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    • 1. 发明授权
    • Pattern layout of integrated circuit
    • 集成电路图案布局
    • US07941782B2
    • 2011-05-10
    • US11943771
    • 2007-11-21
    • Yasunobu KaiKazuo HatakeyamaHidefumi MukaiHiromitsu MashitaKoji Hashimoto
    • Yasunobu KaiKazuo HatakeyamaHidefumi MukaiHiromitsu MashitaKoji Hashimoto
    • G06F17/50
    • H01L27/0207G11C5/025H01L27/115Y10T428/24802
    • In a pattern layout which includes a first device pattern having a uniformly repeated pattern group having first lines and first spaces formed parallel to one anther and uniformly arranged with constant width at a constant pitch and a non-uniformly repeated pattern group having first lines and first spaces non-uniformly arranged, and a second device pattern arranged adjacent to the end portion of the non-uniformly repeated pattern group in an arrangement direction thereof and having second lines and second spaces whose widths are larger than the widths of the first lines and first spaces of the non-uniformly repeated pattern group, at least part of the widths of the first lines and the first spaces of the non-uniformly repeated pattern group is made larger than the width of the first line or the width of the first space of the uniformly repeated pattern group.
    • 在图案布局中,包括具有均匀重复的图案组的第一装置图案,该第一装置图案具有第一线和平行于一个花柱形成的第一间隔,并且以恒定间距均匀地布置,并且具有第一线和第一线的不均匀重复的图案组 以及与其非排列方向上的非均匀重复图形组的端部相邻排列的第二装置图案,并且具有第二线和第二空间,第二线和第二空间的宽度大于第一线和第一线的宽度 不均匀重复图案组的空间,使不均匀重复图案组的第一线和第一空间的宽度的至少一部分大于第一线的宽度或第一空间的第一空间的宽度 均匀重复模式组。
    • 2. 发明申请
    • PATTERN LAYOUT OF INTEGRATED CIRCUIT
    • 集成电路图案布局
    • US20080137421A1
    • 2008-06-12
    • US11943771
    • 2007-11-21
    • Yasunobu KAIKazuo HatakeyamaHidefumi MukaiHiromitsu MashitaKoji Hashimoto
    • Yasunobu KAIKazuo HatakeyamaHidefumi MukaiHiromitsu MashitaKoji Hashimoto
    • G11C11/34B41M5/00G03G13/00
    • H01L27/0207G11C5/025H01L27/115Y10T428/24802
    • In a pattern layout which includes a first device pattern having a uniformly repeated pattern group having first lines and first spaces formed parallel to one anther and uniformly arranged with constant width at a constant pitch and a non-uniformly repeated pattern group having first lines and first spaces non-uniformly arranged, and a second device pattern arranged adjacent to the end portion of the non-uniformly repeated pattern group in an arrangement direction thereof and having second lines and second spaces whose widths are larger than the widths of the first lines and first spaces of the non-uniformly repeated pattern group, at least part of the widths of the first lines and the first spaces of the non-uniformly repeated pattern group is made larger than the width of the first line or the width of the first space of the uniformly repeated pattern group.
    • 在图案布局中,包括具有均匀重复的图案组的第一装置图案,该第一装置图案具有第一线和平行于一个花柱形成的第一间隔,并且以恒定间距均匀地布置,并且具有第一线和第一线的不均匀重复的图案组 以及与其非排列方向上的非均匀重复图形组的端部相邻排列的第二装置图案,并且具有第二线和第二空间,第二线和第二空间的宽度大于第一线和第一线的宽度 不均匀重复图案组的空间,使不均匀重复图案组的第一线和第一空间的宽度的至少一部分大于第一线的宽度或第一空间的第一空间的宽度 均匀重复模式组。
    • 3. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US07713833B2
    • 2010-05-11
    • US12557111
    • 2009-09-10
    • Hiromitsu MashitaToshiya KotaniHidefumi MukaiFumiharu NakajimaChikaaki Kodama
    • Hiromitsu MashitaToshiya KotaniHidefumi MukaiFumiharu NakajimaChikaaki Kodama
    • H01L21/76
    • H01L27/11524H01L21/0337H01L21/32139
    • According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, the method including: forming a first film on a target film; forming resist patterns on the first film; processing the first film with the resist patterns to form first patterns including: periodic patterns; and aperiodic patterns; removing the resist patterns; forming a second film over the target film; processing the second film to form second side wall patterns on side walls of the first patterns; removing the periodic patterns; and processing the target film with the aperiodic patterns and the second side wall patterns, thereby forming a target patterns including: periodic target patterns; aperiodic target patterns; and dummy patterns arranged between the periodic target patterns and the aperiodic patterns and arranged periodically with the periodic target patterns.
    • 根据本发明的一个方面,提供一种制造半导体器件的方法,所述方法包括:在靶膜上形成第一膜; 在第一膜上形成抗蚀剂图案; 用抗蚀剂图案处理第一膜以形成第一图案,包括:周期图案; 和非周期性模式; 去除抗蚀剂图案; 在目标膜上形成第二膜; 处理所述第二膜以在所述第一图案的侧壁上形成第二侧壁图案; 去除周期性模式; 用非周期图案和第二侧壁图案处理目标薄膜,从而形成包括周期性目标图案的目标图案; 非周期目标模式; 以及布置在周期性目标图案和非周期性图案之间的虚拟图案,并且周期性地布置有周期性目标图案。
    • 8. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20100081265A1
    • 2010-04-01
    • US12557111
    • 2009-09-10
    • Hiromitsu MashitaToshiya KotaniHidefumi MukaiFumiharu NakajimaChikaaki Kodama
    • Hiromitsu MashitaToshiya KotaniHidefumi MukaiFumiharu NakajimaChikaaki Kodama
    • H01L21/28
    • H01L27/11524H01L21/0337H01L21/32139
    • According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, the method including: forming a first film on a target film; forming resist patterns on the first film; processing the first film with the resist patterns to form first patterns including: periodic patterns; and aperiodic patterns; removing the resist patterns; forming a second film over the target film; processing the second film to form second side wall patterns on side walls of the first patterns; removing the periodic patterns; and processing the target film with the aperiodic patterns and the second side wall patterns, thereby forming a target patterns including: periodic target patterns; aperiodic target patterns; and dummy patterns arranged between the periodic target patterns and the aperiodic patterns and arranged periodically with the periodic target patterns.
    • 根据本发明的一个方面,提供一种制造半导体器件的方法,所述方法包括:在靶膜上形成第一膜; 在第一膜上形成抗蚀剂图案; 用抗蚀剂图案处理第一膜以形成第一图案,包括:周期图案; 和非周期性模式; 去除抗蚀剂图案; 在目标膜上形成第二膜; 处理所述第二膜以在所述第一图案的侧壁上形成第二侧壁图案; 去除周期性模式; 用非周期图案和第二侧壁图案处理目标薄膜,从而形成包括周期性目标图案的目标图案; 非周期目标模式; 以及布置在周期性目标图案和非周期性图案之间的虚拟图案,并且周期性地布置有周期性目标图案。