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    • 2. 发明申请
    • SEMICONDUCTOR DEVICE, SCHOTTKY BARRIER DIODE, ELECTRONIC APPARATUS, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
    • 半导体器件,肖特基二极管二极管,电子设备和生产半导体器件的方法
    • US20110297954A1
    • 2011-12-08
    • US13141448
    • 2009-11-26
    • Yasuhiro OkamotoHironobu MiyamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • Yasuhiro OkamotoHironobu MiyamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • H01L29/20H01L21/329
    • H01L29/872H01L29/08H01L29/2003H01L29/475
    • [Problem to be Solved] Provided is a semiconductor device in which the trade-off between the pressure resistance and the on-state resistance is improved and the performance is improved.[Solution] The semiconductor device 1 of the present invention comprises semiconductor layers 20 to 23, an anode electrode 12, and a cathode electrode 13, wherein the semiconductor layers include a composition change layer 23, the anode electrode 12 is electrically connected to one of principal surfaces of the composition change layer through a formation of a Schottky junction between the anode electrode 12 and a part of the semiconductor layers, the cathode electrode 13 is electrically connected to the other of the principal surfaces of the composition change layer through a formation of a junction between the cathode electrode 13 and another part of the semiconductor layers, the anode electrode 12 and the cathode electrode 13 are capable of applying a voltage to the composition change layer 23 in a direction perpendicular to the principal surface, andthe composition change layer 23 has composition that changes from a cathode electrode 13 side toward an anode electrode 12 side in the direction perpendicular to the principal surface of the composition change layer, has a negative polarization charge that is generated due to the composition that changes, and contains a donor impurity.
    • [待解决的问题]提供了一种半导体器件,其中改善了耐压性和通态电阻之间的折衷,并提高了性能。 [解决方案]本发明的半导体器件1包括半导体层20至23,阳极电极12和阴极电极13,其中半导体层包括组成变化层23,阳极电极12电连接到 通过在阳极12和半导体层的一部分之间形成肖特基结,组成变化层的主表面通过形成阴极电极13而与组合物改变层的另一个主表面电连接 阴极电极13和半导体层的另一部分之间的接合点,阳极电极12和阴极电极13能够在垂直于主表面的方向上向组合物变化层23施加电压,并且组成变化层 23具有从阴极电极13侧向阳极电极12侧变化的组成 具有垂直于组成变化层的主表面的方向具有由于组成变化而产生并且包含施主杂质的负极化电荷。
    • 3. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110006346A1
    • 2011-01-13
    • US12919640
    • 2009-03-12
    • Yuji AndoYasuhiro OkamotoKazuki OtaTakashi InoueTatsuo NakayamaHironobu Miyamoto
    • Yuji AndoYasuhiro OkamotoKazuki OtaTakashi InoueTatsuo NakayamaHironobu Miyamoto
    • H01L29/737
    • H01L29/7783H01L29/2003H01L29/4236H01L29/518H01L29/7785
    • The present invention provides a semiconductor device that has high electron mobility while reducing a gate leakage current, and superior uniformity and reproducibility of the threshold voltage, and is also applicable to the enhancement mode type. The semiconductor device according to the present invention is a semiconductor device having such a structure formed by sequentially laminating a lower barrier layer composed of lattice-relaxed AlxGa1-xN (0≦x≦1), a channel layer composed of InyGa1-yN (0≦y≦1) with compressive strain and a contact layer composed of AlzGa1-zN (0≦z≦1), wherein a two-dimensional electron gas is produced in the vicinity of an interface of said InyGa1-yN channel layer with said AlzGa1-zN contact layer; a gate electrode is formed so as to be embedded in the recessed portion with intervention of an insulating film, which recessed portion is formed by removing a part of said AlzGa1-zN contact layer by etching it away until said InyGa1-yN channel layer is exposed; and, ohmic electrodes are formed on the AlzGa1-zN contact layer. Thus, there is provided a semiconductor device that has superior uniformity and reproducibility of the threshold voltage while maintaining a low gate leakage current and high electron mobility, and thereby, is capable of operation in enhancement mode.
    • 本发明提供了一种在降低栅极漏电流的同时具有高电子迁移率并具有优异的阈值电压的均匀性和再现性的半导体器件,并且也适用于增强型。 根据本发明的半导体器件是具有这样的结构的半导体器件,该半导体器件通过顺序地层叠由晶格弛豫的Al x Ga 1-x N(0< n 1; x&n 1; 1)构成的下阻挡层,由InyGa1-yN(0& ; y≦̸ 1)具有压应变和由AlzGa1-zN(0& nlE; z≦̸ 1)组成的接触层,其中在所述In y Ga 1-y N沟道层的界面附近产生二维电子气体与所述AlzGa1 -zN接触层 通过介入绝缘膜形成嵌入在凹陷部分中的栅电极,该凹陷部分通过蚀刻除去所述AlzGa1-zN接触层的一部分而形成,直到所述In y Ga 1-y N沟道层暴露 ; 并且在AlzGa1-zN接触层上形成欧姆电极。 因此,提供了具有优异的阈值电压的均匀性和再现性的半导体器件,同时保持低栅极漏电流和高电子迁移率,从而能够在增强模式下操作。
    • 6. 发明授权
    • Semiconductor device using a group III nitride-based semiconductor
    • 使用III族氮化物基半导体的半导体器件
    • US08674407B2
    • 2014-03-18
    • US12919640
    • 2009-03-12
    • Yuji AndoYasuhiro OkamotoKazuki OtaTakashi InoueTatsuo NakayamaHironobu Miyamoto
    • Yuji AndoYasuhiro OkamotoKazuki OtaTakashi InoueTatsuo NakayamaHironobu Miyamoto
    • H01L29/66
    • H01L29/7783H01L29/2003H01L29/4236H01L29/518H01L29/7785
    • The present invention provides a semiconductor device having such a structure formed by sequentially laminating a lower barrier layer composed of lattice-relaxed AlxGa1-xN (0≦x≦1), a channel layer composed of InyGa1-yN (0≦y≦1) with compressive strain and a contact layer composed of AlzGa1-zN (0≦z≦1), wherein a two-dimensional electron gas is produced in the vicinity of an interface of said InyGa1-yN channel layer with said AlzGa1-zN contact layer; a gate electrode is formed so as to be embedded in the recessed portion with intervention of an insulating film, which recessed portion is formed by removing a part of said AlzGa1-zN contact layer by etching it away until said InyGa1-yN channel layer is exposed; and, ohmic electrodes are formed on the AlzGa1-zN contact layer. Thus, the semiconductor device has superior uniformity and reproducibility of the threshold voltage while maintaining a low gate leakage current, and is also applicable to the enhancement mode type.
    • 本发明提供一种具有这样的结构的半导体器件,该半导体器件通过依次层叠由晶格弛豫的Al x Ga 1-x N(0 @ x @ 1)构成的下阻挡层,由InyGa1-yN(0 @ y @ 1) 具有压应变和由Al z Ga 1-z N(0 @ z @ 1)组成的接触层,其中在所述In y Ga 1-y N沟道层与所述Al z Ga 1-z N接触层的界面附近产生二维电子气; 通过介入绝缘膜形成嵌入在凹陷部分中的栅电极,该凹陷部分通过蚀刻除去所述AlzGa1-zN接触层的一部分而形成,直到所述In y Ga 1-y N沟道层暴露 ; 并且在AlzGa1-zN接触层上形成欧姆电极。 因此,半导体器件在保持低栅极漏电流的同时具有优异的阈值电压的均匀性和再现性,并且也适用于增强型。
    • 8. 发明授权
    • Semiconductor device and field effect transistor
    • 半导体器件和场效应晶体管
    • US08981434B2
    • 2015-03-17
    • US13393002
    • 2010-06-23
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • H01L29/76H01L29/812H01L29/201H01L29/78H01L29/06H01L29/20H01L29/205H01L29/417H01L29/423
    • H01L29/8122H01L29/0657H01L29/2003H01L29/201H01L29/205H01L29/41741H01L29/41766H01L29/4236H01L29/7809H01L29/7812H01L29/7813H01L29/8128
    • Provided is a semiconductor device in which the trade-off between the withstand voltage and the on-resistance is improved and the performance is increased. A semiconductor device comprises a substrate 1, a first n-type semiconductor layer 21′, a second n-type semiconductor layer 23, a p-type semiconductor layer 24, and a third n-type semiconductor layer 25′, wherein the first n-type semiconductor layer 21′, the second n-type semiconductor layer 23, the p-type semiconductor layer 24, and the third n-type semiconductor layer 25′ are laminated at the upper side of the substrate 1 in this order. The drain electrode 13 is in ohmic-contact with the first n-type semiconductor layer 21′ and the source electrode 12 is in ohmic-contact with the third n-type semiconductor layer 25′. A gate electrode 14 is arranged so as to fill an opening portion to be filled that extends from the third n-type semiconductor layer 25′ to the second n-type semiconductor layer 23, and the gate electrode 14 is in contact with the upper surface of the second n-type semiconductor layer 23, the side surfaces of the p-type semiconductor layer 24, and the side surfaces of the third n-type semiconductor layer 25′. The second n-type semiconductor layer 23 has composition that changes from the drain electrode 13 side toward the source electrode 12 side in the direction perpendicular to the plane of the substrate 1 and contains donor impurity.
    • 提供一种半导体器件,其中耐压和导通电阻之间的折衷被提高并且性能提高。 半导体器件包括衬底1,第一n型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25',其中第一n型半导体层 型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25'依次层叠在基板1的上侧。 漏电极13与第一n型半导体层21'欧姆接触,源电极12与第三n型半导体层25'欧姆接触。 栅电极14被布置成填充从第三n型半导体层25'延伸到第二n型半导体层23的待填充的开口部分,并且栅电极14与上表面 第二n型半导体层23,p型半导体层24的侧表面和第三n型半导体层25'的侧表面。 第二n型半导体层23具有从垂直于基板1的平面的方向从漏电极13侧向源电极12侧变化的成分,并且含有施主杂质。
    • 9. 发明授权
    • Heterojunction field effect transistor, method for producing heterojunction field effect transistor, and electronic device
    • 异质结场效应晶体管,异质结场效应晶体管的制造方法和电子器件
    • US08674409B2
    • 2014-03-18
    • US13141449
    • 2009-12-25
    • Takashi InoueHironobu MiyamotoKazuki OtaTatsuo NakayamaYasuhiro OkamotoYuji Ando
    • Takashi InoueHironobu MiyamotoKazuki OtaTatsuo NakayamaYasuhiro OkamotoYuji Ando
    • H01L29/66
    • H01L29/7787H01L29/0843H01L29/2003H01L29/41766H01L29/42316H01L29/66462
    • A heterojunction filed effect transistor with a low access resistance, a low on resistance, and the like, a method for producing a heterojunction filed effect transistor and an electron device are provided. In the heterojunction field effect transistor, an electron transit layer 11 formed of a III-nitride semiconductor is formed on a substrate 10, an electron supply layer 12 formed of a III-nitride semiconductor forms a heterojunction with an upper surface of the electron transit layer 11, a gate electrode 14, a source electrode 15A, and a drain electrode 15B are arranged on the electron supply layer 12, n-type conductive layer regions 13A and 13B each extended from an upper part of the electron transit layer 11 to an upper surface of the electron supply layer 12 are provided in at least a part below the source electrode 15A and a part below the drain electrode 15B, and an n-type impurity concentration at a heterojunction interface of an electron transit layer 11 part of each of the n-type conductive layer regions 13A and 13B with the electron supply layer 12 is 1×1020 cm−3 or more.
    • 提供具有低访问阻抗,低导通电阻等的异质结场效应晶体管,提供了异质结场效应晶体管和电子器件的制造方法。 在异质结场效应晶体管中,在衬底10上形成由III族氮化物半导体形成的电子迁移层11,由III族氮化物半导体形成的电子供给层12与电子迁移层的上表面形成异质结 如图11所示,在电子供给层12上配置有栅电极14,源电极15A和漏电极15B,从电子渡越层11的上部延伸到上部的n型导电层区域13A,13B 电子供给层12的表面设置在源电极15A的下方以及漏电极15B的下方的至少一部分以及电子迁移层11的异质界面的n型杂质浓度 具有电子供给层12的n型导电层区域13A,13B为1×1020cm-3以上。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE AND FIELD EFFECT TRANSISTOR
    • 半导体器件和场效应晶体管
    • US20120199889A1
    • 2012-08-09
    • US13393002
    • 2010-06-23
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • H01L29/78
    • H01L29/8122H01L29/0657H01L29/2003H01L29/201H01L29/205H01L29/41741H01L29/41766H01L29/4236H01L29/7809H01L29/7812H01L29/7813H01L29/8128
    • Provided is a semiconductor device in which the trade-off between the withstand voltage and the on-resistance is improved and the performance is increased.A semiconductor device comprises a substrate 1, a first n-type semiconductor layer 21′, a second n-type semiconductor layer 23, a p-type semiconductor layer 24, and a third n-type semiconductor layer 25′, wherein the first n-type semiconductor layer 21′, the second n-type semiconductor layer 23, the p-type semiconductor layer 24, and the third n-type semiconductor layer 25′ are laminated at the upper side of the substrate 1 in this order. The drain electrode 13 is in ohmic-contact with the first n-type semiconductor layer 21′ and the source electrode 12 is in ohmic-contact with the third n-type semiconductor layer 25′. A gate electrode 14 is arranged so as to fill an opening portion to be filled that extends from the third n-type semiconductor layer 25′ to the second n-type semiconductor layer 23, and the gate electrode 14 is in contact with the upper surface of the second n-type semiconductor layer 23, the side surfaces of the p-type semiconductor layer 24, and the side surfaces of the third n-type semiconductor layer 25′. The second n-type semiconductor layer 23 has composition that changes from the drain electrode 13 side toward the source electrode 12 side in the direction perpendicular to the plane of the substrate 1 and contains donor impurity.
    • 提供一种半导体器件,其中耐压和导通电阻之间的折衷被提高并且性能提高。 半导体器件包括衬底1,第一n型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25',其中第一n型半导体层 型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25'依次层叠在基板1的上侧。 漏电极13与第一n型半导体层21'欧姆接触,源电极12与第三n型半导体层25'欧姆接触。 栅电极14被布置成填充从第三n型半导体层25'延伸到第二n型半导体层23的待填充的开口部分,并且栅电极14与上表面 第二n型半导体层23,p型半导体层24的侧表面和第三n型半导体层25'的侧表面。 第二n型半导体层23具有从垂直于基板1的平面的方向从漏电极13侧向源电极12侧变化的成分,并且含有施主杂质。