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1. 发明授权

US06839219B2 Laminate for forming capacitor layer and method for manufacturing the same 失效
标题翻译：用于形成电容器层的层压板及其制造方法
公开(公告)号：US06839219B2
公开(公告)日：2005-01-04
申请号：US10466886
申请日：2002-09-25
申请人： Yasuaki Mashiko , Hideshi Sekimori , Naotomi Takahashi
发明人： Yasuaki Mashiko , Hideshi Sekimori , Naotomi Takahashi
IPC分类号： H01G4/10 , C25D11/04 , C25D11/18 , H01G4/12 , H01G4/33 , H05K1/16 , H05K3/46 , H01G4/06
CPC分类号： H01G4/1209 , C25D11/04 , C25D11/18 , H01G4/129 , H05K1/162 , H05K2201/0179 , H05K2201/0338 , H05K2201/0355 , H05K2201/09309 , H05K2203/0315 , Y10T428/24917
摘要： An object of the present invention is to provide a laminate for forming a capacitor layer for a printed wiring board which is capable of ensuring a higher capacitance and an inner layer core material using the laminate for example. In order to achieve this object, a material for forming a capacitor layer comprising a three-layered structure of an aluminum layer 2/a modified alumina barrier layer 3/an electrode copper layer 4 is used, such as a laminate 1a for forming a capacitor layer in which the above described modified alumina barrier layer 3 is obtained through subjecting one side of an aluminum plate or aluminum foil to an anodic treatment to form an alumina barrier layer as a uniform oxide layer and then subjecting the alumina material with the above described alumina barrier layer formed thereon to a boiling and modifying treatment in water and the above described modified aluminum barrier layer 3 is used as a dielectric layer.

2. 发明授权

US06475638B1 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof 失效
标题翻译：其表面电沉积铜箔，其制备方法及其用途
公开(公告)号：US06475638B1
公开(公告)日：2002-11-05
申请号：US09654769
申请日：2000-09-05
申请人： Masakazu Mitsuhashi , Yasuaki Mashiko , Hitoshi Kurabe
发明人： Masakazu Mitsuhashi , Yasuaki Mashiko , Hitoshi Kurabe
IPC分类号： B32B1508
CPC分类号： C25D1/04 , C25D5/48 , H05K3/382 , Y10T428/12431 , Y10T428/12438 , Y10T428/12472 , Y10T428/12569 , Y10T428/1291 , Y10T428/12993
摘要： A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 &mgr;m to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 &mgr;m; and subjecting the matte side having undergone the mechanical polishing to a selective chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 &mgr;m. The invention further provides an electrodeposited copper foil with its surface prepared, produced by the above process, and still further provides PWBs and a multilayer laminate of PWBs, produced with the use of the above electrodeposited copper foil with its surface prepared. The mechanical polishing followed by chemical polishing of the matte side enables obtaining an electrodeposited copper foil with its surface prepared, the matte side of which exhibits excellent properties, and hence enables obtaining PWBs and a multilayer PWBs which have excellent properties.
摘要翻译：一种制备其表面的电沉积铜箔的方法，包括以下步骤：将平均表面粗糙度（Rz）在2.5至10μm的范围内的平均表面粗糙度（Rz）的光致侧面和无光泽面的电解铜箔至少一次机械抛光使得无光面的平均表面粗糙度（Rz）在1.5-3.0μm的范围内; 并对经过机械抛光的磨砂面进行选择性化学抛光，使得无光面的平均表面粗糙度（Rz）在0.8〜2.5μm的范围内。本发明还提供了通过上述方法制备的其表面的电沉积铜箔，并且还进一步提供PWB和PWB的多层层压体，其使用其上制备的上述电沉积铜箔制备。机械抛光后，通过无光泽化学抛光，可以得到其表面准备的电沉积铜箔，其哑光面具有优异的性能，因此能够获得具有优异性能的PWB和多层PWB。

3. 发明申请

US20060262481A1 Film carrier tape with capacitor circuit and method for manufacturing the same, and surface-mounted film carrier tape with capacitor circuit and method for manufacturing the same 审中-公开
标题翻译：具有电容器电路的胶片载带及其制造方法，以及具有电容器电路的表面安装膜载带及其制造方法
公开(公告)号：US20060262481A1
公开(公告)日：2006-11-23
申请号：US11436697
申请日：2006-05-18
申请人： Yasuaki Mashiko
发明人： Yasuaki Mashiko
IPC分类号： H01G4/228 , H01G4/10 , H01G4/06
CPC分类号： H05K1/162 , H01G4/228 , H01G4/33 , H01L27/016 , H05K1/0393 , H05K3/243 , H05K3/3457 , H05K3/4007 , H05K2201/0367 , H05K2201/0394 , H05K2201/09472 , H05K2201/09763 , H05K2201/10681
摘要： The present invention provides a manufacturing method capable of mass production of a thin film decoupling capacitor provided with a capacitor circuit on the surface of a film tape carrier form of a polyimide resin or the like. For the purpose of achieving the above described object, there is provided a film carrier tape with a capacitor circuit, including a wiring pattern on the surface of a resin film including a plurality of sprocket holes on each of the two edges, wherein the resin film includes solder ball land holes and the wiring pattern includes a capacitor circuit having a structure in which a dielectric layer is disposed between an upper electrode and a lower electrode. As the method for manufacturing the aforementioned film carrier tape, there is provided such a method for semicontinuously manufacturing the film carrier tape concerned in the state of tape as applied to manufacturing conventional TAB products.
摘要翻译：本发明提供一种能够大量生产在聚酰亚胺树脂等的薄膜带载体的表面上设置有电容器电路的薄膜去耦电容器的制造方法。为了实现上述目的，提供了一种具有电容器电路的薄膜载带，其包括在包括两个边缘中的每一个上的多个链轮孔的树脂膜的表面上的布线图案，其中树脂膜包括焊球接地孔，并且布线图案包括电容器电路，其电介质层设置在上电极和下电极之间。作为制造上述薄膜载带的方法，提供了一种在制造传统的TAB产品时，以带状状半连续制造薄膜载带的方法。

4. 发明申请

US20080130196A1 Capacitor Layer Forming Material and Printed Wiring Board Having Embedded Capacitor Layer Obtained by using the Capacitor Layer Forming Material 审中-公开
标题翻译：具有通过使用电容层形成材料获得的嵌入式电容层的电容器层形成材料和印刷线路板
公开(公告)号：US20080130196A1
公开(公告)日：2008-06-05
申请号：US11744250
申请日：2007-05-04
申请人： Akihiro Kanno , Naohiko Abe , Akiko Sugioka , Yasuaki Mashiko
发明人： Akihiro Kanno , Naohiko Abe , Akiko Sugioka , Yasuaki Mashiko
IPC分类号： H01G4/008 , B32B15/04
CPC分类号： H01G4/228 , H01G4/008 , H01G4/12 , H05K1/09 , H05K1/162 , H05K3/4641 , H05K2201/0355 , H05K2201/09309 , H05K2201/09509 , Y10T428/26 , Y10T428/31678
摘要： It is an object of the present invention to provide a capacitor layer forming material which is applicable to printed wiring boards manufactured through a high-temperature processing of 300° C. to 400° C. of a fluorine-contained resin substrate, a liquid crystal polymer and the like, and exhibits no deterioration of the strength after a high-temperature heating. In order to achieve the object, a capacitor layer forming material for a printed wiring board which comprises a first conductive layer used for forming a top electrode, a second conductive layer used for forming a bottom electrode and a dielectric layer between the first and second conductive layers, characterized in that for the second conductive layer, a nickel layer or a nickel alloy layer is employed. The nickel layer or the nickel alloy layer as the second conductive layer preferably has a thickness of 10 micron meter to 100 micron meter. Further, the sol-gel method is suitably employed to form the dielectric layer on the nickel layer or the nickel alloy layer constituting the second conductive layer.
摘要翻译：本发明的目的是提供一种电容器层形成材料，其适用于通过含氟树脂基板的300℃至400℃的高温加工制造的印刷线路板，液晶聚合物等，并且在高温加热后表现出强度的劣化。为了实现该目的，用于印刷电路板的电容器层形成材料包括用于形成顶部电极的第一导电层，用于形成底部电极的第二导电层和介于第一和第二导电层之间的介电层层，其特征在于，对于第二导电层，采用镍层或镍合金层。作为第二导电层的镍层或镍合金层优选具有10微米至100微米的厚度。此外，溶胶 - 凝胶法适合用于在构成第二导电层的镍层或镍合金层上形成电介质层。

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