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    • 4. 发明授权
    • Method for forming a compound semiconductor device using a buffer layer
over a corrugated surface
    • 在波纹表面上形成使用缓冲层的化合物半导体器件的方法
    • US6083813A
    • 2000-07-04
    • US61044
    • 1998-04-16
    • Yasumasa Kashima
    • Yasumasa Kashima
    • H01L21/205C30B25/02C30B25/18H01S5/00H01S5/12H01L21/20H01L21/00
    • C30B25/02C30B25/18C30B29/40H01S5/12
    • The method for forming the compound semiconductor device includes the step of forming a buffer layer so as to cover the periodic corrugation on the InP substrate, wherein the buffer layer forms using a crystal growth temperature lower than the preferred crystal growth temperature. Accordingly, the method for forming the compound semiconductor device can avoid a shape change and a thickness change because of defect of the periodic corrugation. Further, the compound semiconductor device includes a buffer layer formed so as to cover the periodic corrugation on the InP substrate, wherein the buffer layer forms using a crystal growth temperature lower than the preferred crystal growth temperature. Accordingly, the compound semiconductor device can get superior characteristics of the compound semiconductor device.
    • 形成化合物半导体器件的方法包括形成缓冲层以覆盖InP衬底上的周期性波纹的步骤,其中使用低于优选晶体生长温度的晶体生长温度形成缓冲层。 因此,形成化合物半导体器件的方法由于周期性波纹的缺陷而能够避免形状变化和厚度变化。 此外,化合物半导体器件包括形成为覆盖InP衬底上的周期性波纹的缓冲层,其中使用低于优选晶体生长温度的晶体生长温度形成缓冲层。 因此,化合物半导体器件可以获得化合物半导体器件的优异特性。
    • 5. 发明授权
    • Compound semiconductor light emitting device and process for producing the same
    • 化合物半导体发光器件及其制造方法
    • US06470038B2
    • 2002-10-22
    • US09161227
    • 1998-09-28
    • Tsutomu MunakataYasumasa Kashima
    • Tsutomu MunakataYasumasa Kashima
    • H01S500
    • H01S5/227H01S5/2226H01S5/2227H01S5/2275H01S5/3072
    • A compound semiconductor light emitting device that confines carriers into an active layer and that has improved light emission efficiency. The device has a first conductive type substrate; an active layer on the first conductive type substrate; a second conductive type sub-layer and a first conductive type sub-layer, in this order from a lower portion to an upper portion of the device, on the first conductive type substrate and at both sides of the active layer; a second conductive type cladding layer on/over the active layer and the first conductive type sub-layer; and a second conductive type contact layer on the second conductive type cladding layer. A p-type diffusion barrier layer is further formed between the n-type sub-layer and the p-type cladding layer.
    • 一种化合物半导体发光器件,其将载流子限制在有源层中并且具有改善的发光效率。 该器件具有第一导电型衬底; 在第一导电类型衬底上的有源层; 第二导电类型子层和第一导电类型子层,从第一导电类型衬底和有源层的两侧依次从器件的下部到器件的上部; 在有源层上和第二导电型子层之上的第二导电型包覆层; 和在第二导电型包覆层上的第二导电型接触层。 在n型子层和p型覆层之间进一步形成p型扩散阻挡层。
    • 7. 发明授权
    • Compound semiconductor light emitting device and process for producing the same
    • 化合物半导体发光器件及其制造方法
    • US06562649B2
    • 2003-05-13
    • US10227412
    • 2002-08-26
    • Tsutomu MunakataYasumasa Kashima
    • Tsutomu MunakataYasumasa Kashima
    • H01L2100
    • H01S5/227H01S5/2226H01S5/2227H01S5/2275H01S5/3072
    • A compound semiconductor light emitting device that can keep the effect of confining carriers into an active layer and that can improve light emission efficiency. In the device having a first conductive type substrate; and active layer on the first conductive type substrate; a second conductive type sub-layer and a first conductive type sub-layer, in this order from a lower portion to an upper portion of the device, on the first conductive type substrate and at both sides of the active layer; a second conductive type cladding layer on/over the active layer and the first conductive type sub-layer; and a second conductive type contact layer on the second conductive type cladding layer 19. A p-type diffusion barrier layer is further formed between the n-type sub-layer and the p-type cladding layer.
    • 一种化合物半导体发光器件,其可以保持将载流子限制在有源层中并且可以提高发光效率的效果。 在具有第一导电类型衬底的器件中; 和有源层在第一导电类型衬底上; 第二导电类型子层和第一导电类型子层,从第一导电类型衬底和有源层的两侧依次从器件的下部到器件的上部; 在有源层上和第二导电型子层之上的第二导电型包覆层; 以及第二导电型覆层19上的第二导电型接触层。在n型子层和p型覆层之间还形成p型扩散阻挡层。
    • 9. 发明授权
    • Edge emitting led and method of forming the same
    • 边缘发光LED和形成方法相同
    • US6013539A
    • 2000-01-11
    • US3694
    • 1998-01-07
    • Yasumasa KashimaTsutomu Munakata
    • Yasumasa KashimaTsutomu Munakata
    • H01L33/00H01L33/06H01L33/14H01L33/30H01L33/40H01S5/00H01L21/20
    • H01L33/0062C23C14/048H01L33/0045
    • An edge emitting LED comprises a semiconductor substrate having a main surface, an active layer formed over the main surface, and the active layer having a light emitting region, an optical absorption region having a bandgap energy smaller than that of the light emitting region, and a composition change region formed between the light emitting region and the optical absorption region, the composition change region having the bandgap energy continuously changes. Accordingly, an edge emitting LED is able to produce a stable, spontaneous emission of a light under a wide range of operating conditions. Furthermore, a method of forming an edge emitting LED, comprising the steps of: providing a semiconductor substrate having a previous formation region of an active layer having a light emitting region and an optical absorption region continued with the light emitting region; forming a mask pattern over the substrate located on both sides of the optical absorption region; and forming the active layer over the formed structure. Accordingly, a method of forming a edge emitting LED is able to form a light emitting region and an optical absorption region, with one-step growth.
    • 边缘发射LED包括具有主表面的半导体衬底,在主表面上形成的有源层,并且有源层具有发光区域,具有小于发光区域的带隙能量的光能吸收区域,以及 形成在发光区域和光吸收区域之间的成分变化区域,具有带隙能量的成分变化区域连续变化。 因此,边缘发射LED能够在宽范围的操作条件下产生稳定的自发发光。 此外,形成边缘发光LED的方法包括以下步骤:提供具有与发光区域连续的具有发光区域和光吸收区域的有源层的先前形成区域的半导体衬底; 在位于光吸收区两侧的衬底上形成掩模图案; 并在所形成的结构上形成有源层。 因此,形成边缘发光LED的方法能够以一步生长形成发光区域和光吸收区域。
    • 10. 发明授权
    • Method of fabricating an abrupt hetero interface by organometallic vapor
phase growth
    • 通过有机金属气相生长制造突变异质界面的方法
    • US5994158A
    • 1999-11-30
    • US788374
    • 1997-01-24
    • Yasumasa KashimaTsutomu Munakata
    • Yasumasa KashimaTsutomu Munakata
    • C23C16/52C23C16/54C30B25/02H01L21/20H01L21/205H01L29/201
    • C30B25/02C30B29/40H01L21/02461H01L21/02463H01L21/02543H01L21/02546H01L21/0262
    • A method of fabricating an abrupt hetero interface by organometallic vapor growth comprises supplying a first Group III source gas at a predetermined flow rate and a first Group V source gas at a predetermined flow rate to a growth chamber during a first growth process to form a first Group III-Group V compound layer. During a growth interruption process, the inflow of the first Group III source gas to the growth chamber is stopped, while the supply of the first Group V source gas to the growth chamber is continued, to thereby interrupt the growth of the first Group III-Group V compound layer. Finally, during a second growth process, the first Group V source gas flowing into the growth chamber is switched to a second Group V source gas, and a second Group III source gas is simultaneously supplied at a predetermined flow rate to the growth chamber, thereby forming a second Group III-Group V compound layer on the first Group III-Group V compound layer.
    • 通过有机金属气相生长制造突变异质界面的方法包括:在第一生长过程期间以预定流速将预定流量的第一III族源气体和第一V族源气体以预定流速供应至生长室,以形成第一 III族-V族化合物层。 在生长中断过程中,停止向第一组III源气体的流入,同时向生长室供应第一V族源气体,从而中断第一组III- V组化合物层。 最后,在第二次生长过程中,流入生长室的第一组V源气体被切换成第二组V源气体,并且将第二组III源气体以预定的流量同时供给到生长室,由此 在第一组III-V族化合物层上形成第二组III-V族化合物层。