first reference plane and which senses a physical quantity, and a second element placed parallel to a second reference plane which intersects the first reference plane at a predetermined angle. The circuit device further includes a sealing resin for integrally sealing the first and second elements, a first conductive pattern which is electrically connected to the first element and placed parallel to the first reference plane and which has a back surface exposed from the sealing resin, and a second conductive pattern which is electrically connected to the second element and placed parallel to the second reference plane and which has a back surface exposed from the sealing resin.
摘要翻译：本发明的电路装置包括平行于第一参考平面并感测物理量的第一元件和平行于与第一参考平面以预定角度相交的第二参考平面放置的第二元件。电路装置还包括用于一体地密封第一和第二元件的密封树脂，与第一元件电连接并平行于第一参考平面放置并且具有从密封树脂露出的后表面的第一导电图案，以及第二导电图案，其电连接到第二元件并且平行于第二参考平面放置，并且具有从密封树脂暴露的后表面。

10. 发明申请

US20060193108A1 Circuit device and manufacturing method thereof 审中-公开
标题翻译：电路装置及其制造方法
公开(公告)号：US20060193108A1
公开(公告)日：2006-08-31
申请号：US11359429
申请日：2006-02-23
申请人： Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue , Makoto Murai
发明人： Ryosuke Usui , Hideki Mizuhara , Yasunori Inoue , Makoto Murai
IPC分类号： H02B1/00
CPC分类号： H01L23/5389 , H01L21/6835 , H01L21/6836 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/83 , H01L25/0652 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/12105 , H01L2224/16 , H01L2224/16235 , H01L2224/24145 , H01L2224/24195 , H01L2224/274 , H01L2224/2919 , H01L2224/29399 , H01L2224/32145 , H01L2224/73267 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10158 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/185 , H05K3/323 , H05K3/4652 , H05K2201/10515 , H01L2924/00
摘要： A thin circuit device that can operate at a high speed is provided. The circuit device includes a first circuit element and a circuit element portion formed on a substrate. The first circuit element and the circuit element portion are arranged in such a manner that element surfaces thereof are opposed to each other. A terminal formed on the element surface of the first circuit element and a terminal formed on the element surface of the circuit element portion are electrically connected to each other via conductive particles in a binder forming an anisotropic conductive film and a via. The anisotropic conductive film and a third insulating resin film are bonded by thermocompression bonding in the same step, thereby simplifying manufacturing steps of the circuit device.
摘要翻译：提供可以高速运行的薄电路器件。电路装置包括第一电路元件和形成在基板上的电路元件部分。第一电路元件和电路元件部分以其元件表面彼此相对的方式布置。形成在第一电路元件的元件表面上的端子和形成在电路元件部分的元件表面上的端子通过形成各向异性导电膜和通孔的粘合剂中的导电颗粒彼此电连接。各向异性导电膜和第三绝缘树脂膜在同一步骤中通过热压接合，从而简化了电路器件的制造步骤。

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