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    • 5. 发明授权
    • Method for programming phase-change memory and method for reading date from the same
    • 编程相变存储器的方法和从其读取日期的方法
    • US07646633B2
    • 2010-01-12
    • US12038547
    • 2008-02-27
    • Yukio Fuji
    • Yukio Fuji
    • G11C11/00
    • G11C13/004G11C13/0004G11C13/0069G11C2013/009G11C2013/0092G11C2213/79
    • When a phase-change element that can transition between a reset state (amorphous state) and a set state (crystalline state) is to be caused to transition to the reset state, a first pulse having a first voltage is applied to the phase-change element. The first voltage is higher than the threshold voltage in the reset state, and can cause current to flow that corresponds to an amount of generated heat required for placing the element in the reset state. When the phase-change element is to be caused to transition to the set state, a second pulse having a second voltage and the same time width as the first pulse is applied to the phase-change element. The second voltage that is higher than the threshold voltage but lower than the first voltage, and can cause only a current to flow that does not attain the necessary amount of generated heat.
    • 当要使复位状态(非晶状态)和设定状态(结晶状态)之间转换的相变元件转变到复位状态时,具有第一电压的第一脉冲被施加到相变 元件。 第一电压高于复位状态下的阈值电压,并且可导致电流流动,其对应于将元件置于复位状态所需的发热量。 当相变元件转变到设定状态时,具有与第一脉冲相同的第二电压和时间宽度的第二脉冲施加到相变元件。 第二电压高于阈值电压但低于第一电压,并且只能导致不达到所需量的产生的热量的电流。
    • 6. 发明授权
    • Memory device including a programmable resistance element
    • 存储器件包括可编程电阻元件
    • US07580277B2
    • 2009-08-25
    • US12207077
    • 2008-09-09
    • Yukio Fuji
    • Yukio Fuji
    • G11C11/00
    • G11C13/0069G11C11/406G11C11/4099G11C11/5678G11C13/0004G11C13/0033G11C13/0064G11C16/3431G11C16/349G11C2211/4061
    • Disclosed are a phase change memory with improved retention characteristic of a phase change device, and a method for refreshing the phase change memory. The fact that a memory is a DRAM interface compatible memory is exploited. There are provided dummy cells stressed in accordance with the number of times of read and write operations. Changes in the resistance value of the dummy cells are detected by comparator circuits. If the resistance value have been changed beyond a predetermined reference value (that is, changed to a low resistance), a refresh request circuit requests an internal circuit, not shown, to effect refreshing. The memory cells and the dummy cells are transitorily refreshed and correction is made for variations in the programmed resistance value of the phase change devices to assure the margin as well as to improve retention characteristic.
    • 公开了一种具有改进的相变装置的保持特性的相变存储器,以及用于刷新相变存储器的方法。 存储器是DRAM接口兼容存储器的事实被利用。 根据读写操作的次数提供了被压制的虚拟单元。 比较电路检测虚设电池的电阻值的变化。 如果电阻值已经改变超过预定参考值(即,改变为低电阻),则刷新请求电路请求未示出的内部电路实现刷新。 存储器单元和虚拟单元被过饱和刷新,并且对相变装置的编程电阻值的变化进行校正,以确保余量以及改善保持特性。
    • 9. 发明申请
    • Semiconductor memory device and writing method thereof
    • 半导体存储器件及其写入方法
    • US20060190672A1
    • 2006-08-24
    • US11340623
    • 2006-01-27
    • Yukio Fuji
    • Yukio Fuji
    • G06F12/00G06F12/14G06F13/28G06F12/16G06F13/00
    • G11C13/0069G11C7/1006G11C7/1012G11C7/1051G11C7/106G11C7/1078G11C7/1087G11C7/22G11C13/0004G11C13/004G11C2013/0076
    • To provide a semiconductor memory device comprising a phase-change memory and having high compatibility with DRAM interface. The memory cell array 18 comprises a memory cell that includes a phase-change element provided at the intersection of a bit line and word line. A write address and data accompanying a write request are temporarily held in a write address register 15 and a data register 14 respectively, and a write operation is not performed on the memory cell array 18 in this cycle of write request. And when a next write request occurs, the held data is written to the memory cell array 18. At this time, two write cycles—RESET cycle and SET cycle—are provided. Then the written contents of the memory cell and the rewrite data are compared, and after only SET cells are temporarily RESET (amorphization, increasing the resistance), it is operated so as to write only SET data (crystallization, lowering the resistance).
    • 提供包括相变存储器并且与DRAM接口具有高兼容性的半导体存储器件。 存储单元阵列18包括存储单元,其包括设置在位线和字线的交点处的相变单元。 写入地址和与写入请求相关的数据分别临时保存在写入地址寄存器15和数据寄存器14中,并且在写入请求循环中不对存储单元阵列18进行写入操作。 并且当发生下一个写入请求时,保持的数据被写入存储单元阵列18。 此时,提供两个写周期 - 复位周期和SET周期。 然后比较存储单元的写入内容和重写数据,只有SET单元暂时复位(非晶化,增加电阻)之后,才能操作SET数据(结晶,降低电阻)。